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IPC-7351 & 7251 Padstack Naming Convention

IPC-7351 & 7251 Padstack Naming Convention

ohm.bu.edu

IPC-7251 & 7351 Padstack Naming Convention INTRODUCTION The padstack consists of combinations of letters and numbers that represent shape, or dimensions of

  Padstack naming convention, Padstack, Naming, Convention

Via In Pad - Conductive Fill or Non-Conductive Fill

Via In Pad - Conductive Fill or Non-Conductive Fill

www.4pcb.com

of the padstack structures move either with or against the adjacent board laminate material, which can lead to stress fractures and possible electrical opens in the very worst cases. This consideration naturally favors the non-conductive epoxies as their CTE is a better match with the laminate therefore making a more reliable overall structure.

  Padstack

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