ELECTRONICS INDUSTRIES Rework of Electronic …

1 IPC-7711A/7721 ARework of Electronic AssembliesIPC-7711, Change 1 - February 2002 IPC-7711 - February 1998 Repair and Modification of PrintedBoards and Electronic AssembliesIPC-7721, Change 2 - April 2001 IPC-7721, Change 1 - March 2000 IPC-7721 - February 1998 These standards are now published in a single volumewith three sections. Part 1 includes the general informationand procedures that are common to both IPC-7711A andIPC-7721A. Part 2 includes all the Rework procedures fromIPC-7711A and Part 3 includes all the repair and modificationprocedures from by the Repairability Subcommittee (7-34) of the ProductAssurance Committee (7-30) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC2215 Sanders RoadNorthbrook, Illinois60062-6135 Tel 847 847 :IPC-R-700C - January 1988 ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES Table of ContentsPART 1 General Information and Common Procedures1 Definition of Requirements 11.

2 12. 13. 21. Class 1 General ELECTRONICS 22. Class 2 Dedicated Service Electronic 23. Class 3 High Performance Electronic Printed Board 2R. Rigid Printed Boards and 2F. Flexible Printed Boards and 2W. Discrete Wiring Boards and 2C. Ceramic Boards and Level of Levels of 2L. Lowest 2M. Medium 2H. Highest Skill Terms and 31. Soldering 32. Personnel 33. Professional Basic 41. Appropriate 42. Singular 43. Quality and 44. Procedure 45. 46. Heat 47. Removal of Tools and 41.

3 Proper 42. High Quality 43. 44. Soldering 45. Component Removal and 46. Preheating (Auxiliary) 47. Fume 48. Hand Held Drilling and Grinding 49. Precision Drill/Mill 510. Replacement Conductors and 511. Gold Plating 512. Epoxy and Coloring 513. Eyelets and Eyelet Press 514. Cleaning 515. Tools and 516. Conformal Coating 517. Process Goals and Non-destructive Component Surface Mount Land 61. Remove Old 62. Clean Component Primary Heating Preheating and Auxiliary Heating Vision Systems and Surface MountComponent Selecting Optimum Process for BGA/CSP/Flip Chip Time TemperatureProfile TTP).

4 Lead Free 9 October 2003 IPC-7711A/7721 AvHandling/CleaningProcedureDescriptionP roduct ClassSkill LevelLevel Electronic AssembliesR,F,W, , F, C, WIntermediateHighCoating RemovalProcedureDescriptionIllustrationP roductClassSkillLevelLevel Removal, Identification ofConformal CoatingR, F, W, Removal, Solvent MethodR, F, W, Removal, Peeling MethodR, F, W, Removal, Thermal MethodR, F, W, Removal, Grinding/Scraping MethodR, F, W, Removal, Micro BlastingMethodR, F, W, CAdvancedHighIPC-7711A/7721 AOctober 2003viCoating ReplacementProcedureDescriptionIllustrat ionProductClassSkillLevelLevel Replacement, SolderResistR, F, W, Replacement, ConformalCoatings/EncapsulantsR, F, W, CIntermediateHighConditioningProcedureDe scriptionIllustrationProductClassSkillLe velLevel and PreheatingR, F, W, CIntermediateHighEpoxy Mixing and HandlingProcedureDescriptionIllustration ProductClassSkillLevelLevel Mixing and HandlingR, F, W.

5 CIntermediateHighOctober 2003 IPC-7711A/7721 AviiTable of ContentsPART 2 Rework of Electronic Assemblies3 Through-Hole RemovalProcedureDescriptionRound LeadProduct ClassSkill LevelLevel Vacuum MethodR,F, Vacuum Method - Partial ClinchR,F, Vacuum Method - Full ClinchR,F, Clinch Straigthening MethodR,F, Clinch Wicking MethodR,F, PGA and Connector RemovalProcedureDescriptionProduct ClassSkill LevelLevel Fountain MethodR,F,W, Chip Component RemovalProcedureDescriptionProduct ClassSkill LevelLevel tipR,F,W, MethodR,F,W, Termination - Hot Air MethodR,F,W, Leadless Component RemovalProcedureDescriptionProduct ClassSkill LevelLevel Wrap MethodR,F,W, Application MethodR,F,W,CAdvancedHighIPC-7711A/7721 AOctober SOT RemovalProcedureDescriptionProduct ClassSkill LevelLevel Application MethodR,F,W, Application Method - TweezerR,F,W, Air PencilR,F,W, Gull Wing Removal (two sided)ProcedureDescriptionProduct ClassSkill LevelLevel Fill MethodR,F,W, Wrap MethodR,F,W, Application MethodR,F,W, Fill Method - TweezerR,F,W, Wrap Method - TweezerR,F,W, Application Method - TweezerR,F,W, Gull Wing Removal (four sided)

