Search results with tag "Electronic packaging technologies"

Electronic Packaging Technologies - Carleton University

Chip Scale Packages (CSP) • Chip Scale Package, or CSP, based on IPC/JEDEC J-STD-012 definition, is a single-die, direct surface mountable package with an area of no more than 1.2 times the original die area Electronic Packaging Technologies 12 CSP Benefits and Drawbacks • CSP is not a new mounting technology, is an evolution of SMD

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