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3D 플라스틱 사출성형해석의 선구자 - moldex3d.com
www.moldex3d.comeDesign Basic eDesign Professional Advanced IC Packaging 6 Designer* Mesh* Flow* Pack* Cool* Warp* Multi-Component Molding* Project* Parallel Processing*
Production Proven
multimedia.3m.com3M™ Wafer Support System Temporary wafer bonding for advanced IC packaging High yields High throughput Cost effective Effectively handles wafers thinned to 20 µm ...