3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI

1 W25Q16JV Publication Release Date: March 22, 2018, 2018 Revision G 3V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI W25Q16JV - 1 - Table of Contents 1. GENERAL DESCRIPTIONS .. 4 2. FEATURES .. 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS .. 5 Pin Configuration SOIC 150/208-mil .. 5 Pad Configuration WSON 6x5-mm & USON 2x3-mm/4x3-mm, XSON 4x4-mm .. 5 Pin Description SOIC 150/208-mil, WSON 6x5-mm, USON 2x3-mm/4x3-mm, XSON 4x4-mm 5 Ball Configuration WLCSP .. 6 Ball Description WLCSP .. 6 4. PIN DESCRIPTIONS .. 7 Chip Select (/CS) .. 7 SERIAL Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .. 7 Write Protect (/WP) .. 7 HOLD (/HOLD) .. 7 SERIAL Clock (CLK) .. 7 Reset (/RESET)(1) .. 7 5. BLOCK DIAGRAM .. 8 6. FUNCTIONAL DESCRIPTIONS .. 9 Standard SPI Instructions .. 9 Dual SPI Instructions .. 9 Quad SPI 9 Software Reset & Hardware /RESET pin.

2 9 Write Protection .. 10 Write Protect 10 7. STATUS AND CONFIGURATION REGISTERS .. 11 Status Registers .. 11 Erase/Write In Progress (BUSY) Status Only .. 11 Write Enable Latch (WEL) Status Only .. 11 Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable .. 11 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable .. 12 Sector/Block Protect Bit (SEC) Volatile/Non-Volatile Writable .. 12 Complement Protect (CMP) Volatile/Non-Volatile Writable .. 12 Status Register Protect SRP, SRL) Volatile/Non-Volatile Writable .. 13 Erase/Program Suspend Status (SUS) Status Only .. 14 Security Register Lock Bits (LB3, LB2, LB1) Non-Volatile OTP Writable .. 14 8. QUAD ENABLE (QE) VOLATILE/NON-VOLATILE WRITABLE .. 14 Write Protect Selection (WPS) Volatile/Non-Volatile Writable .. 15 Output Driver Strength (DRV1, DRV0) Volatile/Non-Volatile Writable .. 15 Reserved Bits Non Functional .. 15 W25Q16JV Status Register MEMORY Protection (WPS = 0, CMP = 0).

3 16 W25Q16JV Status Register MEMORY Protection (WPS = 0, CMP = 1) .. 17 W25Q16JV Publication Release Date: March 22, 2018, 2018 - 2 - Revision G W25Q16JV Individual Block MEMORY Protection (WPS=1) .. 18 9. INSTRUCTIONS .. 19 Device ID and Instruction Set Tables .. 19 Manufacturer and Device Identification .. 19 Instruction Set Table 1 (Standard SPI Instructions) (1) .. 20 Instruction Set Table 2 ( DUAL/QUAD SPI Instructions)(1) .. 21 Notes: .. 21 Instruction Descriptions .. 22 Write Enable (06h) .. 22 Write Enable for Volatile Status Register (50h) .. 22 Write Disable (04h) .. 23 Read Status Register-1 (05h), Status Register-2 (35h) & Status Register-3 (15h) .. 23 Write Status Register-1 (01h), Status Register-2 (31h) & Status Register-3 (11h) .. 24 Read Data (03h) .. 26 Fast Read (0Bh) .. 27 Fast Read Dual Output (3Bh) .. 28 Fast Read Quad Output (6Bh) .. 29 Fast Read Dual I/O (BBh).

