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Dell EMC PowerEdge T640 Technical Guide

dell EMC PowerEdge T640 Technical GuideRegulatory Model: E47 SRegulatory Type: E47S001 Notes, cautions, and warningsNOTE: A NOTE indicates important information that helps you make better use of your : A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid : A WARNING indicates a potential for property damage, personal injury, or death. 2017 - 2020 dell Inc. or its subsidiaries. All rights reserved. dell , EMC, and other trademarks are trademarks of dell Inc. or itssubsidiaries. Other trademarks may be trademarks of their respective - 02 Rev. A04 List of of 61 System overview .. 8 New 82 System features ..9 Product Chassis views and features .. 12 Chassis view and the panels and 14 Security 144 16 Supported System 22 Memory 22 Memory module installation 236 24 Supported hard 24 Storage 25 IDSDM/vFlash Optimized Storage Subsystem (BOSS)..25 External Networking and 27 PCIe expansion 278 GPU and 289 Power, Thermal, and consumption and energy 30 Thermal and 31 ContentsContents310 Rack 3211 dell EMC OpenManage systems 33 Server and Chassis 34 dell EMC 34 Automation 34 Integration with third-party for third-party 34 dell EMC Update 34 dell Appendix A.

The PowerEdge T640 is the latest 2-socket, rack-capable tower (5U rack) server designed to run complex workloads using highly scalable memory, I/O, and network options. The system features the Intel Xeon Processor Scalable family, up to 24 DIMMs, PCI Express (PCIe)

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Transcription of Dell EMC PowerEdge T640 Technical Guide

1 dell EMC PowerEdge T640 Technical GuideRegulatory Model: E47 SRegulatory Type: E47S001 Notes, cautions, and warningsNOTE: A NOTE indicates important information that helps you make better use of your : A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid : A WARNING indicates a potential for property damage, personal injury, or death. 2017 - 2020 dell Inc. or its subsidiaries. All rights reserved. dell , EMC, and other trademarks are trademarks of dell Inc. or itssubsidiaries. Other trademarks may be trademarks of their respective - 02 Rev. A04 List of of 61 System overview .. 8 New 82 System features ..9 Product Chassis views and features .. 12 Chassis view and the panels and 14 Security 144 16 Supported System 22 Memory 22 Memory module installation 236 24 Supported hard 24 Storage 25 IDSDM/vFlash Optimized Storage Subsystem (BOSS)..25 External Networking and 27 PCIe expansion 278 GPU and 289 Power, Thermal, and consumption and energy 30 Thermal and 31 ContentsContents310 Rack 3211 dell EMC OpenManage systems 33 Server and Chassis 34 dell EMC 34 Automation 34 Integration with third-party for third-party 34 dell EMC Update 34 dell Appendix A.

2 Additional supply 36 Chassis dimensions ..37 Chassis 40 Environmental 40 Video 4213 Appendix B. Standards 4314 Appendix C. Additional 4415 Appendix D. Support and deployment 45 ProDeploy Enterprise Suite and Residency 45 Basic 45 ProSupport Enterprise 46 ProSupport 46 ProSupport One for Data 47 Support 47 Additional professional 48 dell Education 48 dell EMC Global Infrastructure Consulting EMC Managed of FiguresFigure 1. PowerEdge T640 front 2. PowerEdge T640 back 3. dell EMC OpenManage 33 Figure 4. Chassis base and top cover/foot 5. Left slam latch handle outer surface to right slam handle outer surface 38 Figure 6. Chassis base width and foot to foot 7. Bezel to rear wall/Bezel to rear power supply handle/Bezel to rear fan 40 Figure 8. ProDeploy Enterprise Suite 9. ProSupport Enterprise 10. Enterprise Support feature 11. SupportAssist 47 List of Figures5 List of TablesTable 1.

3 New 8 Table 2. Product 9 Table 3. Technical 4. Security 14 Table 5. Supported Processors for 6. Supported 7. DIMM performance 22 Table 8. Supported RAS 9. Supported hard 24 Table 10. PERC series 25 Table 11. Supported external storage 12. PCIe expansion 27 Table 13. Power tools and 29 Table 14. PSU 30 Table 15. Supported rack 32 Table 16. dell 34 Table 17. Power efficiency 36 Table 18. Temperature 40 Table 19. Relative humidity 41 Table 20. Maximum vibration 21. Maximum shock of TablesTable 22. Maximum altitude 41 Table 23. Operating temperature de-rating 41 Table 24. Standard operating 25. Expanded operating 41 Table 26. Video 27. Industry standard 43 Table 28. Additional 44 List of Tables7 System overviewIntroductionThe PowerEdge T640 is the latest 2-socket, rack-capable tower (5U rack) server designed to run complex workloads using highly scalablememory, I/O, and network options. The system features the Intel Xeon Processor Scalable family, up to 24 DIMMs, PCI Express (PCIe) enabled expansion slots, and a choice of network interface technologies to cover NIC and PowerEdge T640 is a general-purpose platform capable of handling demanding workloads and applications, such as: Data warehouse Ecommerce Databases High-performance computing (HPC)The PowerEdge T640 is the most scalable 2-socket tower server in the dell EMC portfolio.

