IPC J-STD-006B with Amendments 1&2

1 IPC J-STD- 006b with Amendments 1&2 Requirements for ElectronicGrade Solder Alloys andFluxed and Non-FluxedSolid Solders for ElectronicSoldering ApplicationsDeveloped by the Solder Alloy Task Group (5-24c) of the Assemblyand Joining Processes Committee (5-20) of IPCU sers of this standard are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309 SBannockburn, IL 60015-1249 Phone (847) 615-7100 Fax (847) 615-7105 Supersedes:J-STD- 006b w/ amendment 1 -October 2008J-STD- 006b - January 2006 amendment 1 - June 2008J-STD-006A - May 2001J-STD-006 - January 1995 amendment 1 - July 1996 Table of Contents1 SCOPE AND .. Composition .. Impurity Level .. Form .. Characteristics .. Percentage and Metal Content.

2 Classification .. 12 APPLICABLE Industry Standards .. Standards Organization (ISO) .. Society for Testing and Materials(ASTM) .. of Precedence .. and Definitions .. *Acceptance Tests .. Metal .. *Dewetting .. *Flux .. Characterization .. Residue .. * Wetting, Solder3 .. Composition .. Impurities .. D Alloys .. Forms and DimensionalCharacteristics .. Solder .. Solder .. Solder .. Form Solder .. Solder Characteristics .. Cored Solder .. Spitting .. Coated Solder .. Characteristics .. Percentage .. Classification .. Pool .. Residue Dryness .. for Product Identification .. 54 QUALITY ASSURANCE for Inspection .. for Compliance .. Assurance Program.

3 Of Inspections .. Inspection .. Inspections .. Conformance Inspections .. Equipment and Inspection Facilities .. Conditions .. Routine .. Sampling .. of Solder Alloy for Test .. Cored Solder .. Solder Up to Approximately 6 mmDiameter .. Solder and Other Wire Solder .. Reporting .. 75 PREPARATION FOR , Packing, and Packaging .. 76 .. Alloys .. Bismuth-Containing and Bismuth-Based Alloys .. Alloys .. Alloys .. Alloys .. 7 October 2009 IPC J-STD- 006b with Amendments1& Indium-Containing and Indium-Based Alloys .. Lead-Free Alloys .. Silver-Containing Alloys .. Tin-Silver-Copper Alloys with orwithout Antimony .. Solder Product Packages .. and Ribbon Solders .. Solders.

4 Powder .. Spheres .. Description of SolidSolder Products .. Test for the Presence of Lead .. for Lead-Free and LeadedMarking, Symbols and Labels .. 8 Appendix A Solder 10 Appendix B Examples of Inspection 18 Appendix B-1 Test Report for Solder AlloyComposition and 18 Appendix B-2 Inspection Report for FluxedWire/Ribbon 19 Appendix B-3 Inspection Report for Non-Fluxed 20 Appendix B-4 Inspection Report for 21 FiguresFigure 6-1 Recommended Lead Free Marking Symbol .. 8 TablesTable 4-1 Requirements and Inspection Routine .. 6 Table A-1 Composition, and TemperatureCharacteristics of Lead-freeSolder Alloys .. 10 Table A-2 Composition and TemperatureCharacteristics of CommonTin-Lead Alloys .. 12 Table A-3 Composition and TemperatureCharacteristics for Specialty (non-Tin/Lead) Alloys.

5 14 Table A-4 Cross-Reference from Solidus andLiquidus Temperatures to AlloyNames by Temperature .. 15 Table A-5 Cross-Reference from ISO 9453 Alloy Numbers and Designationsto J-STD-006 Alloy Names .. 17 IPC J-STD- 006b with Amendments1&2 October 2009iiRequirements for Electronic Grade Solder Alloysand Fluxed and Non-Fluxed Solid Soldersfor Electronic Soldering Applications1 SCOPE AND ScopeThis standard prescribes the nomenclature,requirements and test methods for electronic grade solderalloys; for fluxed and non-fluxed bar, ribbon, and powdersolders, for electronic soldering applications; and for spe-cial electronic grade solders. This is a quality control stan-dard and is not intended to relate directly to the material sperformance in the manufacturing process.

6 Solders forapplications other than electronics should be procuredusing ASTM standard is one of a set of three joint industry stan-dards that prescribe the requirements and test methods forsoldering materials for use in the electronics industry. Theother two joint industry standards are:IPC/EIA J-STD-004 Requirements for Soldering FluxesIPC/EIA J-STD-005 Requirements for Soldering PastesAdditionally, marking requirements for lead-free materialsand assemblies is addressed in this document by directapplication of text from IPC/JEDEC J-STD-609,Lead-Free and Leaded Marking, Symbols and Labels(see ). ClassificationSoldering alloys covered by this stan-dardshallbe classified by alloy composition and impuritylevel, solder form and dimensional characteristics peculiarto the solder form, flux percentage and flux classification,if applicable.

7 These classificationsshallbe used as part ofthe standard description of solder products (see ). Alloy CompositionThe solder alloys covered bythis standard include, but are not limited to, the alloyslisted in Appendix A, including pure tin and pure alloy is identified by an alloy name, which is com-posed of a series of alphanumeric characters that identifythe component elements in the alloy by chemical symboland nominal percentage by Alloy Impurity LevelThe allowable impurity levelof the solder alloys covered by this standard is identified See for the description of Variation D alloys. Thealloy variation letter D is added to the end of an alloy nameand becomes part of the alloy s Solder FormThe forms of solder materials cov-ered by this set of standards include paste (cream), bar,powder, ribbon, wire and special electronic grade solderswhich do not fully comply with the requirements of stan-dard solder alloys and forms listed herein.

8 Some examplesof special form solders are anodes, ingots, preforms, barswith hook and eye ends, and multiple-alloy solder single-letter identifying symbol as defined below may Paste (Cream)B BarD PowderR RibbonW WireS SpecialH Dimensional CharacteristicsStandard bar soldersare further classified by unit mass. Wire solders are furtherclassified by wire size (outside diameter) and unit solders are further classified by thickness, widthand unit mass. Powder solders are further classified bypowder particle size distribution and unit mass (see ). Flux Percentage and Metal ContentThe nominalpercentage of flux by mass in solid-form solder productsshallbe specified. For solder paste products, metal contentshallbe specified instead.

9 Metal content refers to thepercentage of metal in solder paste by mass (see ). Flux ClassificationThe material of composition,activity level and halide content of fluxes covered by thisset of standardsshallbe specified according to APPLICABLE DOCUMENTSThe following documents form a part of this standard tothe extent specified herein. Unless a specific issue is citedherein or in the contract or purchase order, the issue ineffect on the date of invitation for bids or request for Joint Industry Standards1 IPC/EIA J-STD-004 Requirements for Soldering FluxesIPC/EIA J-STD-005 Requirements for Soldering Pastes1. 2009 IPC J-STD- 006b with Amendments1&21