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Part II How to Design and Build Working Electronic Circuits
www-mdp.eng.cam.ac.ukElectronic packaging is the physical container of an electronic component. The function of a package is to provide a robust mechanical structure for making electrical ... typically are dual-inline packages (DIPs), which contains two rolls of pins as shown in Figure ###. The separation between pins in …
Electronic Packaging Technologies - Carleton University
www.doe.carleton.camapping method to pick up only good die. For most processes, die attach materials like gold or lead-tin based solder wires or silver epoxy paste potting on the frame are required prior to die bonding process. ... Package Substrate • The die attachment compound should provide