Transcription of IPC-TM-650 TEST METHODS MANUAL (D-33a)
1 1 ScopeThis test method uses pressure sensitive tape todetermine the adhesion quality of platings, marking inks orpaints, and other materials used in conjunction with Applicable DocumentsCommercial Item Description (CID) A-A-113 Tape, Pres-sure Sensitive, Test SpecimensAny preproduction, first article, or pro-duction printed board. A minimum of three tests should beperformed for each Apparatus or TapeA roll of pressure sensitive tape 3M Brand 6001/2 inch wide or a tape as described in (CID AA-113), Type 1,Class B, except that the tape may be clear. The shelf life ofthe tape is one TestPress a strip of pressure sensitive tape, 50 mm[ in] minimum in length, firmly across the surface of the testarea removing all air entrapment.
2 The time between applica-tion and removal of tape shall be less than one the tape by a rapid pull force applied approximatelyperpendicular (right angle) to the test area. An unused strip oftape must be used for each EvaluationVisually examine tape and test area for evi-dence of any portion of the material tested having beenremoved from the ReportThe report should note any evidence of materialremoved by this plating overhang breaks off (slivers) and adheres to thetape, it is evidence of overhang but not an adhesion foreign material (oil, grease, etc.) is present on the testsurface the results may be of 3M Brand 600 1/2 inch tape to CID-A-A-113 is not required. The 3M Brand 600 1/2 inch tape is avail-able through most office supply Sanders RoadNorthbrook, IL 60062-6135 IPC-TM-650 TEST METHODS , Tape TestingDate05/04 RevisionEOriginating Task GroupRigid Printed Board Performance Task Group (D-33a) Material in this Test METHODS MANUAL was voluntarily established by Technical Committees of IPC.
3 This material is advisory onlyand its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of thismaterial. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent referenced is for the convenience of the user and does not imply endorsement by CONNECTINGELECTRONICS INDUSTRIES
