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ELECTRONICS INDUSTRIES Rework of Electronic Assemblies

IPC-7711 - Includes Change 1 Rework of ElectronicAssembliesDeveloped by the Electronic Assembly Rework Task Group (7-34b)of IPCU sers of this standard are encouraged to participate in thedevelopment of future :IPC2215 Sanders RoadNorthbrook, Illinois60062-6135 Tel 847 847 , Chg 1 - May 2002 IPC-7711 - February 1998 Supersedes:IPC-R-700C - January 1988 ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES AcknowledgmentAny Standard involving a complex technology draws material from a vast number of sources. While the principal members of theIPC Electronic Assembly Rework Task Group (7-34b) of the Product Assurance Committee are shown below, it is not possible toinclude all of those who assisted in the evolution of this standard.

Acknowledgment Any Standard involving a complex technology draws material from a vast number of sources. While the principal members of the IPC Electronic Assembly Rework Task Group (7-34b) of the Product Assurance Committee are shown below, it is not possible to

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Transcription of ELECTRONICS INDUSTRIES Rework of Electronic Assemblies

1 IPC-7711 - Includes Change 1 Rework of ElectronicAssembliesDeveloped by the Electronic Assembly Rework Task Group (7-34b)of IPCU sers of this standard are encouraged to participate in thedevelopment of future :IPC2215 Sanders RoadNorthbrook, Illinois60062-6135 Tel 847 847 , Chg 1 - May 2002 IPC-7711 - February 1998 Supersedes:IPC-R-700C - January 1988 ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES AcknowledgmentAny Standard involving a complex technology draws material from a vast number of sources. While the principal members of theIPC Electronic Assembly Rework Task Group (7-34b) of the Product Assurance Committee are shown below, it is not possible toinclude all of those who assisted in the evolution of this standard.

2 To each of them, the members of the IPC extend their AssuranceCommitteeElectronic Assembly ReworkTask GroupTechnical Liaison of theIPC Board of DirectorsChairmanMel ParrishSoldering technology InternationalChairmanDaniel L. FosterSoldering technology InternationalVice ChairmanPeggi BlakleyNSWC CraneWilliam Beckenbaugh, CorporationA Special Note of AppreciationThe following core group hasvolunteered much of their time andhave made significant contributionsto this , Peggi, NSWC CraneBrock, Ron, NSWC CraneDay, Jennifer, Current CircuitsFerry, Jeff, Circuit TechnologyCenter, , Daniel L.

3 , Soldering TechnologyInternationalHersey, Ralph J., Ralph Hersey& AssociatesHoughton, Bruce, CelesticaCorporationMoffitt, James H., Moffitt ConsultingServicesNorton, John S., Tektronix , Eric, PACE, Assembly Rework Task GroupAoki, Masamitsu, Toshiba , Peter, Cisco Systems , Timothy E., Alcatel USAB ergum, Erik J., Polyclad LaminatesBlakley, Peggi, NSWC CraneBoerdner, Richard W., EJE ResearchBogert, , Bechtel Plant Machinery, , Diana, Soldering TechnologyInternationalBrock, Ron, NSWC CraneCash, Alan S., Northrop GrummanCorporationChen, D. Phillip, Honeywell CanadaCirimele, Ray, BEST Andrade, Derek, Surface MountTechnology CentreDaugherty, Dale, Siemens Energy &AutomationDay, Jennifer, Current CircuitsDeane, William, EPTAC CorporationDehne, Rodney, WorldwideDennehy, Charles S.

4 , CircuitTechnology Center , William C., BAES ystems ControlsDiFranza, Michele J., The Mitre , Nancy, AssembliesHallstead , Thomas R., Boeing Aircraft& MissilesFalconbury, Gary, Raytheon TechnicalServices , Jeff, Circuit Repair CorporationFieselman, Charles D., SolectronTechnology , Daniel L., Soldering TechnologyInternationalFreeman, Fortunata A., SolectronTechnology , Alan L., Boeing Aircraft &MissilesGonzalez, Constantino, ACME, , William F., Plessey TellumatSouth AfricaGrim, Edward A., Raytheon SystemsCompanyHargreaves, Larry, DC. Scientific , Steven A.

5 , Hughes DefenseCommunicationsHiett, Carol E., Lockheed MartinAstronauticsHill, Michael E., Dynamic Details , David P., Circuit Graphics , F. D. Bruce, CelesticaHymes, Les, Les Hymes AssociatesJohnson, Kathryn L., Hexacon ElectricCompanyJohnson, Laurence G., General , Sue A., Compaq ComputerCorporationKemp, Cindy A., Evenflo , Richard, Bahiatech BahiaTechnologia , Terence, Axiom ELECTRONICS , , Robert J., GlasteelIndustrial LaminatesKorth, Connie M., ReptronManufacturing Services/HibbingLambert, Leo P., EPTAC CorporationLee, Frederic W., Northrop GrummanNorden SystemsMacLennan, Karen E.

