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Chapter 11 PVD and Metallization - ntut.edu.tw

Chapter 11 PVD and Metallization - ntut.edu.tw

www.me.ntut.edu.tw

17 2006/5/23 33 Titanium Nitride PVD •Reactive sputtering process •Ar and N 2 •N 2 molecules dissociate in plasma •Free nitrogen radicals react with Ti to form a thin layer of TiN on target surface.

  Surfaces, Chapter, Chapter 11 pvd and metallization, Metallization, Nitride

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