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eMMC MA110 Series - socle-tech.com

emmc MA110 Series Big Innovation Company Limited Page 1 of 36 Copyright 2017 BIG-INNO all rights reserved. 1. Features MLC NAND General Features o Embedded with e-MMC Flash Controller and NAND flash o JEDEC R emmc compliant o Field Firmware Update o Sleep Notification in Power Off Notification o Device Health Report o Secure Removal o Command Queuing o 1bit, 4bit, 8bit data bus widths Supported Speed Mode o SDR52 MHz/DDR52 MHz/HS200/HS400 Form Factor o JEDEC R MO-276D Embedded Flash Memory o BGA 153 Ball BA type ( mm x 13 mm) Available Capacities o 8 GB to 32 GB Voltages o Memory Power (VCC): o Interface Power (VCCQ).

eMMC MA110 Series Big Innovation Company Limited

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Transcription of eMMC MA110 Series - socle-tech.com

1 emmc MA110 Series Big Innovation Company Limited Page 1 of 36 Copyright 2017 BIG-INNO all rights reserved. 1. Features MLC NAND General Features o Embedded with e-MMC Flash Controller and NAND flash o JEDEC R emmc compliant o Field Firmware Update o Sleep Notification in Power Off Notification o Device Health Report o Secure Removal o Command Queuing o 1bit, 4bit, 8bit data bus widths Supported Speed Mode o SDR52 MHz/DDR52 MHz/HS200/HS400 Form Factor o JEDEC R MO-276D Embedded Flash Memory o BGA 153 Ball BA type ( mm x 13 mm) Available Capacities o 8 GB to 32 GB Voltages o Memory Power (VCC): o Interface Power (VCCQ).

2 ECC o Internal Error Correction High Performance o HS400 (400 MB/s bus transfer rate) Temperature Ranges o -25 C ~+85 C 2. Ordering Information Part Number Capacity (GB) Dimension (mm) Form Factor T0008M1 VDB-F6B0 8 x 13 x BGA 153 ball T0016M1 VDB-F6B0 16 x 13 x BGA 153 ball T0032M1 VDB-F6B0 32 x 13 x BGA 153 ball * 1 GB=1,000,000,000 Bytes For latest ordering information, please consult BIG-INNO s sales. emmc MA110 Series Big Innovation Company Limited Page 2 of 36 Copyright 2017 BIG-INNO all rights reserved. 3. Contents 1.

3 Features 1 2. Ordering Information 1 3. Contents 2 4. General Description 3 System Performance 4 Power Consumption 4 Recommended Operating Conditions 4 5. Functional Block Diagram 5 6. Physical Dimensions 6 7. Electrical Interface 7 8. Product Features 10 Communication interface 10 Bus Operating Condition 11 9. Supported Features 12 Bootable 12 Partition 14 Sleep Mode 16 Sleep (CMD5) 16 Enhanced Write 17 Secure Erase 17 Secure Trim 17 Trim 17 Write Protection 17 Hardware Reset 17 Background Operations 18 High Priority Interrupt (HPI) 18 HS400 18 Discard Command 20 Sanitize 20 Extended partition types 20 Context ID Management 20 Data Tag 21 Packed Commands 21 Real Time Clock 21 Dynamic Device Capacity 21 Power Off Notification 21 Large Sector Size 21 Cache 22 10.

4 emmc Signals Connection and Layout Guideline 23 11. Register 25 OCR Register 25 CID Register 25 CSD Register 25 Extended CSD Register 26 14. Contact Information 36 emmc MA110 Series Big Innovation Company Limited Page 3 of 36 Copyright 2017 BIG-INNO all rights reserved. 4. General Description BIG-INNO MA110 Series is an emmc flash memory module that integrates a slim controller and NAND flash into a BGA package for various consumer electronics applications such as smart phones, Tablet PC, GPS, etc. BIG-INNO MA110 Series provides low power mode to greatly extend battery lifetime and to achieve high performance that makes it an ideal solution for multimedia handsets.

5 MA110 integrates advanced flash management technology to achieve balance between cost and performance. It works at 0-200 MHz frequency, with 1bit, 4bit and 8bit data bus width. BIG-INNO MA110 s various advantages such as high performance, capacity and reliability make it the best emmc storage solution for several consumer electronics devices such as mobile PC and personal handheld devices. emmc MA110 Series Big Innovation Company Limited Page 4 of 36 Copyright 2017 BIG-INNO all rights reserved. System Performance Table 1: System Performance Table System Performance Value Unit Sustained Sequential Read Rate 8 GB 190 MB/s Sustained Sequential Write Rate 35 MB/s 4KB Random Read IOPS 8635 IOPS 4KB Random Write IOPS 810 IOPS Sustained Sequential Read Rate 16 GB 225 MB/s Sustained Sequential Write Rate 120 MB/s 4KB Random Read IOPS 8925 IOPS 4KB Random Write IOPS 1445 IOPS Sustained Sequential Read Rate 32 GB 260 MB/s Sustained Sequential Write Rate 155 MB/s 4KB Random Read IOPS 9375 IOPS 4KB Random Write IOPS 1930 IOPS Note.

