IPC-J-STD-001G: Requirements for Soldered Electrical and ...

1 IPC J-STD-001 GRequirements forSoldered Electrical andElectronic AssembliesDeveloped by the J-STD-001 Task Group (5-22a) of the Soldering Subcommittee (5-22) of the Assembly & Joining Committee (5-20) of IPCU sers of this publication are encouraged to participate in the development of future :IPCS upersedes:J-STD-001F WAM1 -February 2016J-STD-001F - July 2014J-STD-001E - April 2010J-STD-001D - February 2005J-STD-001C - March 2000J-STD-001B - October 1996J-STD-001A - April 1992If a conflict occursbetween the English andtranslated versions of thisdocument, the Englishversion will takeprecedence. Table of .. Units and Applications .. Verification of Dimensions .. of Requirements .. Hardware Defects and Process Indicators .. Material and Process Nonconformance .. Requirements .. of Precedence .. Conflict .. Clause References .. Appendices .. and Definitions .. Diameter .. Disposition .. Electrical Clearance.

2 FOD (Foreign Object Debris) .. High Voltage .. Manufacturer (Assembler) .. Objective Evidence .. Process Control .. Proficiency .. Solder Destination Side .. Solder Source Side .. Supplier .. User .. Wire Overwrap .. Wire Overlap .. Flowdown .. Personnel Proficiency .. Acceptance Requirements .. General Assembly Requirements .. Miscellaneous Requirements .. Health and Safety .. Procedures for Specialized Technologies .. 52 APPLICABLE .. Industry Standards .. Discharge Association .. Electrotechnical Commission .. International .. Standards .. 73 MATERIALS, COMPONENTS AND .. Solder Lead Free .. Solder Purity Maintenance .. Flux Application .. Paste .. Preforms .. Strippers .. Component and Seal Damage .. Coating Meniscus .. and Equipment .. 104 GENERAL SOLDERING AND Discharge (ESD) .. Controls .. and Humidity .. Assembly Operations.

3 Maintenance .. of Component Surface Finishes .. Removal .. Metallic Surface Finishes Removal .. Protection .. of Nonsolderable Parts .. Cleanliness Requirements .. Part Mounting Requirements .. Requirements .. Deformation Limits .. Obstruction .. Component Isolation .. Coverage Limits .. Mounting of Parts on Parts (Stacking ofComponents) .. 12 October 2017 IPC Connectors and Contact Areas .. Handling of Parts .. Preheating .. Controlled Cooling .. Drying/Degassing .. Holding Devices and Materials .. Machine (Nonreflow) Soldering .. Machine Controls .. Solder Bath .. Reflow Soldering .. Intrusive Soldering (Paste-in-Hole) .. Solder Connection .. Exposed Surfaces .. Solder Connection Anomalies .. Partially Visible or Hidden SolderConnections .. Shrinkable Soldering Devices .. 145 WIRES AND TERMINAL and Cable Preparation .. Damage .. Damage .. of Stranded Wire Forming.

4 Terminals .. , Turret and Slotted TerminalInstallation .. Damage .. Damage .. Flange Angles .. Mounting Mechanical .. Mounting Electrical .. Mounting Soldering .. to Terminals .. Requirements .. and Straight Pin Terminals .. Terminals .. Terminals .. Terminals .. or Perforated Terminals .. Cup and Hollow Cylindrical Terminals Placement .. to Terminals .. Terminals .. Terminal .. Cup and Hollow Cylindrical Terminals Soldering .. Wires .. Insulation .. Wire Routing .. Wire Staking .. Unpopulated Land or Via Lap Soldered .. Supported Holes .. SMT .. 236 THROUGH-HOLE MOUNTING Terminations General .. Lead Forming .. Termination Requirements .. Lead Trimming .. Interfacial Connections .. Coating Meniscus In Solder .. Holes .. Solder Application .. Through-Hole Component Lead Soldering .. Holes .. Lead Termination Requirements forUnsupported Holes.

5 277 SURFACE MOUNTING OF Mount Device Lead .. Plastic Components .. Forming .. Unintentional Bending .. Flat Pack Parallelism .. Surface Mount Device Lead Bends .. Flattened Leads .. Parts Not Configured for Surface Mounting .. Component Body Clearance .. Axial-Leaded Components .. Configured for Butt/I Lead Mounting .. of Surface Mount Components .. Requirements .. Misaligned Components .. Unspecified and Special Requirements .. Bottom Only Chip ComponentTerminations .. Rectangular or Square End ChipComponents 1, 2, 3 or 5 SideTermination(s) .. End Cap Terminations .. Terminations .. Gull Wing Leads .. Round or Flattened (Coined) GullWing Leads .. Lead Terminations .. 37 IPC J-STD-001 GOctober Butt/I Terminations .. Flat Lug Leads and Flat Unformed Leads .. Tall Profile Components Having BottomOnly Terminations .. Inward Formed L-Shaped Ribbon Leads .. Surface Mount Area Array Packages.

