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Advanced Materials High Performance Components

Advanced MaterialsHigh Performance ComponentsNorth AmericaTable of ContentsIntroduction ..11 .0 Bisphenol-A Based Epoxy Resins ..2 Unmodified Liquid Epoxy Resins .. Modified Liquid Epoxy Resins ..2 Unmodified Solid Epoxy Resins ..3 Modified Solid Epoxy Resins .. Epoxy Resin Solutions ..5 62 .0 Bisphenol-F Based Epoxy Resins ..73 .0 Multifunctional Epoxy Resins ..8 Epoxy Phenol Novolacs (EPN) ..8 Epoxy Cresol Novolacs (ECN) .. Glycidyl Amines Based Epoxy Resins .. Miscellaneous Multifunctional Epoxy Resins ..114 .0 Brominated Epoxy Resins ..125 .0 Cycloaliphatic Epoxy Resins ..126 .0 Waterborne Epoxy Resins ..137 .0 Epoxy Reactive Diluents ..148 .0 Toughened/Flexibilized Resins ..159 .0 AroCy Cyanate Ester Resins ..1510.

Introduction Huntsman is a world-leading producer of thermoset resins for the structural composite, adhesive, electronic, coating and construction markets.

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Transcription of Advanced Materials High Performance Components

1 Advanced MaterialsHigh Performance ComponentsNorth AmericaTable of ContentsIntroduction ..11 .0 Bisphenol-A Based Epoxy Resins ..2 Unmodified Liquid Epoxy Resins .. Modified Liquid Epoxy Resins ..2 Unmodified Solid Epoxy Resins ..3 Modified Solid Epoxy Resins .. Epoxy Resin Solutions ..5 62 .0 Bisphenol-F Based Epoxy Resins ..73 .0 Multifunctional Epoxy Resins ..8 Epoxy Phenol Novolacs (EPN) ..8 Epoxy Cresol Novolacs (ECN) .. Glycidyl Amines Based Epoxy Resins .. Miscellaneous Multifunctional Epoxy Resins ..114 .0 Brominated Epoxy Resins ..125 .0 Cycloaliphatic Epoxy Resins ..126 .0 Waterborne Epoxy Resins ..137 .0 Epoxy Reactive Diluents ..148 .0 Toughened/Flexibilized Resins ..159 .0 AroCy Cyanate Ester Resins ..1510.

2 0 Polyimide Resins ..16 Kerimid Polyimide Resins .. Matrimid Polyimide Resins .. Rhodeftal Polyimide Resins ..1711 .0 Benzoxazine Thermoset Resins .. Benzoxazine Resins .. Benzoxazine Catalysts ..1812 .0 Epoxy Curing Agents ..19 Aliphatic Amine Based .. Cycloaliphatic Amine Based ..20 Amidoamine and Polyamide Based ..22 Phenalkamine and Mannich Based ..23 Aromatic Amine Based .. Anhydride .. Waterborne ..25 Waterborne Applications .. Miscellaneous ..2813 .0 Curing Accelerators ..29 Liquid Accelerators .. Solid Accelerators ..3014 .0 Matting Agents ..3115 .0 Miscellaneous Products ..31 FDA Status ..32 Product Index ..33 36iiIntroductionHuntsman is a world-leading producer of thermoset resins for the structural composite, adhesive, electronic, coating and construction markets.

3 The thermoset resin chemistries offered by Huntsman include epoxy resins, epoxy reactive diluents, curing agents and crosslinkers for epoxy resins, benzoxazines, cyanate esters, polyimides and bismaleimides. Typical service temperatures for these products can range from room temperature to as high as 350 Araldite and Tactix epoxy resins produced by Huntsman are supplied in a range of viscosities, functionalities and epoxy equivalent weight for a wide range of industrial applications. Araldite epoxy resins are typically based on bisphenol-A, bisphenol-F, tetrabromobisphenol-A, phenol novolacs, cresol novolacs, amino phenol, methylene dianiline and isocyanuric acid. Tactix epoxy resins are based on bisphenol-A, tri(hydroxyphenyl) methane and maximum achievable cured Tg and the temperature range required to achieve a viscosity of 1,000 cP are shown in the figures below for various types of curing agents are supplied in liquid or solid form and can be used in conjunction with all the epoxy resins to achieve a broad range of thermal, mechanical and electrical properties.

