Transcription of 無加圧焼成可能な焼結Cu接合ペースト
1 Cu . Sintering Cu Bonding Paste that can be Sintered without Pressure HideoNakako Dai Ishikawa Chie Sugama Yuki Kawana Motohiro Negishi Yoshinori Ejiri . 1 . 225 Cu Cu Ni Au Ag . 40 MPa 180 W m 1 K 1 . 40 200 2000 SAT Ag . Cu .. We developed a sintering Cu bonding paste that can be cured without pressure at 225 in an H2 atmosphere. The die- shear adhesive strength with an adherend of Cu, Ni, Au, or Ag is at least 40 MPa. After sintering, the thermal conductivity of the sintered Cu bonding layer is 180 W m 1 K 1. The sintered Cu bonding after a thermal cycle test (TCT) of 2000 cycles in the temperature range from 40 to 200 showed a bonding reliability that is the same as, or better than, sintered Ag bonding or high lead solder.
2 With its high thermal conductivity, high bonding reliability, good productivity, and reasonable cost, this sintering Cu bonding paste is likely to be an ideal bonding material for application in power electronics. 2 .. 225 , , . Cu >180 W m 1 K 1 . Cu . 3 .. 1 Tj,max 1990 125 2005. 150 2016 175 SiC GaN 200 250 .. RoHS 2 Tj,max 175 . 3 .. 4 . Cu 225 . Au Ag Cu Ni Pd . 180 W m 1 K 1 35 W m 1 K 1 . 40 200 Ag . Tj,max 175 . Ag . Cu .. 2017 12 35. Cu Ag . Table 1 C. omparison of die-bonding properties among sintering Cu bonding paste, sintering Ag bonding paste, and high-lead solder Sintering Cu Sintering Ag High-lead Items bonding paste bonding paste solder Environment H2 Air H2 or HCOOH.
3 Bonding Bonding pressure No pressure Press (20 MPa) No pressure conditions Temperature 225 300 300 350 350 . Adherent materials Cu, Ni, Au, Ag, Pd Ag, Au Cu, Ni, Au, Ag 1 1 1 1. Thermal conductivity 180 W m K 280 W m K 35 W m 1 K 1. Properties of Power cycle reliability > 40000 38000. bonding layer Thermal cycle reliability > 2000 > 2000 > 2000. Material cost Reasonable Expensive Cheap Environmental friendliness OK OK Pb Si Ni adherend . Sintered Cu Appearance of the sintering Cu bonding paste Cross sectional SEM of the bonding interface Cu SEM . Figure 1 A. ppearance of the sintering Cu bonding paste and an SEM image of the bonding interface 5 . 10 mm 10 mm 7 mm 7 mm . 100 %.
4 The European union, , 2011. 1 2014-2015 3 S. Kim, Kim, Kim, K. Suganuma and G. Izuta, 2014 Improving the Reliability of Si Die Attachment with 2 DIRECTIVE 2011/65/EU, The restriction of the use of Zn-Sn-Based High-Temperature Pb-Free Solder Using a certain hazardous substances in electrical and electronic TiN Diffusion Barrier, J. Electron. Mater., , , equipment, The European parliament and the council of , 2009. 36 2017 12.