6 Bottom Termination Components (BTC) .. Components with Bottom Thermal PlaneTerminations (D-Pak) .. Flattened Post Connections .. P-Style Terminations .. SMT Terminations .. 508 CLEANING PROCESS Exemptions .. Cleaning .. Cleanliness .. Foreign Object Debris (FOD) .. Flux Residues and Other Ionic or OrganicContaminants .. Post-Soldering Cleanliness Designator .. Cleaning Option .. Test for Cleanliness .. Testing .. 529 PCB Circuit Board Damage .. Blistering/Delamination .. Weave Exposure/Cut Fibers .. Haloing .. Edge Delamination .. Land/Conductor Separation .. Land/Conductor Reduction in Size .. Flexible Circuitry Delamination .. Flexible Circuitry Damage .. Burns .. Non- Soldered Edge Contacts .. Measles .. Crazing .. and Twist (Warpage) .. 5410 COATING, ENCAPSULATION AND STAKING(ADHESIVE).. Coating Materials .. Coating Masking .. Coating Application.

7 Coating on Components .. Thickness .. Uniformity .. Transparency .. Bubbles and Voids .. Delamination .. Foreign Objects Debris .. Other Visual Conditions .. Inspection .. Rework or Touchup of Conformal Coating .. Encapsulation .. Application .. Performance Requirements .. Rework of Encapsulant Material .. Encapsulant Inspection .. Application .. Adhesive .. (Inspection) .. 5811 WITNESS (TORQUE/ANTI-TAMPERING) 5812 PRODUCT Methodology .. Verification Inspection .. Inspection .. Control Requirements .. Determination .. Process Control .. 6013 REWORK AND .. Rework/Repair Cleaning .. 61 APPENDIX AGuidelines for Soldering Toolsand 62 APPENDIX BMinimum Electrical Clearance Electrical Conductor 64 APPENDIX CJ-STD-001 Guidance onObjective Evidence ofMaterial 66 FiguresFigure 1-1 Overwrap .. 4 Figure 1-2 Overlap .. 4 Figure 4-1 Hole Obstruction .. 12 Figure 4-2 Acceptable Wetting Angles.

8 13 Figure 5-1 Insulation Thickness .. 15 October 2017 IPC J-STD-001 GixFigure 5-2 Flange Damage .. 16 Figure 5-3 Flare Angles .. 16 Figure 5-4 Terminal Mounting Mechanical .. 17 Figure 5-5 Terminal Mounting Electrical .. 17 Figure 5-6 Insulation Clearance Measurement .. 17 Figure 5-7 Service Loop for Lead Wiring .. 18 Figure 5-8 Cup and Hollow Cylindrical Terminal Solder Height .. 18 Figure 5-9 Wires on Intermediate Turret Terminal .. 18 Figure 5-10 Wire and Lead Placement .. 19 Figure 5-11 Bifurcated Terminal Side Route Placementwith Wrap .. 19 Figure 5-12 Bifurcated Terminal Side Route Placement Straight Though and Staked .. 20 Figure 5-13 Bifurcated Terminal Top and Bottom RouteConnection .. 20 Figure 5-14 Slotted Terminal .. 21 Figure 5-15 Hook Terminal Wire Placement .. 21 Figure 5-16 Acceptable Pierced or Perforated TerminalWire Placement .. 22 Figure 5-17 Solder Depression .. 22 Figure 5-18 Cup and Hollow Cylindrical Terminals Vertical Fill of Solder.

9 22 Figure 6-1 Component Lead Stress Relief Examples .. 24 Figure 6-2 Lead Bends .. 25 Figure 6-3 Lead Trimming .. 26 Figure 6-4 Vertical Fill Example .. 26 Figure 7-1 Surface Mount Device Lead Forming .. 28 Figure 7-2 Surface Mount Device Lead Forming .. 28 Figure 7-3 Bottom Only Terminations .. 31 Figure 7-4 Rectangular or Square End ChipComponents .. 32 Figure 7-5 Cylindrical End Cap Terminations .. 33 Figure 7-6 Castellated Terminations .. 34 Figure 7-7 Flat Gull Wing Leads .. 35 Figure 7-8 Round or Flattened (Coined) GullWing Leads .. 36 Figure 7-9J Leads .. 37 Figure 7-10 Butt/I Terminations for ModifiedThrough-Hole Leads .. 38 Figure 7-11 Butt/I Terminations for SolderCharged Leads .. 39 Figure 7-12 AFlat Lug Leads .. 41 Figure 7-12 BFlat Unformed Leads .. 41 Figure 7-13 Tall Profile Components Having BottomOnly Terminations .. 42 Figure 7-14 Inward Formed L-Shaped Ribbon Lead .. 43 Figure 7-15 BGA Solder Ball Clearance .. 45 Figure 7-16 Bottom Termination Component.

10 47 Figure 7-17 Bottom Thermal Plane Termination .. 48 Figure 7-18 Flattened Post Termination .. 49 Figure 7-19P-Style Termination .. 50 Figure 10-1 Radial Leaded Components whoseheight is greater than or equal totheir length or diameter IndividualRectangular Shaped Component .. 57 Figure 10-2 Radial Leaded Components whose heightis greater than or equal to their length ordiameter Individual Cylindrically ShapedComponent .. 57 TablesTable 1-1 Design, Fabrication and AcceptabilitySpecifications .. 3 Table 3-1 Maximum Limits of Solder BathContaminant .. 8 Table 4-1 Solder Anomalies .. 14 Table 5-1 Allowable Strand Damage .. 15 Table 5-2 Terminal Mounting Minimum SolderingRequirements .. 17 Table 5-3 Turret and Straight Pin Wire Placement .. 19 Table 5-4 AWG 30 and Smaller Wire WrapRequirements .. 19 Table 5-5 Bifurcated Terminal Wire Placement Side Route with Wrap .. 20 Table 5-6 Bifurcated Terminal Side RouteStraight-Through Staking Requirements .