4 Aradur curing agents may be based on polyamides, aliphatic amines, cycloaliphatic amines, aromatic amines, anhydrides and figures below compare the Tg and the cure temperature of various types of Aradur curing agents when used with a bisphenol-A based liquid epoxy resin ( Araldite GY 6010 resin).AroCy cyanate ester resins can provide high glass transition temperature (Tg = 170 350 C), low water absorption and low dielectric properties. They are typically used in aerospace applications, high-speed circuit boards, electronic chip adhesives and encapsulants, and syntactic foams. AroCy cyanate ester resins are based on bisphenol-E, bisphenol-M or phenol and Matrimid resin systems provide outstanding heat Performance (Tg = 220 350 C), excellent mechanical properties at both ambient and elevated temperatures, and low coefficient of thermal expansion.

5 They are typically used for aerospace structures, high-speed circuit board substrates and high- Performance adhesives. Kerimid and Matrimid resins are based on polyimide and bismaleimide benzoxazine resins represent a new addition to the comprehensive Huntsman product offering for Advanced composites and high- Performance coating systems. Araldite benzoxazine resins can provide some unique combinations of thermal, mechanical and electrical properties. 1 Hardener Tg Overview with Araldite GY 6010 Hardener Curing Temperature OverviewResin Tg (Data)Temperature for 1,000 cp OverviewSection 1 Bisphenol-A Based Epoxy Resins1 .1 Unmodified Liquid Epoxy Resins2 Product Viscosity @ 25 C, [cP]Epoxide Eq . Weight [EEW, g/eq] Density @ 25 C [lb/gal, (g/cm3)]Color [Gardner] Comments/ApplicationsAraldite GY 260011,000 14,000184 ( ) 1 Unmodified bisphenol-A based liquid epoxy resin.

6 For use in automotive coatings or other applications requiring an epoxy resin with a low hydrolyzable chlorine GY 601011,000 14,000182 ( ) 1 Standard bisphenol-A based liquid epoxy GY 602016,000 20,000185 ( ) 1 High-viscosity bisphenol-A based liquid epoxy MY 790-14,000 5,500170 ( ) 1 Distilled bisphenol-A based liquid epoxy resin, with very low chloride LY 155611,000 13,000182 1 Liquid bisphenol-A epoxy resin for composite 1234,400 5,600172 ( ) 1 High-purity, low-viscosity bisphenol-A based liquid epoxy .2 Modified Liquid Epoxy ResinsProduct Viscosity @ 25 C, [cP]Epoxide Eq . Weight [EEW, g/eq] Density @ 25 C [lb/gal, (g/cm3)]Color [Gardner] Comments/ApplicationsAraldite GY 5022,100 3,600222 ( ) 3 Bisphenol-A liquid epoxy resin modified with dibutyl GY 506500 700175 ( ) 1 Bisphenol-A liquid epoxy resin modified with a monofunctional reactive GY 507500 700180 ( ) 3 Bisphenol-A liquid epoxy resin modified with a monofunctional reactive GY 5082,000 5,000390 ( ) 5 Bisphenol-A liquid epoxy resin modified with a difunctional reactive GY 509500 700189 ( ) 1 Bisphenol-A liquid epoxy resin modified with a monofunctional reactive GY 512900-1, ( ) 3 Bisphenol-A liquid epoxy resin modified with a monofunctional reactive GY 60045,000 6,800178 ( )

