Search results with tag "New challenge for interconnection technology"

Gold wire bonding on Low-k Material A new …

SEMICON® Singapore 2004 © SEMI 2004 Pg 1 Gold wire bonding on Low-k Material A new challenge for interconnection technology Ralph Binner Andreas Schopper ESEC (Asia Pacific) Pte Ltd

  Challenges, Technology, Interconnection, New challenge for interconnection technology