4 The T640 is suitable for Remote Office,Branch Office (ROBO) and Small Medium Business (SMB) usage in an office or data center environment that requires large amount ofdisk, memory space, I/O slots, and TechnologiesTable 1. New technologiesTechnologyDetailed Description2nd Generation Intel Xeon Processor Scalable family 14nm process technology Virtual address space: 48 bits Physical address space 46 bits Intel Hyper-Threading Technology Up to 28 cores Up to GHz Max TDP: 205 WIntel C620 ChipsetIntel Platform Controller Hub (PCH)Memory 6x DDR4 Channels per socket, 2 DIMMs per channel (2 DPC) Up to 2933 MT/s (configuration-dependent) RDIMMs up to 32GB LRDIMMs at 128GB supported. NVDIMMs of 16GB supportediDRAC9 with Lifecycle ControllerThe new embedded systems management solution for the dell EMC systems features hardwareand firmware inventory and alerting, data center level power monitoring, and faster details, see the dell EMC OpenManage systems management sectionWireless ManagementThe Quick Sync feature is an extension of NFC based low bandwidth of the previous generationQuick Sync interface.

5 Quick Sync will offer feature parity with previous generation serverNFC interface with improved user experience. To extend this Quick Sync feature to wide varietyof Mobile OS's with higher data throughput, the Quick Sync version replaces previousgeneration NFC technology with wireless at-the-box system overviewSystem featuresProduct comparisonTable 2. Product comparisonFeaturePowerEdge T640 PowerEdge T630 CPU2x 2nd Generation Intel Xeon processor Scalable Family2x Intel Xeon E5-2600 v3 (Haswell-EP),BroadwellMemory 24 DDR4 DIMM slots Supports RDIMMs/LRDIMMs Speeds up to 2933MT/s, 3TB max Up to 12 NVDIMM, 192GB max Up to 24 DDR4 DIMM slots max memory Speeds up to 2400MT/sCPU InterconnectIntel Ultra Path Interconnect (UPI)Intel QuickPath Interconnect (QPI)Hard -inch, -inch, -inch, -inch + 8xNVMe, -inch - 12Gb SAS, 6Gb -inch, -inch, -inch, -inch - 12Gb SAS, 6Gb SATAS torage ControllersAdapters: HBA330, H330, H730P, H740P, H840, 12Gb SASHBA Mini Mono: HBA330, H330, H730P, H740P SW RAID:S140 Adapters: HBA330, H330, H730, H730P, H830(ext) Mini Mono: HBA330, H330, H730, H730 PSW RAID: S130 PCIe SSDUp to 8x PCIe SSD (NVMe)4x PCIe SSDPCIe SlotsMax 8 PCIe + 1 internalMax 7 PCIe Gen3 + 1 internalLOM2x 10 GbE (10 GBASE-T) Broadcom 574162x 1 GbEUSB PortsFront.

6 1 port (USB ), 1 port (USB ), dedicated iDRAC,serial, video, 6x : 1 port (USB ), 1 port ,dedicated iDRAC, serial, video,4x USB (rack)5U (rack)Power Supplies 2400W Platinum (AC only) 2000 Platinum (AC only) 1600W Platinum (AC only) 1100W Platinum (AC/DC) 750W Platinum/Titanium (AC only) 750W Platinum Mixed Mode DC (For china only) 495W Platinum (AC only)AC: 495W, 750W, 1100W DC: 1100W MixedMode: 750W 1100W DC, 1600 WRemote ManagementiDRAC9iDRAC8 Internal GPU4x 300W (DW) Passive or 8x 150W (SW)4x 300W (DW) Active or 7x 150w (SW)Availability Hot-plug Drives Hot-plug Redundant Cooling Hot-plug Redundant Power Supplies BOSS IDSDM Hot-plug Drives Hot-plug redundant Cooling Hot-plug Redundant Power Supplies IDSDM Support2 System features9 SpecificationsTable 3. Technical specificationsFeatureSpecificationForm factor5U rackable towerChassis dimension Width: mm Height: mm Depth: mmChassis weight inch hard drive with 8 fans: lb inch hard drive with 8 fans: lb inch hard drive with 8 fans: lbProcessors2nd Generation Intel Xeon processors Scalable familyProcessor sockets2 socketsChipsetIntel C620 Memory Maximum RAM: 3TB-24 DIMM slots Minimum RAM: 8GB-one module RDIMM-maximum system capacity: 768GB LRDIMM-maximum system capacity: 3TB NVDIMM-maximum system capacity: 192GB (up to 12 DIMMs per system) Architecture: 2666 or 2933 MT/s DDR4, registeredRAID controller H330 H730P H840 H740P HBA 330 12Gb SAS HBA Software RAID: S140 Hardware RAID.

