2021 IRDS More than Moore

1 INTERNATIONAL ROADMAP FOR DEVICES AND SYSTEMS 2021 UPDATE MORE THAN Moore WHITE PAPER THE IRDS IS DEVISED AND INTENDED FOR TECHNOLOGY ASSESSMENT ONLY AND IS WITHOUT REGARD TO ANY COMMERCIAL CONSIDERATIONS PERTAINING TO INDIVIDUAL PRODUCTS OR EQUIPMENT. ii THE INTERNATIONAL ROADMAP FOR DEVICES AND SYSTEMS: 2021 COPYRIGHT 2021 IEEE. ALL RIGHTS RESERVED. 2021 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. Bluetooth SIG and its members, licensors, and suppliers own all right, title, and interest (including intellectual property rights) in the Services, Content, and all draft and adopted specifications for the Bluetooth standard and reserve all rights not expressly granted to you in these Terms or, if applicable, the SIG Member Terms.

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3 Iii THE INTERNATIONAL ROADMAP FOR DEVICES AND SYSTEMS: 2021 COPYRIGHT 2021 IEEE. ALL RIGHTS RESERVED. Table of Contents Acknowledgments .. v 1. Introduction .. 1 History .. 1 Definition of More than Moore .. 2 2. Smart Sensors .. 3 Introduction .. 3 Scope .. 4 Stakeholders .. 4 Technology Status, Requirements and Potential Solutions .. 4 Recommendations .. 12 Summary .. 12 3. Smart Energy .. 12 Introduction .. 12 Scope .. 13 Technology Status, Requirements and Potential Solutions .. 13 Recommendations .. 20 Summary .. 22 4. Energy Harvesting .. 22 Introduction .. 22 Scope .. 23 Stakeholders .. 24 Technology Status, Requirements and Potential Solutions .. 25 Recommendations .. 34 Summary .. 34 5. Wearable, Flexible and Printed Electronics .. 35 Introduction .. 35 Scope .. 35 Stakeholders .. 36 Technology Status, Requirements and Potential Solutions.

4 37 Recommendations .. 38 Summary .. 39 6. Glossary/Abbreviations .. 40 iv THE INTERNATIONAL ROADMAP FOR DEVICES AND SYSTEMS: 2021 COPYRIGHT 2021 IEEE. ALL RIGHTS RESERVED. List of Figures Figure MtM-1 Moore s Law and more .. 2 Figure MtM-2 Predicted global population growth.. 6 Figure MtM-3 Advanced nanosensor modified with nano-copper designed for monitoring of agricultural nitrate run off .. 7 Figure MtM-4 Breakdown of medical devices by application and genera .. 8 Figure MtM-5 A. Sketch of the filtering structure in a pinned photo diode. B. Schematic of the PNA-miRNA sandwich array used to detect the target miRNAs.. 10 Figure MtM-6 Survey of energy harvesting technologies .. 23 Figure MtM-7 Basic structures of the energy harvesting concepts covered so far in the IRDS Roadmap.. 25 Figure MtM-8 Multiscale thermal design for thermoelectrics.

5 27 List of Tables Table MtM-1 Smart Sensors Difficult Challenges .. 11 Table MtM-2 Smart Energy Difficult Challenges .. 18 Table MtM-3 Energy Harvesting Difficult Challenges .. 29 Table MtM-4 Wearable, Flexible and Printed Electronics Difficult Challenges .. 37 v THE INTERNATIONAL ROADMAP FOR DEVICES AND SYSTEMS: 2021 COPYRIGHT 2021 IEEE. ALL RIGHTS RESERVED. ACKNOWLEDGMENTS Mart Graef, TU Delft (editor) Smart Sensors Alan O'Riordan, Tyndall (team leader) Danilo De Marchi, IUNET Walter De Raedt, Imec Ho l Gu rin, XSensio Irina Ionica, GINP Fernanda Irrera, IUNET Ivona Mitrovic, University of Liverpool St phane Monfray, ST Mireille Mouis, GINP Conor O'Mahony, Tyndall Pierpaolo Palestri, IUNET Fabrizio Palma, IUNET Cosmin Roman, ETHZ Frans Widdershoven, NXP Smart Energy Gaudenzio Meneghesso, IUNET - UniPD (team leader) Bauer Anton, IISBF raunhofer Joff Derluyn, EPIGAN Thomas Harder , ECPE Ray Hueting , University of Twente Tetsu Kachi, Nagoya Univ.

