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Search results with tag "Nanostar"
NanoStar & NanoFree 300 m Solder Bump Wafer Chip-Scale ...
www.ti.comSBVA017 NanoStar & NanoFree 300 m Solder Bump Wafer Chip-Scale Package Application 5 2 Physical Description 2.1 Package Characteristics The NanoStar package family is a Die Size BGA as identified by the JEDEC standards organiza-
Nostrana Nightly Dinner
menus.nostrana.comNostrana dinner tonight. Saturday, 05 march ANTIPASTI Focaccia & ciabatta Nostrana 5 Arbequina olive oil Sweet pepper arancini15 fried mozzarella - stuffed risotto balls Roasted squash soup 10 Marina di Chioggia squash, brodo crème fraîche, chive Grilled blue prawns17 aïoli, Visser Farm red endive sunchoke chips †