7 SATA adapter (BOSS)Drives bays Up to 8 -inch SAS, SATA, and SSD drives Up to 18 -inch SAS, SATA, and SSD drives Up to 32 -inch SAS, SATA, and SSD drives Up to 16 -inch SAS, SATA, and SSD drives Up to 16 -inch SAS, SATA and SSD plus up to 8 NVMe drivesPCIe slots Slot 1: Full Length, Full Height, CPU1 - PCIe Gen3 x16 (x16 connector) Slot 2: Full Length, Full Height, CPU1 - PCIe Gen3 x4 (x8 connector) Slot 3: Full Length, Full Height, CPU1 - PCIe Gen3 x16 (x16 connector) Slot 4: Half Length, Full Height, CPU2 - PCIe Gen3 x8 (x8 connector) Slot 5: Full Length, Full Height, CPU2 - PCIe Gen3 (DMI) x4 (x8 connector) Slot 6: Full Length, Full Height, CPU2 - PCIe Gen3 x16 (x16 connector) Slot 7: Full Length, Full Height, CPU2 - PCIe Gen3 x8 (x8 connector) Slot 8: Full Length, Full Height, CPU2 - PCIe Gen3 x16 (x16 connector) Slot 9(internal): Half Length, Full Height, CPU1 - PCIe Gen3 x8 (x8 connector)Power supply 495W AC, 86 mm-Platinum 750W AC, 86 mm-Titanium 750W AC, 86 mm -Platinum 750W AC/HVDC, 86 mm-Platinum (Mixed mode China only) 750W DC-Platinum 240 V DC (For china only) 1100W AC, 86 mm-Platinum10 System featuresFeatureSpecification 1100W DC, 86 mm-Gold 1600W AC, 86 mm-Platinum 2000W AC, 86 mm-Platinum 2400W AC, 86 mm-PlatinumAvailability Hot-plug hard drives Hot-plug redundant cooling Hot-plug redundant power Internal Dual SD Module (IDSDM) BOSSS ystemsManagement dell EMC Systems management consoles and tools: OpenManage Essentials OpenManage Mobile with Quick Sync 2 OpenManage Power Center Repository Manager iDRAC License options: iDRAC9 Basic (default) iDRAC9 Express (upgrade) iDRAC9 Enterprise (upgrade) vFlash with 16GB micro SD card (upgrade) dell EMC OpenManage Integrations.

8 dell OpenManage Integration Suite for Microsoft System Center dell OpenManage Integration for VMware vCenter BMC Software (available from BMC) dell EMC OpenManage Connections: HPE Operations Manager I (OMi) Nagios Core and Nagios XIOperating systems Microsoft Windows Server with Hyper-V Citrix XenServer SUSE Linux Enterprise Server Red Hat Enterprise Linux VMware ESXi Canonical Ubuntu LTSFor more information on the specific versions and additions, visit GPU4x 300W (DW) passive or 8x 150W (SW)System features11 Chassis views and featuresChassis view and featuresFront panel view and featuresThe following components are located on the front of the PowerEdge T640:Figure 1. PowerEdge T640 front information tag312 Chassis views and health and system ID LED Quick Sync 2 wireless indicator (optional) USB drive (optional) drive slotsFor more information on the HDD numbering or to view other configurations, see the PowerEdge T640 Hardware Owner s Manual view and featuresThe following components are located on the back of the PowerEdge T640:Figure 2.

9 PowerEdge T640 back expansion card slot(s) health and system ID Enterprise port (2)Chassis views and expansion card slot(s) port (2) port (4) supply unit (2)Inside the systemNOTE: Components that are hot swappable are marked orange and touch points on the components are marked fan card card external external panels and LEDFor more information about the PowerEdge T640 control panels, see the PowerEdge T640's Owner s Manual at featuresThe latest generation of PowerEdge servers has the features listed in the table to help ensure the security of your data 4. Security featuresSecurity featureDescriptionCover latchA tooled latch is integrated in the top cover to secure it to the Trusted Platform Module (TPM) is used to generate/storekeys, protect/authenticate passwords, and create/store digitalcertificates. Intel's TXT (Trusted Execution Technology)functionality along with Microsoft's Platform Assurance feature inWindows Server 2016 is supported.

10 TPM can also be used to14 Chassis views and featuresSecurity featureDescriptionenable the BitLocker hard drive encryption feature in WindowsServer 2012/2016. Three versions of TPMs are supported in 14 Gnamely TPM , TPM (Rest of World, aka everywhereexcluding China and Russia) and TPM No TPMs are supportedfor Russia in bezelThe front bezel of the system contains a lock. A locked bezelsecures the system hard drivesPower-off securityBIOS has the ability to disable the power button alertAn internal switch is used to detect chassis Boot modeA switch mounted on the air shroud is used to detect chassisintrusion. When the cover is opened, the switch circuit closes toindicate intrusion to ESM. When enabled, the software will providenotification that the cover has been views and features15 ProcessorProcessor FeaturesThe 2nd Generation Intel Xeon Processor Scalable Family provides the foundation for a powerful datacenter platform. The keyfeatures are as follows: Higher Per-Core Performance: Up to 28 cores, delivery high performance and scalability for compute-intensive workloads acrosscompute, storage & network usages.


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