7 1 Bisphenol-A liquid epoxy resin modified with a monofunctional reactive 1 Bisphenol-A Based Epoxy Resins (continued)1 .2 Modified Liquid Epoxy Resins (continued)Product Viscosity @ 25 C, [cP]Epoxide Eq . Weight [EEW, g/eq] Density @ 25 C [lb/gal, (g/cm3)]Color [Gardner] Comments/ApplicationsAraldite GY 60057,500 9,500182 ( ) 1 Bisphenol-A liquid epoxy resin modified with a monofunctional reactive GY 9413600 900195 ( ) 1 Bisphenol-A liquid epoxy resin modified with a monofunctional reactive GY 9513525 675196 ( ) 1 Bisphenol-A liquid epoxy resin modified with a monofunctional reactive GY 95801,600 2,000188 ( ) 3 Bisphenol-A liquid epoxy resin modified with a monofunctional reactive GY 96132,100 2,500188 ( ) 1 Bisphenol-A liquid epoxy resin modified with a monofunctional reactive GY 96153,100 3,900188 ( )

8 1 Bisphenol-A liquid epoxy resin modified with a monofunctional reactive GY 9667500 700196 ( ) 1 Bisphenol-A liquid epoxy resin modified with a monofunctional reactive diluent with low tendency to LY 15641,200 1,400161 ( ) 2 Modified low viscosity bisphenol-A based liquid epoxy resin for filament winding and resin transfer molding .3 Unmodified Solid Epoxy ResinsProductSoftening Point [ C]Epoxide Eq . Weight [EEW, g/eq]Melt Viscosity @ 150 C, [cP]Color 1 [Gardner]Comments/ApplicationsAraldite CT 606060 75450 530D G 2 2 Semi solid unmodified bisphenol-A based epoxy resin. For use in casting, electrical encapsulating, laminating and adhesives GT 606390 97640 7301,500 3,400 1 Unmodified bisphenol-A solid epoxy resin.

9 Specifically designed for powder coatings. Exceptional flow and GT 608495 105875 1,025R T 2N/ASolid bisphenol-A based epoxy resin designed for the production of epoxy At 25 C, 40% in butylcarbitol2 Gardner Holdt Viscosity, 40% in butylcarbitol4 Section 1 Bisphenol-A Based Epoxy Resins (continued)1 .3 Unmodified Solid Epoxy Resins (continued)ProductSoftening Point [ C]Epoxide Eq . Weight [EEW, g/eq]Melt Viscosity @ 150 C, [cP]Color 1 [Gardner]Comments/ApplicationsAraldite GT 6097125 1352,000 2,500X Z1 2 3 High molecular weight epoxy resin for use in solvent-based industrial coatings in conjunction with urea, melamine or phenolic crosslinkers. Also used to control the melt viscosity of powder coating GT 6243110 1201,200 1,400W Z 2 3 High melt viscosity 6-type solid resin.

10 Designed for high quality industrial coatings and thick film powder GT 624875 85505 560800 1,500 1 Low molecular weight solid epoxy GT 701385 92650 7252,200 3,200 1 Standard low molecular weight solid epoxy resin for epoxy / polyester hybrid and epoxy powder GT 701486 96725 7753,100 4,700 1 Low molecular weight solid epoxy resin for use in decorative powder coating applications. Improved edge coverage as compared to Araldite GT GT 707165 75450 530D G 2 2 Unmodified 1-type solid epoxy resin for use in solvent-borne GT 707275 85600 700600 1,500 1 Low molecular weight epoxy resin. For use in conjunction with higher molecular weight epoxy resins to improve flow and leveling GT 707497 110935 1,1753,000 6,000 3 1 Intermediate molecular weight epoxy resin for use in powder coatings with outstanding flexibility and impact GT 7097113 1231,500 2,000W Z 2 3 Standard 7-type solid epoxy resin for use in conjunction with urea-formaldehyde, melamine-formaldehyde or phenolic resoles for packaging and coil coating GT 901383 90650 7251,600 2,600 1 Standard unmodified solid epoxy resin with improved flow properties as compared to Araldite GT GT 954595 105875 1,0251,100 2.


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