Search results with tag "Design and process guidelines for use"

Design and Process Guidelines for Use of Ceramic Chip ...

– Smaller capacitors – Choose a dielectric material with a higher fracture toughness – Reduce bond pad width – Replace with tantalum capacitors – Improve insertion and bolt tolerances – Avoid placing MLCC's near board edges and holes _____

  Guidelines, Design, Process, Capacitors, Design and process guidelines for use, Tantalum, Tantalum capacitors