6 , M/A-COM , Peter E., PEM ConsultingMalewicz, Wesley R., Siemens MedicalSystems , John, Sypris ELECTRONICS ,LLCA special note of thanks is due to PACE, Metcal and Circuit technology Centerfor the preparation of the illustrations in this 2002 IPC-7711iiiMay, William Dean, NSWC - CraneMcCormick, Becky, EMD , Jr., Stephen, White ElectronicDesigns , Christine A., FORE SystemsMoffitt, James H., Moffitt ConsultingServicesMoir, Jim, Hewlett Packard , Yori, Hadco , DavidNortham, Riley L., EMPF/ACIN orton, John S., Tektronix , Benetta, IEC , Seppo, Nokia Networks,Switching PlatformParrish, Mel, Soldering TechnologyInternationalPoelking, Monica, Defense SupplyCenter ColumbusQuinn, Paul J.

7 , Lockheed MartinMissiles & SpaceRaby, Jim D., Soldering TechnologyInternationalRassal, David, 3 COM CorporationRausch, James E., Delphi DelcoElectronics SystemsRaye, John F., Defense Supply CenterColumbusRobertson, David , Teresa M., AAI CorporationSanford, Kelly, Micron Custom , Patricia A., SolderingTechnology InternationalSherman, Lowell, Defense SupplyCenter Columbus DSCCS iegel, Eric, PACE, , Rick B., Motorola , Douglas J., Essex TechnologiesGroup, , David B., Lucent , Wayne A., Rockwell CollinsTevels, John R., Harris , Ronald E., NSWC - CraneTorres, Steven, Corlund , Sharon T.

8 , Aviation &Missile CommandWoodford, James Walter, Departmentof DefenseWooldridge, James R., RockwellInternationalXiao, Nora, Tektronix , Don, Honeywell s documentation strategy is to provide distinct documents that focus on specific aspects of Electronic packaging this regard document sets are used to provide the total information related to a particular Electronic packaging topic. Adocument set is identified by a four digit number that ends in zero (0) ( , IPC-7710).This standard is intended to provide information on the Rework , repair and modification of printed boards and electronicassemblies.

9 This information must also be supplemented by a performance specification that contains the requirements forthe chosen technology . When used together, these documents should lead both manufacturer and customer to consistentterms of documents supersede the following:IPC-7711 supersedes IPC-R-700 CIPC-7721 supersedes IPC-R-700 CAs technology changes, a performance specification will be updated, or new focus specifications will be added to the docu-ment set. The IPC invites input on the effectiveness of the documentation and encourages user response through completionof Suggestions for Improvement forms at the end of each 2002ivTable of Contents1 12 Handling/CleaningProcedureDescriptionPro duct ClassSkill LevelLevel Electronic AssembliesR,F,W, ,F,W, ConditioningProcedureDescriptionProduct ClassSkill LevelLevel and PreheatingR,F,W, CoatingProcedureDescriptionProduct ClassSkill LevelLevel , Identification of Conformal CoatingR,F,W, , Solvent MethodR,F,W, , Peeling MethodR,F,W, , Thermal MethodR,F,W.

10 , Grinding/Scraping MethodR,F,W, , Micro Blasting MethodR,F,W,CAdvancedHigh3 Through-Hole RemovalProcedureDescriptionRound LeadProduct ClassSkill LevelLevel Vacuum MethodR,F, Vacuum Method - Partial ClinchR,F, Vacuum Method - Full ClinchR,F, Clinch Straigthening MethodR,F, Clinch Wicking MethodR,F,WAdvancedHighMay 2002 IPC-7711v4 Pad/Land PreparationProcedureDescriptionProduct ClassSkill LevelLevel Mount Land Preparation - Individual MethodR,F,W, Mount Land Preparation - Continuous MethodR,F,W, Solder Removal - Braid MethodR,F,W, RelevelingR,F,W, Land TinningR,F,W, SMT LandsR,F,W,CIntermediateHigh5 Through-Hole InstallationProcedureDescriptionInstall following the requirements of J-STD-001 PGA and Connector InstallationProcedureDescriptionProduct ClassSkill LevelLevel Fountain Method with PTH PrefilledR,F,W, Chip InstallationProcedureDescriptionProduct ClassSkill LevelLevel Paste MethodR,F,W, to Point MethodR,F,W, Leadless Component Installation(To Be Developed)


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