High current inductor - Cooper Industries

1 Technical Data 4109 Effective October 2015 Supersedes August 2006 Product description Compact footprint Designed for high density, high current /low voltage applications Foil technology that adds higher reliability factor over the traditional magnet wire used for higher frequency circuit designs Frequency Range up to 1 MHzApplications Distributed power systems DC-DC converters General-purpose low voltage supplies Computer systems Servers Point of Load (POL) converters Industrial Equipment Networking/Telecom power suppliesEnvironmental data Storage temperature range (component): - 40 C to +125 C Operating temperature range: -40 C to +125 C (ambient + self-temperature rise). Solder reflow temperature: J-STD-020D compliantHC2 high current power inductorsPb2 Technical Data 4109 Effective October 2015HC2 high current power inductors specifications Part numberPart number (Tape and reel) OCL1 ( H) 20%lrms2 ampslsat3 ampsDCR ( )4 maximum @ 20 CVolt- sec5 (V- s)HC2-R47-R HC2-R47TR-R.

2 1. Open Circuit Inductance Test Parameters: 300kHz, Vrms, Adc2. DC current for an approximate temperature change of 40 C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125 C under worst case operating conditions verified in the end Peak current for approximately 30% Values @ 20 C5. Applied Volt-Time product (V- s) across the inductor . This value represents the applied V- s at 300 KHz neccessary to generate a core loss equal to 10% of the total losses for 40 C temperature mmPackaging information (mm)Bulk packaging: 45 parts per tray Tape and reel packaging: 110 parts per 13 diameter reelwwllyy RHC2-xxxAo= + + + direction of feedSECTION VIEWTOP VIEWSCHEMATIC2 RECOMMENDED PCB PAD LAYOUTHC2 - XXXwwllyy R13 Technical Data 4109 Effective October 2015HC2 high current power inductors lossIRMS DERATING WITH CORE LOSS100080060050040030020010080605040302 010% of Applied Volt- -Seconds99989796959492908070605040200% o f Losses from Irms (maximum)1 MHz500 KHz300 KHz200 KHz100 KHzINDUCTANCE VERSUS SATURATION CURRENT020406080100120140160180200010203 0405060708090100% of ISAT% of OCLE atonElectronics Division1000 Eaton BoulevardCleveland, OH 44122 United 2015 EatonAll Rights ReservedPrinted in USAP ublication No.

3 4109 October 2015 Eaton is a registered other trademarks are property of their respective current power inductors Technical Data 4109 Effective October 2015 Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an of cer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in signi cant injury to the reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this tsTC -5 CTime 25 C to Peak Time25 CTsminTsmaxTLTPP reheatAMax. Ramp Up Rate = 3 C/sMax. Ramp Down Rate = 6 C/sSolder reflow profileReference JDEC J-STD-020D Profile FeatureStandard SnPb SolderLead (Pb) Free SolderPreheat and Soak Temperature min.

4 (Tsmin)100 C150 C Temperature max. (Tsmax)150 C200 C Time (Tsmin to Tsmax) (ts)60-120 Seconds60-120 SecondsAverage ramp up rate Tsmax to Tp3 C/ Second C/ Second temperature (Tl) Time at liquidous (tL)183 C 60-150 Seconds217 C 60-150 SecondsPeak package body temperature (TP)*Table 1 Table 2 Time (tp)** within 5 C of the specified classification temperature (Tc)20 Seconds**30 Seconds**Average ramp-down rate (Tp to Tsmax)6 C/ Second C/ Second 25 C to Peak Temperature6 Minutes Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user 1 - Standard SnPb Solder (Tc)Package ThicknessVolume mm3 <350 Volume mm3 350< )235 C220 C C220 CTable 2 - Lead (Pb) Free Solder (Tc)Package ThicknessVolume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000< C260 C260 C250 C245 C> C245 C245 C