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TI's journey to high-volume copper wire bonding production

TI's journey to high-volume copper wire bonding production

www.ti.com

TI’s journey to high-volume copper wire bonding production 5 October 2014 where copper wires are bonded to thick copper nickel palladium plated pads on the chip, require stable

  Wire, Copper, Bonding, Palladium, Nickel, Pads, Copper wire bonding, Copper nickel palladium

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