6 Performance is based on 8-bit HS200 mode Power Consumption Table 2: Power Consumption VCC VCCQ Active Power saving A A * All value are tested under room temperature 25 C @ Recommended Operating Conditions Table 3: Recommended Operating Conditions Parameter Value Operating Temperature -25 C to +85 C Temperature Gradient ( C per hour max, non-condensing) 20 C (operating) Temperature Gradient ( C per hour max, non-condensing) 30 C (non-operating) Power Supply Voltage (VCC) Power Supply Voltage (VCCQ) emmc MA110 Series Big Innovation Company Limited Page 5 of 36 Copyright 2017 BIG-INNO all rights reserved.

7 5. Functional Block Diagram Command, Data [7:0] Power, Ground, Clock, Reset e-MMC HostDeviceeMMC InterfacePower On Reset, RC RAMP rogram RAMData/Address BusMicro ControllerDMAECCF lash Control LogicNAND FlashProgram ROM Figure 1: Functional Block Diagram emmc MA110 Series Big Innovation Company Limited Page 6 of 36 Copyright 2017 BIG-INNO all rights reserved. 6. Physical Dimensions TOP BOTTOM Figure 2: Physical Dimensions Dimensions Unit Length mm Width 13 mm Thickness mm emmc MA110 Series Big Innovation Company Limited Page 7 of 36 Copyright 2017 BIG-INNO all rights reserved.

8 7. Electrical Interface Top View: BA Figure 3: TOP View 14 NCNCNCNCNCNCNCNCNCNCNCNCNCNC13 NCNCNCNCNCNCNCNCNCNCNCNCNCNC12 NCNCNCNCNCNCNCNCNCNCNCNCNCNC11 NCNCNCNCNCNC10 NCNCNCTXRFUNCVSSVCCNCNCNCNC9 NCNCNCRXVCCNCNCNC8 NCNCNCNCVSSNCNCNC7 NCNCNCVSSNCNCNCNC6 VSSDAT7 VCCQVCCNCCLKNCVSS5 DAT2 DAT6 NCNCVCCVSSDSVSSRST_nCM DVSSVCCQ4 DAT1 DAT5 VSSNCVCCQVCCQVSS3 DAT0 DAT4 NCNCNCNCNCNCNCNCNCNCNCVCCQ2 NCDAT3 VDDiNCNCNCNCNCNCNCNCNCVSSNC1 NCNCNCNCNCNCNCNCNCNCNCNCNCNC ABCDEFGHJKLMNP emmc MA110 Series Big Innovation Company Limited Page 8 of 36 Copyright 2017 BIG-INNO all rights reserved.

9 Table 4 153 Ball Pin and Signal Definition Pin Signal Type Description M6 CLK Input Clock: Each cycle directs a 1-bit transfer on the command and DAT lines. M5 CMD Input Command: A bidirectional channel used for device initialization and command transfers. Command has two operating modes: 1) Open-drain for initialization. 2) Push-pull for fast command transfer. A3 DAT0 I/O Data I/O0: Bidirectional channel used for data transfer. A4 DAT1 I/O Data I/O1: Bidirectional channel used for data transfer. A5 DAT2 I/O Data I/O2: Bidirectional channel used for data transfer.

10 B2 DAT3 I/O Data I/O3: Bidirectional channel used for data transfer. B3 DAT4 I/O Data I/O4: Bidirectional channel used for data transfer. B4 DAT5 I/O Data I/O5: Bidirectional channel used for data transfer. B5 DAT6 I/O Data I/O6: Bidirectional channel used for data transfer. B6 DAT7 I/O Data I/O7: Bidirectional channel used for data transfer. K5 RST_n Input Reset signal pin E6, F5, J10, K9 VCC Supply VCC: Flash memory I/F and Flash memory power supply. C6, M4, N4, P3, P5 VCCQ Supply VCCQ: Memory controller core and MMC interface I/O power supply. E7, G5, H10, K8, A6, C4, J5, N2, N5, P4, P6 VSS Supply VSS: Flash memory I/F and Flash memory ground connection.


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