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Design and Assembly Process Implementation for ... - IPC

IPC-7093.. Design and Assembly Process Implementation for Bottom Termination SMT Components Developed by the IPC Bottom Termination Components (BTC) Task Group (5-21h) of the Assembly & Joining Processes Committee (5-20). of IPC. Users of this publication are encouraged to participate in the development of future revisions. Contact: IPC. 3000 Lakeside Drive, Suite 309S. Bannockburn, Illinois 60015-1249. Tel 847 Fax 847 March 2011 IPC-7093. Table of Contents 1 SCOPE ..1 Marking Alternatives ..24. Purpose ..1 Materials Used.

IPC-7093 Design and Assembly Process Implementation for Bottom Termination SMT Components Developed by the IPC Bottom Termination Components (BTC) Task

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1 IPC-7093.. Design and Assembly Process Implementation for Bottom Termination SMT Components Developed by the IPC Bottom Termination Components (BTC) Task Group (5-21h) of the Assembly & Joining Processes Committee (5-20). of IPC. Users of this publication are encouraged to participate in the development of future revisions. Contact: IPC. 3000 Lakeside Drive, Suite 309S. Bannockburn, Illinois 60015-1249. Tel 847 Fax 847 March 2011 IPC-7093. Table of Contents 1 SCOPE ..1 Marking Alternatives ..24. Purpose ..1 Materials Used.

2 24. Intent ..1 Description of Commercial Variations ..24. Detailed Description of MLF , MLP, and 2 APPLICABLE DOCUMENTS ..1. MLFP Components ..25. IPC ..1. Detailed Description of LLC and LFCSP . JEDEC ..2 Components ..27. Packaging and Handling ..30. 3 SELECTION CRITERIA AND MANAGING BTC. Implementation ..2. 5 MOUNTING STRUCTURES ..31. Terms and Definitions ..2. Types of Mounting Structures ..31. Bottom Termination Components (BTC) ..2. Organic Resin Systems ..31. Component Mounting Site ..2. Inorganic Structures.

3 31. Conductive Pattern* ..2. Layering (Multilayer, Sequential or Build-Up Land Pattern* ..2 and HDI) ..31. Mixed Component-Mounting Technology* ..2 Properties of Mounting Structures ..31. Printed Board Assembly ..2 Resin Systems ..32. Surface Mounting Technology (SMT)* ..2 Reinforcements ..32. BTC Executive Summary ..2 Reliability Concerns with High Temperature Description of Different Component Lead-Free Soldering ..32. Structures ..3 Thermal Expansion ..33. Total Cost of Ownership ..6 Moisture Absorption.

4 33. Design and Assembly Process Considerations Flatness (Bow and Twist) ..34. for QFN Type BTC Packages ..6. Surface Finishes ..34. Future Needs and Expectations ..8. Hot Air Solder Leveling (HASL) ..35. 4 COMPONENT CONSIDERATIONS ..8 Organic Surface Protection (Organic Solder- General Description of Different BTC ability Preservative) Coatings ..36. Packages ..8 Noble Metal Platings/Coatings ..36. Detailed Description and Standards for Solder Mask ..38. BTCs ..9. Wet and Dry Film Solder Masks ..38. Single Row Molded Lead-Frame Based Packaging.

5 9 Photoimageable Solder Masks ..40. Multiple Row Molded Lead-Frame Based Registration ..41. Packaging ..9 Via Protection ..41. JEDEC Publication 95 Design Guide ..10 Thermal Spreader Structure Incorporation ( , JEDEC Publication 95 Design Guide ..12 Metal Core Boards) ..44. JEDEC Publication 95 Design Guide ..15 Lamination Sequences ..44. Detailed Description of QFN and SON Heat Transfer Pathway ..44. (DFN) Packages ..17 Thermal Pad Attachment ..44. Manufacturing Methods ..17 Thermal Vias ..45. Types of Defects.

6 21 Solderless Interconnections Systems ..45. Marking Alternatives ..21. 6 PRINTED CIRCUIT Assembly Design . Materials Used ..21 CONSIDERATIONS ..46. Solderability Testing ..21 BTC Part Description ..46. Custom QFN and SON (DFN) ..21 BTC Package Variations ..46. Detailed Description of LGA, QFN and Termination Formats ..48. SON (DFN) Substrate-Based Packages ..23. Mounting Conditions ..48. Manufacturing Methods for Substrate- Based Packages ..23 Package Tolerances ..54. Types of Defects ..24 Attachment Techniques.

7 57. v IPC-7093 March 2011. 7 Assembly OF BTCs ON PRINTED Mold Compound Material ..85. BOARDS ..60 Die Size ..85. PCB Surface Finish Requirements ..60 Full vs. Half Etched Leadframe ..85. PCB Design ..61 Gold/Silver/Palladium Embrittlement ..85. Consideration for Soldering Process ..61 Stand-Off Height ..85. Component Preconditioning Bake ..62 PCB Design Considerations ..85. Component Preparation for Assembly ..62 Land Size ..85. Solder Paste and its Application ..62 Fillet Formation ..86. Component Placement Impact.

8 65 Board Thickness ..87. Reflow Soldering and Profiling ..66 Voids in Thermal Pad ..87. Reflow Process Impact on Material ..68 Design for Reliability (DfR) Process ..87. Vapor Phase ..69 Wear-Out Mechanisms ..88. Cleaning vs. No-Clean ..70 Creep-Fatigue Interaction ..88. Package Standoff ..70 Solder Thickness Mechanical Reliability ..89. Post-SMT Processes ..71 Wear-Out Mechanisms Review ..90. Conformal Coatings ..71 Reliability Factors ..90. Use of Underfills and Adhesives ..71 Benefits of Reinforcement.

9 90. Depaneling of Boards and Modules ..71 Event Related Failures ..91. Inspection Techniques ..71 Design for Reliability Issues and Concerns ..91. X-Ray Usage ..72 Damage Mechanisms and Failure of Solder Scanning Acoustic Microscopy ..72 Attachments ..91. BTC Standoff Measurement ..72 Solder Joints and Attachment Types ..91. Optical Inspection ..73 Solder Interface Grain Structure Effects ..92. Destructive Analysis Methods ..73 Global Expansion Mismatch ..92. Testing and Product Verification ..74 Local Expansion Mismatch.

10 92. Electrical Testing ..74 Internal Expansion Mismatch ..93. Test Coverage ..75 Solder Attachment Failure ..93. Burn-In Testing ..75 Validation and Qualification Tests ..93. Product Screening Tests ..75 Screening Procedures ..93. Assembly Process Control Criteria for Solder Joint Defects ..93. Plastic BTCs ..75 Screening Recommendations ..93. Voids in BTC Solder Joints ..75. Solder Bridging ..76 9 DEFECT AND FAILURE ANALYSIS. CASE STUDIES ..94. Opens ..77. Solder Attachment Failures ..94. Cold Solder ..78.


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