Example: tourism industry
IPC/JEDEC J-STD-033B - researchmfg.com
IPC/JEDEC J-STD-033B . 第四章. Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Device （潮濕/迴流敏感性表面貼著元件的處理、包裝、運送和使用標準） 4. 乾燥. 下面兩個表格是針對各類濕敏等級以及暴露於大氣濕度 ≦60% RH 情況下
Tags:
Information
Domain:
Source:
Link to this page:
Related documents
Supersedes IPC/JEDEC J-STD-033B October 2005 JOINT ...
www.surfacemountprocess.comIPC/JEDEC J-STD-033B.1 Includes Amendment 1 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices A joint standard developed by the JEDEC JC-14.1 Committee on Reliability Test Methods for Packaged Devices and the B-10a Plastic Chip Carrier Cracking Task Group of IPC Users of this standard are encouraged to ...
IPC/JEDEC J-STD-020C Moisture/Reflow Sensitivity ...
ferroxcube.home.plIPC/JEDEC J-STD-020 Revision C Proposed Standard for Ballot January 2004 4 3.7 Weighing Apparatus (Optional) Weighing apparatus capable of weighing the package to a resolution of 1 microgram. This apparatus must be maintained in a draft-free environment, such as a cabinet.
IPC/JEDEC J-STD-020D - ElecFans
file.elecfans.comIPC/JEDEC J-STD-020D Issue 3 Page 6 of 8 Appendix 1 – Capacitor Photographs The following photographs have been taken after the moisture soak and 3x reflow processes and are representative of the capacitors subjected to the moisture/ reflow sensitivity classification tests. 0603 C0G J Termination Ref 1. Final External Visual Ref 2.
Moisture/Reflow Sensitivity Classification for Nonhermetic ...
www.ipc.orgIPC/JEDEC J-STD-020E Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices A joint standard developed by the IPC Plastic Chip Carrier Cracking Task Group (B-10a) and the JEDEC JC-14.1 Committee on Reliability Test Methods for Packaged Devices Users of this standard are encouraged to participate in the
Handling, Packing, Shipping and Use of Moisture, Reflow ...
www.ipc.orgIPC/JEDEC J-STD-033D Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices A joint standard developed by the JEDEC JC-14.1 Committee on Reliability Test Methods for Packaged Devices and the B-10a Plastic Chip Carrier Cracking Task Group of IPC Users of this publication are encouraged to participate in the
Charged Device Model (CDM) Qualification Issues - JEDEC
www.jedec.orgT J B1 B2 B3 H1 H2 H3 G1 G2 G3 R LS N (479) s Launch year Next socket target ... • Discrepancy between JEDEC and ESDA testers • Rel. Humidity during testing not controlled/recorded 00 0000 00 0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8 2,0 M M M M M M M M M M based on 11.6 billion devices e
JEDEC STANDARD - Computer Action Team
web.cecs.pdx.eduthe JEDEC standards or publications. The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC …
JEDEC STANDARD - Designer’s Guide
designers-guide.orgJ-STD-020, Joint IPC/JEDEC Standard, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface-Mount Devices. JP-001, Foundry Process Qualification Guidelines (Wafer Fabrication Manufacturing Sites). JESD22 Series, Reliability Test Methods for Packaged Devices
Reflow Soldering Profile, Per J-STD-020D, Table 5-2, Pb ...
www.diodes.comReflow Soldering Profile, Per J-STD-020D, Table 5-2, Pb-Free Devices. February 2019 Diodes Incorporated S 1-408-232-100 T 88-3-4518888 www.diodes.com RE)L: All specifications are subMect to change without notice. iodes ncorporporated A product ine of Diodes Incorporated ...