ELECTRONICS INDUSTRIES Guidelines for Printed …

1 IPC-CM-770 EGuidelines for PrintedBoard ComponentMountingDeveloped by the component mounting Guidelines Task Group (5-21a)of the Assembly & Joining Processes Committee (5-20) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC2215 Sanders RoadNorthbrook, Illinois60062-6135 Tel 847 847 :IPC-CM-770 - September 1968 IPC-CM-770A - March 1976 IPC-CM-770B - October 1980 IPC-CM-770C - March 1987 IPC-CM-770D - January 1996 ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES Table of .. of board Types andAssemblies .. Classes .. Levels .. Types .. Circuit board Assembly Types .. of Precedence .. and Definitions .. 32 APPLICABLE .. Industry Standards .. INDUSTRIES Association .. Association Documents .. 103 GENERAL Options and Considerations.

2 component Terminations .. component Terminations .. Type .. Considerations .. Preparation .. Forming .. Placement .. Assemblies .. Securing .. Agent .. Boards .. & Lead Finishes .. and Storage .. Sensitivity .. Movement Systems .. and Carriers .. 234 component Characterization and Classes .. Components .. Components .. Components .. Outline Components (SOs) .. Components .. Carriers .. Semiconductors .. Automated Bonding (TAB) .. Array Components .. and InterconnectComponents .. Packaging/Delivery Systems .. Finishes .. 275 PACKAGING AND INTERCONNECTING( Printed board ) board Characterization and Classes .. Laminate Boards .. Laminate Boards .. Boards .. Printed board Structures.

3 board Bonded to Support Plane(Metal or Nonmetal) .. Structures withMetal Support Plane .. Structures with MetalSupport Plane .. Printed board with MetalSupport Plane .. Core Printed board Structures .. (Metal Core) Structures .. board with Constraining (NotElectrically Functioning) Core .. Boards with Electrically-FunctionalConstraining Cores .. board with Constraining Core .. mounting Structure Materials andConsiderations .. 31 January Sinks .. Spreaders .. Conductive Insulators .. 346 ASSEMBLY DESIGN of Assembly Operations .. Machines .. Machines .. Placement Machines .. Operations .. Soldering Tools and Processes .. Soldering Processes .. Sequence .. Before Assembly .. Preparation .. Preparation (Tinning/SolderDipping).

4 Process Sequence .. Attachment Properties .. Soldering Processes .. (Nitrogen) .. Atmosphere Soldering .. 397 PLACEMENT Technology .. Identification .. Checks .. Checks for All Assembly Types .. Checks for Surface MountedAssemblies .. Checks for Mixed TechnologyAssemblies Involving Auto-Placementand Auto-Insertion .. and Procurement ofComponents .. Processes and Applications .. Package Style .. Transit Packaging .. of Manufacture and SolderableCoating Thickness .. and Procurement ofPrinted Boards .. Printed Boards .. Assemblers and Their Suppliers .. for High Assembly Yield .. and Procurement of ProcessMaterials .. Pastes and Adhesives .. Performs .. 448 INTERCONNECT Spacing .. Considerations .. Solder component Orientation.

5 Placement .. component Positioning .. and Double-Sided board Assembly .. Standoff Height for Cleaning .. Marks .. Fiducials .. Fiducials .. and Shape of Fiducial .. Width and Spacing .. Guidelines .. Via Holes .. and Land Pattern Separation .. Under Components .. Fabrication Allowances .. Characteristics .. Width and Spacing Tolerances .. Pattern Feature LocationTolerance .. Size and Panelization .. Format .. Construction .. 509 component Discrete Components .. Axial Leaded DiscreteComponent .. Discrete Components .. Type Description .. Radial Leaded DiscreteComponents .. Components .. Outline (TO) Cans .. Variable Resistors .. Packages .. Packages .. Packages .. Components .. Grid Array Components.

