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Search results with tag "Ic integration technology"
3D IC INTEGRATION TECHNOLOGY …
www.circuitinsight.comefforts in 3D IC integration technology development by the ... semiconductor and back-end packaging assembly industry; how the industry’s growth had been planned and cultivated to arrive at the present condition. Having established such ... 3D IC INTEGRATION TECHNOLOGY DEVELOPMENT IN CHINA ...
Status and Outlooks of Flip Chip Technology
www.circuitinsight.combetween the grandma die and package substrate. Figure 2(b) shows Samsung’s 3D IC integration technology for the DDR4 (double data rate type 4) DRAM (dynamic random access memory) of their 128GB RDIMM (registered dual inline memory module). It can be seen that the DRAMs are bonded (stacked) with microbumps and NCF (non-conductive film).