4 30 Fast Read Quad I/O (EBh) .. 31 Set Burst with Wrap (77h) .. 32 Page Program (02h) .. 33 Quad Input Page Program (32h) .. 34 Sector Erase (20h) .. 35 32KB Block Erase (52h) .. 36 64KB Block Erase (D8h) .. 37 Chip Erase (C7h / 60h) .. 38 Erase / Program Suspend (75h) .. 39 Erase / Program Resume (7Ah) .. 40 Power-down (B9h) .. 41 Release Power-down / Device ID (ABh) .. 42 Read Manufacturer / Device ID (90h) .. 43 Read Manufacturer / Device ID Dual I/O (92h) .. 44 Read Manufacturer / Device ID Quad I/O (94h) .. 45 Read Unique ID Number (4Bh) .. 46 Read JEDEC ID (9Fh) .. 47 Read SFDP Register (5Ah) .. 48 Erase Security Registers (44h) .. 49 Program Security Registers (42h) .. 50 Read Security Registers (48h) .. 51 Individual Block/Sector Lock (36h) .. 52 Individual Block/Sector Unlock (39h) .. 53 Read Block/Sector Lock (3Dh) .. 54 Global Block/Sector Lock (7Eh) .. 55 Global Block/Sector Unlock (98h) .. 55 Enable Reset (66h) and Reset Device (99h).

5 56 W25Q16JV - 3 - 10. ELECTRICAL 57 Absolute Maximum Ratings (1) .. 57 Operating Ranges .. 57 Power-Up Power-Down Timing and Requirements .. 58 DC Electrical Characteristics- .. 59 AC Measurement Conditions .. 60 AC Electrical Characteristics(6) .. 61 SERIAL Output Timing .. 63 SERIAL Input Timing .. 63 /WP Timing .. 63 11. PACKAGE SPECIFICATIONS .. 64 8-Pin SOIC 150-mil (Package Code SN) 20131227 .. 64 8-Pin SOIC 208-mil (Package Code SS) .. 65 8-Pad USON ^ (Package Code UX) .. 66 8-Pad WSON 6x5-mm (Package Code ZP) .. 67 8-Pad USON 4x3-mm (Package Code UU) .. 68 8-Pad XSON (Package Code XG) .. 69 8-Ball WLCSP (Package Code BY) .. 70 12. ORDERING INFORMATION .. 71 Valid Part Numbers and Top Side Marking .. 72 13. REVISION HISTORY .. 74 W25Q16JV Publication Release Date: March 22, 2018, 2018 - 4 - Revision G 1. GENERAL DESCRIPTIONS The W25Q16JV ( 16M-BIT ) SERIAL FLASH MEMORY provides a storage solution for systems with limited space, pins and power.

6 The 25Q series offers flexibility and performance well beyond ordinary SERIAL FLASH devices. They are ideal for code shadowing to RAM, executing code directly from DUAL/QUAD SPI (XIP) and storing voice, text and data. The device operates on a single to power supply with current consumption as low as 1 A for power-down. The W25Q16JV array is organized into 8,192 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q16JV has 512 erasable sectors and 32 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See figure 2.) The W25Q16JV supports the standard SERIAL Peripheral Interface (SPI), and a high performance DUAL/QUAD output as well as DUAL/QUAD I/O SPI: SERIAL Clock, Chip Select, SERIAL Data I/O0 (DI), I/O1 (DO), I/O2, and I/O3.

7 SPI clock frequencies of up to 133 MHz are supported allowing equivalent clock rates of 266 MHz (133 MHz x 2) for Dual I/O and 532 MHz (133 MHz x 4) for Quad I/O when using the Fast Read DUAL/QUAD I/O instructions. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel FLASH memories. Additionally, the device supports JEDEC standard manufacturer and device ID and SFDP Register, a 64-bit Unique SERIAL Number and three 256-bytes Security Registers. 2. FEATURES New Family of SpiFlash Memories W25Q16JV: 16M-BIT / 2M-byte (2,097,152) Standard SPI: CLK, /CS, DI, DO Dual SPI: CLK, /CS, IO0, IO1 Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 Software & Hardware Reset(1) Highest Performance SERIAL FLASH 133 MHz Single, DUAL/QUAD SPI clocks 266/532 MHz equivalent DUAL/QUAD SPI 66MB/S continuous data transfer rate Min.

