Transcription of Hole Size Measurement, Plated
1 ScopeTo measure the inside diameter of platedthrough holes in printed wiring Applicable Test SpecimenProduction board or test pattern,number and design of holes shall be determined by agree-ment between vendor and customer or applicable Stereoscopic microscopeWith 20x magnificationmicrometer scale eye piece and MeasurementSet the microscope on 20x magnifica-tion and measure the inside diameter of the hole from oneside to the other side at the largest Evaluation of testRecord measurements and note ifvoids and nodules were Institute for Interconnecting and Packaging Electronic Circuits2215 Sanders Road Northbrook.
2 IL 60062 IPC-TM-650 TEST METHODS Size Measurement, PlatedDate5/86 RevisionAOriginating Task GroupPrinted Board Test Methods Task Group (7-11d)Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory onlyand its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of thismaterial. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent referenced is for the convenience of the user and does not imply endorsement by the
