Search results with tag "Flip chip package qualification of rf"

Flip Chip Package Qualification of RF-IC Packages

Flip Chip Package Qualification of RF-IC Packages Mumtaz Y. Bora . Peregrine Semiconductor . San Diego, Ca. 92121 . mbora@psemi.com . Abstract. Quad Flat Pack No Leads (QFNs) are thermally enhanced plastic packages that use conventional copper leadframe with wire

  Qualification, Packages, Flip, Chip, Flip chip package qualification of rf