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Search results with tag "Thermal interface"
Mechanical and Thermal Design Guidelines for Lidless Flip ...
www.xilinx.comthermal conductivity as traditional flip-chip packaging. However, removing the lid (heat spreader) and adding thermal interface material allows direct contact between the external heat sink and the die. Lidless packages reduce the thermal resistance, improve the thermal
放熱用シリコーン Thermal Interface Materials
www.shinetsusilicone-global.com放熱用シリコーン Thermal Interface Materials フェイズチェンジマテリアル Thermal Interface Phase Change Materials 高硬度放熱シリコーン ...