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Minapad BGA package design and solder joints …

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Minapad 2014, May 21 – 22th, Grenoble; France BGA package design and solder joints board level reliability Luc PETIT and Daniel YAP STMicroelectronics

Design, Reliability, Board, Joint, Packages, Solder, Package design and solder joints, Package design and solder joints board

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Package design and solder joints, Package design and solder joints board, Reliability