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multimedia.3m.com3M™ Wafer Support System Temporary wafer bonding for advanced IC packaging High yields High throughput Cost effective Effectively handles wafers thinned to 20 µm Production
Wafer Bonding will be a Key Enabling Technology for ...
www.yole.frFor Immediate Release : May 19, 2011 1 “Wafer Bonding will be a Key Enabling Technology for Advanced Semiconductor Manufacturing ” Permanent wafer bonding report Lyon, France – May 19, 2011 – Yole Développement announces the publication of its technology study and market research report, Permanent wafer bonding report.Historically developed for MEMS &