6 Atsuhiro Kinoshita, Mitsubishi UFJ Martin Kuball, Peter Moens, ONSemi Seamus O'Driscoll, Tyndall Tatsuya Ohguro, Toshiba Mikael Ostling, KTH Fabrizio Roccaforte, CNR Thomas Detzel, Infineon AT Ken Uchida, Univ. of Tokyo William Vandendaele, CEA-LETI Joachim W rfl, FBH Energy Harvesting Gustavo Ardila, Grenoble Alpes University/ Grenoble INP (team leader) Aldo Romani, IUNET (team co-leader) Hiro Akinaga, National Institute of Advanced Industrial Science and Technology (AIST) Alessandro Bertacchini, IUNET Alessandra Costanzo, IUNET Mike Hayes, Tyndall Anne Kaminski, Grenoble INP Androula Nassiopoulou, NCSR Demokritos Yoshiyuki Nonogushi, Kyoto Institute of Technology Kafil M Razeeb, Tyndall James Rohan, Tyndall Luca Roselli, IUNET Stefano Saggini, IUNET Hiroshi Toshiyoshi, University of Tokyo Eric Yeatman, Imperial College London Flexible/Wearable Electronics Benjamin I iguez, URV (team leader)

7 Alessandra Costanzo, IUNET Danilo DeMarchi, IUNET Thanasis Dimoulas, NCSR Demokritos David Esseni, IUNET Paul Galvin Tyndall Ho l Gu rin, XSensio Monica Lira, ICN2 Brendan O'Flynn, Tyndall Luca Roselli, IUNET Tsuyoshi Sekitani, Osaka University Introduction 1 THE INTERNATIONAL ROADMAP FOR DEVICES AND SYSTEMS: 2021 COPYRIGHT 2021 IEEE. ALL RIGHTS RESERVED. MORE THAN Moore 1. INTRODUCTION Since its inception in 1998, the objective of the International Technology Roadmap for Semiconductors (ITRS) has been to identify the technical challenges that had to be addressed in order to ensure that microelectronics would be able to remain a driver for innovation in a wide range of applications. This has resulted in an industrial/academic agenda for pre-competitive research, which is continuously being updated to take into account new trends. Over the years, the scope of the ITRS was enlarged to include not only the CMOS-based digital domain for memory and microprocessor devices (driven by miniaturization, as described by Moore s Law), but also heterogeneous integration of multi-functional analog and mixed-signal technologies for smart system applications (More than Moore ).

8 At the same time, the perspective of the roadmap shifted from being mostly technology driven to being increasingly determined by application requirements. In line with this, the ITRS changed into the International Roadmap for Devices and Systems (IRDS ). The roadmapping effort has given rise to new insights in innovation methodology and strategy. This is in particular the case for More than Moore , which requires a highly multidisciplinary R&D environment. It has become clear that progress in highly complex technology fields can only be achieved by cooperation along the complete innovation chain, which implies that multiple fields of expertise can be combined for the development of generic technology modules, which can be made available on open technology platforms. This trend is clearly demonstrated in the present developments in, , the automotive industry and the medical domain.

9 The objective of the present More than Moore white paper is to provide an overview of a number of technology/application areas that are representative for the More than Moore domain in the sense that they require multifunctional heterogeneous system solutions, rather than miniaturization of devices only. These are: Smart sensors, Smart energy, Energy harvesting and Wearable and flexible electronics. The content of this chapter has been generated by the IRDS International Focus Team (IFT) on More than Moore , as listed in the acknowledgments section. Extensive use has been made of the NEREID NanoElectronics Roadmap for HISTORY The concept of More than Moore was introduced in the 2005 edition of the It followed from the observation that many functional requirements, such as power consumption, wireless communication, passive components, sensing and actuating, and biological functions did not scale with Moore s Law, as these would require non-CMOS-based technologies.

10 It was anticipated that the integration of CMOS-based system on chip (SOC) and non-CMOS based system in package (SiP) technologies within a single package would become increasingly important. It was realized that More Moore and More than Moore were not to be viewed as alternative technologies in competition with each other, but rather as complementary technology options that could be combined to create new high value systems. This was depicted in a diagram (Figure MtM-1) that has served as a conversation piece ever since. A particular challenge that More than Moore posed to the roadmapping process was to be driven by application needs, rather than technology requirements. Consequently, a methodology had to be developed to guide the roadmapping effort 1 NEREID NanoElectronics Roadmap for Europe (2018), 2 International Technology Roadmap for Semiconductors 2005 Edition, Semiconductor Industry Association, Executive Summary.