6 56 IPC-CM-770 EJanuary Mount Connectors .. Sockets .. 5810 mounting STRUCTURE board Characterization and Types .. Ratio .. Holes .. Holes .. and Radial Lead ComponentMounting .. Radial Lead ComponentLand Patterns .. Package (DIP) Land Patterns .. Patterns for Ribbon Lead component .. Patterns for Pin Grid ArrayComponent .. Patterns for Through Hole MountConnectors .. Land Patterns for Through Hole MountedSockets .. 6111 ASSEMBLY SEQUENCE Steps .. Issues .. Process Methods .. Termination after Assembly .. Leads .. Retention .. Cutting .. Leaded component .. Leaded Discrete component .. Mechanical Securing .. Inline Leads .. Grid Array Components .. Hole Mounted Connector .. Placement .. Through Leads.

7 Leads .. Spacing .. Body .. Clearance .. Leaded Discrete Components .. Power Transistors .. Insulators and ThermalConductors .. mounting .. Leaded Discrete Components .. Leaded Discrete Components .. Radial Lead component .. Components .. Components .. Power Packages .. Technology .. Leaded Discrete Components .. Leaded Discrete Components .. Leaded Components .. Grid Array Components .. Techniques .. and Radial Discrete Components .. Package Gripping Tools .. Radial Leaded DiscreteComponents .. Leaded Components .. Techniques .. Leaded Discrete Components .. Leaded Discrete Components .. Radial Lead Components .. Leaded Components .. 8012 component CHARACTERISTICSSURFACE and Classes .. Type Descriptions.

8 Procurement .. System .. and Storage .. Protection .. Resistors .. Construction .. Materials .. Capacitors .. Construction .. Materials .. Construction .. Materials .. Capacitors .. Construction .. Materials .. 89 January .. Electrode Face (MELF) Components .. Construction .. Materials .. 23 .. Construction .. Materials .. 89 .. Basic Construction .. Termination Materials .. Marking .. 123 .. Basic Construction .. Termination Materials .. Marking .. 143 .. Basic Construction .. Termination Materials .. Marking .. 223 .. Basic Construction .. Termination Materials .. Marking .. 252/TO 268 .. Basic Construction .. Termination Materials .. Marking .. Basic Construction.

9 Termination Materials .. Pin Numbering .. Basic Construction .. Termination Materials .. Marking .. Basic Construction .. Termination Materials .. Marking .. (Square) .. Plastic Chip Carriers .. Plastic Chip Carriers .. (Rectangular) .. Premolded Plastic Chip Carriers .. Post-Molded Plastic Chip Carriers .. Marking .. Basic Construction .. Termination Materials .. Marking .. 9413 mounting STRUCTURE GUIDELINESSURFACE board Characterization and Types .. Rigid, Organic Flex and Rigid-Flex .. Patterns .. Analysis .. pattern Configurations for SmallOutline Packages .. patterns for DIPs and SIPs .. Carrier Land Patterns .. Patterns for Surface MountConnectors .. Patterns for Surface Mount Sockets .. Printed board Structures.

10 Printed board .. Printed board Technology .. Preparation .. Masking Guidelines .. on Printed board Surface MountLands .. Thickness .. board Condition .. 9814 SURFACE Hierarchy .. Issues .. Configuration after Assembly .. Technology .. Techniques .. Assembly .. Assembly Techniques .. Assembly of Surface MountConnectors .. Assembly of Surface MountSockets .. 10815 component CHARACTERISTICSHIGH PIN COUNT AREA Definition .. 108 IPC-CM-770 EJanuary Size .. Size Relationships .. Packaging StyleConsiderations .. Ball Grid Arrays (PBGA) .. Ball Grid Arrays (CBGA) .. Column Grid Arrays (CCGA) .. Ball Grid Arrays (TBGA) .. Connectors .. Considerations for BGAC onnectors .. Considerations for BGAC onnectors.