85NT & 55NT 55RT - CADX Services

1 Applications:MCM-LCSPFINE PITCH SMTDIRECT CHIP ATTACHPCMCIALCCCBGATSOP BGAMICROVIAF eatures:LightweightEconomical CTE ControlHigh Interconnect DensitySmooth SurfaceLow Dielectric ConstantLaser/Plasma AblatableImproved and RepeatableStandard PWB FabricationDimensional StabilityDrills Similarly to FR-4 Low Melt Viscosity forReduced Drill WanderEase of LaminationThin DielectricsElectronic Substrates85NT &55 NTMATERIALS FOR ELECTRONICS THERMOUNT Laminate & Prepreg For Printed Wiring Boards55 RTTHERMOUNT RT Laminate & Prepreg For HDI Printed Wiring BoardsArlon is a Licensed Laminator of THERMOUNT and THERMOUNT RT THERMOUNT is a registered

2 Trademark of the DuPont CompanyTHERMOUNT RT is a trademark of the DuPont CompanyNon-MDA Polyimideon THERMOUNT ReinforcementArlon 85nt is a unique combination of Non-MDA Pure Polyimide resin coated on DuPont Type E-200 Series non-woven aramid reinforcement. The resin system has a Tg of 250oC. The combination of the resinsystem and the non-woven reinforcement develops a Tg more in the range of 235-245oC with conventionalpolyimide cure cycles. This material is designed for performance reliability in large scale packagingapplications where conventional woven glass substrates are prone to solder joint cracking under thermaland power cycling due to CTE mismatch between the mounted devices (such as LCCC and other high I/Ocount devices) and the conventional woven glass composites as well as for lower Z-axis CTE for thickerMLB s.

3 85nt is commonly used to replace boards containing Copper-Invar-Copper in traditional CTEmatched Epoxyon THERMOUNT ReinforcementArlon 55nt is a unique combination of multifunctional epoxy (Tg 180oC) on DuPont Type E-200 Seriesnon-woven aramid reinforcement with a resin content of 49%. This material is designed for performancereliability with various interconnect packages: BGA (ball grid array), TSOP (thin small outline package),FP-SMT (fine patch surface mount technology), where conventional substrates are more prone to solderjoint cracking under thermal and power cycling due to CTE mismatch of the mounted Epoxyon THERMOUNT RT ReinforcementArlon 55rt is a special combination of multifunctional epoxy (Tg 180oC) on DuPont Type N710 Seriesnon-woven aramid reinforcement with a resin content of 53%.

4 The material is designed for performancereliability in those applications which utilize laser or plasma formed microvia technology. This substrate isalso designed for packaging applications with various interconnect packages: BGA (ball grid array), TSOP(thin small outline package), FP-SMT (fine pitch surface mount technology) & CSP (chip scale package)where conventional substrates are more prone to solder joint cracking under thermal and power cycling dueto CTE mismatch of the mounted devices. Layer to layer circuit techniques can be combined withconventional FR4 (epoxy glass) cores utilizing High Density Interconnect Microvia FOR ELECTRONICS The dielectric constant of aramid reinforcedproducts is not only consistent across allconstructions and thicknesses, but also over awide frequency range.

5 This means predictableand stable performance for impedance controland etched circuit components for almost anydesign. Stable dielectric constants also meanthere will be no surprises as new designs comealong operating at different frequencies. Yourexpected design rules still dissipation factor of the products is alsostable over frequency providing the sametrustworthy design rules that are afforded by thedielectric control and predictability ofdimensional stability can be expected of thesematerials.

6 This chart shows a comparison ofaramid reinforced products on top vs. FR-4 on thebottom using the IPC methods with someadditional experimentation. On actual productionPWB s, we consistently measure about .0003inch/inch of shrinkage time after time. Slightlyless is observed with solid copper planes orlaminate cap layers. 55rt may have slightlymore movement due to it s higher resin contentbut all products are very predictable. Once thescale factors are tuned in, little variability aramid materials provide a lowin-plane CTE.

7 The copper content (% by volume)of the finished PWB will drive the expansionhigher. In order to keep the CTE as low aspossible, the percentage of total copper should bekept to a minimum. The chart at the left shows theeffect of copper content in typical PWB ConstantDissipation Factor85NT Dimensional StabilityMATERIALS FOR ELECTRONICS MATERIALS FOR ELECTRONICS Detailed process guidelines are available for 85nt , 55nt , 55 RTDrilling advantages: drill wear is reduced so tool life is dramatically increased. Time and cost savings canbe significant.

8 Hole quality remains consistent from the first hole through the last. Drill wander is alsoreduced due to the random fiber distribution eliminating high density bundle areas. This further enablessmaller holes, pads, and increased density of the Carbide ToolAfter 4000 hits on FR-4 After 4000 hits on non-wovenaramid laminateLaser ablation of vias is an excellent method forproducing vias of less than .010 inch. It is a cleanand very fast process of producing thousands of viaswithin minutes with no variation from hole to is held to within the tolerance of thephoto tools and etch tolerances of your currentprocess.

9 The copper foil acts as the laser mask byetching the copper where you want the holesformed. Some lasers (YAG) can also be used tosimultaneously form holes in the copper and thedielectric, automatically aligning to innerlayerregistration laser via formation methods allows blindand buried via structures to be easily implementedand formed with very small hole diameters. Thisallows for higher density circuit routing thanpreviously possible. Fewer layers are possible dueto smaller hole sizes and more available area forsignal Test Method Condition 85nt 55nt 55 RTTypical Properties: Non-Woven AramidReinforced LaminatesData based on dielectric thickness,exclusive of metal cladding except where indicated by test method.

10 Results listed above are typical properties; they are not to be usedas specification limits. The above information creates no expressed or implied warranties. The properties may vary depending on the of Thermal Expansion IPC-TM-650 25oC to 125oC(ppm/oC) Method axis 6 - 9 7 - 9 10 - 12Y axis 6 - 9 7 - 9 10 - 12Z axis