Electronic CHIPSHIELD 2401 Materials A 1 …

1 Electronic Materials Incorporated An ISO 9001 registered company CHIPSHIELD 2401 A 1 Component and/or Heat Cure Epoxy For Globbing, Coatings, and Underfills Revision Date: 12/2001 Introduction CHIPSHIELD 2401 is a member of a new generation of Curable epoxies. It is curable by alone, heat alone, or a combination of each (best). It is a 1 component epoxy, which eliminates meter mix and dispense equipment or handling pre-mixed and frozen material . Emcast 2401 is a high purity liquid epoxy glob top ( coating ) encapsulant which, displays excellent pressure pot performance. It is thixotropic with much improved thermal cycling due to a reduced It s resistance to humidity and cleaning solvents is excellent. It is packaged pre-degassed in 3, 5, 10 & 30cc EFD syringes.

2 Properties Uncured Color Gray or black Viscosity Brookfield RVT.#7/25 400,000 cps Filler type Silica Filler % 72 Shelf Life Freezer 6 months. Density Properties Cured Color Grey or black CTE-ppm/ C 1- 18.

3 2- 60 Tg- C 160 Linear shrinkage %{ Flexural strength 9,000 Tensile strength 18,000 Thermal conductivity W/mK - Hardness D. 93 minimum Ionics ppm/total Na+, Cl-, K+ 50 maximum Vol.}

4 Resistivity ohms cm Dielectic St. Volt/mils, 1/8 film 450 Use and Handling No measuring or mixing. CHIPSHIELD 2401 is a single component system. Remove from freezer and allow to come to room temperature (20-30 mins). Working life at room temperature is approximately 3 days. | Expose to light of wavelength range 325 - 380nm. Exposure time is a function of the light intensity, amount (mass) of epoxy and the type of substrate. See TSR #13 for more detailed cure information. Post cure @ 110-130 C for 10 to 30 minutes. { Cure shrinkage can be controlled by the end user. The actual chemical cure shrinkage of CHIPSHIELD 2401 is much less than However, by applying too much energy ( and/or thermal) initially, the cure reaction can proceed very rapidly, generating a very high cure exotherm.}

5 This rapidly raises the temperature of the the epoxy - particularly in the thickest (dome) area of the glob, causing local thermal expansion, then rapid gelation- before the thinner (outer) sections have started to gel. When cooled back to ambient temperature, this results in a stress force in the direction of lifting or curling the perimeter of the glob. Don t be time greedy. Patience will result in superior adhesion. |While the working life is 3 days, CHIPSHIELD 2401 contains a high level of Silica. At room temperature, Silica tends to settle, causing separation from the epoxy polymers. The user must be aware that settling may cause inconsistent results. Good housekeeping rules are always important. Provide ample ventilation in all areas of handling, mixing and use. Avoid prolonged breathing of possible fumes.

6 Minimize skin contact. Use of goggles, rubber gloves, and protective creams is recommended. Always wash exposed areas immediately using warm water and soap followed by rinsing with clear water. If material comes in contact with eyes, flush with clear water for fifteen minutes and consult a physician immediately. All data in this bulletin are based on our own research and the research of others. They are believed to be accurate. However, no guarantee of accuracy is made. Product description is sold without warranty except conformity to specification and on condition that the purchasers shall determine suitability for their particular purpose. End of Document 1814 Airport Road, Breckenridge, CO 80424 Phone: (970) 547-0807 Fax: (970) 547-0817