8 100K Program-Erase cycles per sector More than 20-year data retention Efficient Continuous Read Continuous Read with 8/16/32/64-Byte Wrap As few as 8 clocks to address MEMORY Allows true XIP (execute in place) operation Outperforms X16 Parallel FLASH Low Power, Wide Temperature Range Single to supply -40 C to +85 C operating range -40 C to +105 C operating range <1 A Power-down (typ.) Flexible Architecture with 4KB sectors Uniform Sector/Block Erase (4K/32K/64K-Byte) Program 1 to 256 byte per programmable page Erase/Program Suspend & Resume Advanced Security Features Software and Hardware Write-Protect Power Supply Lock-Down and Special OTP protection(2) Top/Bottom, Complement array protection Individual Block/Sector array protection 64-Bit Unique ID for each device Discoverable Parameters (SFDP) Register 3X256-Bytes Security Registers with OTP locks Volatile & Non-volatile Status Register Bits Space Efficient Packaging 8-pin SOIC 150-mil / 208-mil 8-pad USON 2X3mm/4x3-mm 8-pad XSON 4x4-mm 8-pad WSON 6x5-mm 8-ball WLCSP Contact Winbond for KGD and other options Note: 1.

9 Hardware /RESET pin is only available on SOIC-16 & TFBGA packages 2. Please contact Winbond for details. W25Q16JV - 5 - 3. PACKAGE TYPES AND PIN CONFIGURATIONS Pin Configuration SOIC 150/208-mil Figure 1a. Pin Assignments, 8-pin SOIC150-mil/208-mil (Package Code SN, SS) Pad Configuration WSON 6x5-mm & USON 2x3-mm/4x3-mm, XSON 4x4-mm Figure 1b. Pad Assignments, 8-pad WSON 6x5-mm, USON 2X3-mm/4x3-mm, XSON 4x4-mm (Package Code ZP, UX, UU, XG) Pin Description SOIC 150/208-mil, WSON 6x5-mm, USON 2x3-mm/4x3-mm, XSON 4x4-mm PIN NO. PIN NAME I/O FUNCTION 1 /CS I Chip Select Input 2 DO (IO1) I/O Data Output (Data Input Output 1)(1) 3 /WP (IO2) I/O Write Protect Input ( Data Input Output 2)(2) 4 GND Ground 5 DI (IO0) I/O Data Input (Data Input Output 0)(1) 6 CLK I SERIAL Clock Input 7 /HOLD or /RESET (IO3) I/O Hold or Reset Input (Data Input Output 3)(2) 8 VCC Power Supply Notes: 1. IO0 and IO1 are used for Standard and Dual SPI instructions 2.

10 IO0 IO3 are used for Quad SPI instructions, /HOLD (or /RESET) function is only available for Standard/Dual SPI. 12348765/CSDO (IO1)/WP (IO2)GNDVCC/HOLD or /RESET(IO3)DI (IO0)CLKTop View 1234/CSDO (IO1)/WP (IO2)GNDVCC/HOLD or /RESET(IO3)DI (IO0)CLKTop View 8765W25Q16JV Publication Release Date: March 22, 2018, 2018 - 6 - Revision G Ball Configuration WLCSP GND/CSVCCTop ViewGNDVCCCLKB ottom ViewA1B1C1D1A2B2C2D2/HOLD (IO3)CLK/WP (IO2)DI(IO0)DO(IO1)DO(IO1)B2B1A2A1C2C1D2 /CSDI(IO0)D1/HOLD (IO3)/WP (IO2) Figure 1c. W25Q16JV Ball Assignments, 8-ball WLCSP (Package Code BY) Ball Description WLCSP BALL NO. PIN NAME I/O FUNCTION A1 VCC Power Supply A2 /CS I Chip Select Input B1 /HOLD or /RESET (IO3) I/O Hold or Reset Input (Data Input Output 3)(2) B2 DO (IO1) I/O Data Output (Data Input Output 1)*1 C1 CLK I SERIAL Clock Input C2 /WP (IO2) I/O Write Protect Input ( Data Input Output 2)(2) D1 DI (IO0) I/O Data Input (Data Input Output 0)*1 D2 GND Ground Notes: 1.