6 ProcedureDescriptionProduct ClassSkill LevelLevel Fill Method - Vacuum CupR,F,W, Fill Method - Surface TensionR,F,W, Wrap Method - Vacuum CupR,F,W, Wrap Method - Surface TensionR,F,W, Application Method - Vacuum CupR,F,W, Application Method - Surface TensionR,F,W, Fill Method - TweezerR,F,W, Wrap Method - TweezerR,F,W, Application Method - TweezerR,F,W, Gas Reflow MethodR,F,W,CAdvancedHighOctober 2003 IPC-7711 J-Lead RemovalProcedureDescriptionProduct ClassSkill LevelLevel Fill Method - TweezerR,F,W, Fill Method - Surface TensionR,F,W, Wrap Method - TweezerR,F,W, Wrap Method - Surface TensionR,F,W, Application Method - TweezerR,F,W, & Tin Tip OnlyR,F,W, Gas Reflow SystemR,F,W, BGA/CSP RemovalProcedureDescriptionProduct ClassSkill LevelLevel RemovalR,F,W, MethodR,F,W, PLCC Socket RemovalProcedureDescriptionProduct ClassSkill LevelLevel Fill MethodR,F,W, Wrap MethodR,F,W, Application MethodR,F,W, Air Pencil MethodR,F,W,CAdvancedMedium4 Pad/Land PreparationProcedureDescriptionProduct ClassSkill LevelLevel Mount Land Preparation - Individual MethodR,F,W, Mount Land Preparation - Continuous MethodR,F,W, Solder Removal - Braid MethodR,F,W.

7 RelevelingR,F,W, Land TinningR,F,W, SMT LandsR,F,W,CIntermediateHighIPC-7711A/77 21 AOctober 2003x5 Through-Hole InstallationProcedureDescriptionInstall following the requirements of J-STD-001 PGA and Connector InstallationProcedureDescriptionProduct ClassSkill LevelLevel Fountain Method with PTH PrefilledR,F,W, Chip InstallationProcedureDescriptionProduct ClassSkill LevelLevel Paste MethodR,F,W, to Point MethodR,F,W, Leadless Component Installation(To Be Developed) Gull Wing InstallationProcedureDescriptionProduct ClassSkill LevelLevel Method - Top of LeadR,F,W, Method - Toe TipR,F,W, MethodR,F,W, Air Pencil/Solder Paste MethodR,F,W, Tip w/Wire Layover (To be developed)

8 R,F,W, Tip with WireR,F,W, J-Lead InstallationProcedureDescriptionProduct ClassSkill LevelLevel Solder MethodR,F,W, MethodR,F,W, Paste Method/Hot Air PencilR,F,W, MethodR,F,W,CIntermediateHighOctober 2003 IPC-7711 BGA/CSP InstallationProcedureDescriptionProduct ClassSkill LevelLevel Wire Solder to Prefill LandsR,F,W, Solder Paste to Prefill LandsR,F,W, Reballing ProcedureR,CAdvancedHigh6 Removing ShortsProcedureDescriptionProduct ClassSkill LevelLevel - Draw Off MethodR,F,W, - Respread MethodR,F,W, - Draw Off MethodR,F,W, - Respread MethodR,F,W,CIntermediateHigh8 SplicingProcedureDescriptionProduct ClassSkill LevelLevel SpliceN/AIntermediateLowIPC-7711A/7721 AOctober 2003xiiTable of ContentsPART 3 Repair and Modification of Printed Boards and Electronic AssembliesLegends/MarkingsProcedureDescr iptionIllustrationProductClassSkillLevel Level , StampingMethodR, F, W, , Hand LetteringMethodR, F, W, , Stencil MethodR, F, W, CIntermediateHighBlisters and DelaminationProcedureDescriptionIllustra tionProductClassSkillLevelLevel Repair.

9 Injection MethodRAdvancedHighBow & TwistProcedureDescriptionIllustrationPro ductClassSkillLevelLevel and Twist RepairR, WAdvancedMediumHole RepairProcedureDescriptionIllustrationPr oductClassSkillLevelLevel Repair, Epoxy MethodR, Repair,Transplant MethodR. WExpertHighOctober 2003 IPC-7711A/7721 AxiiiKey and Slot RepairProcedureDescriptionIllustrationPr oductClassSkillLevelLevel and Slot Repair, EpoxyMethodR, and Slot Repair, TransplantMethodR, WExpertHighBase Material RepairProcedureDescriptionIllustrationPr oductClassSkillLevelLevel Material Repair, EpoxyMethodR, Material Repair, AreaTransplant MethodR, Material Repair, EdgeTransplant MethodR, WExpertHighLifted ConductorsProcedureDescriptionIllustrati onProductClassSkillLevelLevel Conductor Repair, EpoxySeal MethodR, Conductor Repair, FilmAdhesive MethodR.

10 FIntermediateHighIPC-7711A/7721 AOctober 2003xivConductor RepairProcedureDescriptionIllustrationPr oductClassSkillLevelLevel Repair, Foil Jumper,Epoxy MethodR, F, Repair, Foil Jumper,Film Adhesive MethodR, F, Repair, Weld MethodR, F, Repair, Surface WireMethodR, F, Repair Through BoardWire Repair/Modification,Conductive Ink MethodR, F, Repair, Inner LayerMethodR, FExpertHighConductor CutProcedureDescriptionIllustrationProdu ctClassSkillLevelLevel Cut, SurfaceConductorsR, Cut, Inner LayerConductorsR, Inner Layer Connectionat a Plated Hole, Drill ThroughMethodR, Inner Layer Connectionat a Plated Hole, Spoke CutMethodR, FAdvancedHighOctober 2003 IPC-7711A/7721 AxvLifted Land RepairProcedureDescriptionIllustrationPr oductClassSkillLevelLevel Land Repair, Epoxy MethodR, Land Repair, Film AdhesiveMethodR