IR Sensor Module for Remote Control Systems - …

1 Semiconductors Rev. , 26-Apr-20181 Document Number: 82478 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT Sensor Module for Remote Control SystemsDESIGN SUPPORT TOOLSMECHANICAL DATAP inning:1, 4 = GND, 2 = VS, 3 = carrier OUTORDERING CODET aping:TSMP77000TT - top view tapedTSMP77000TR - side view tapedFEATURES Photo detector and preamplifier in one package AC coupled response from 20 kHz to 60 kHz, all data formats Improved shielding against electrical field disturbance TTL and CMOS compatibility Output active low Supply voltage V to V, typically the device works in the range between V and V Carrier out signal for code learning functions Material categorization.

2 For definitions of compliance please see TSMP77000 is a two lens miniaturized Sensor for receiving various kinds of modulated IR signals. Two PIN diodes and a preamplifier are assembled on a lead frame, the epoxy package is designed as an IR filter. The modulated output signal, carrier out, can be used for code learning component has not been qualified according to automotive specifications. BLOCK DIAGRAMAPPLICATION CIRCUIT123420953123420953click logo to get startedAvailableModelsPARTS TABLEC arrier frequency20 kHz to 60 kHzTSMP77000 PackageHeimdallPinning1, 4 = GND, 2 = VS, 3 = carrier OUTD imensions (mm) W x H x DMountingSMDA pplicationCode learningTIAAmpSignal shaping3 Carrier out19746-31, 4 GND2 VSC1= FTSMP xxxx OUT GND Circuit CR1 = 100 + VSGNDT ransmitte r with TSAL xxxx VSV O 19750-2R2 = k R1 + C1 recommended to suppress power supply recommended to get faster slopes and a correct high level of the output Semiconductors Rev.

3 , 26-Apr-20182 Document Number: 82478 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliabilityTYPICAL CHARACTERISTICS (Tamb = 25 C, unless otherwise specified)Fig.

4 1 - TestsignalABSOLUTE MAXIMUM RATINGS (Tamb = 25 C, unless otherwise specified)PARAMETERTEST CONDITIONSYMBOLVALUEUNITS upply voltage (pin 2) to +6 VOutput voltage (pin 3) to (VS + )VOutput current (pin 3)IO5mAJunction temperatureTj100 CStorage temperature rangeTstg-25 to +85 COperating temperature rangeTamb-25 to +85 CELECTRICAL AND OPTICAL CHARACTERISTICS CARRIER OUT (Tamb = 25 C, unless otherwise specified, VS = 3 V)PARAMETERTEST current (pin 2)Ev = distanceEv = 0, test signal see Fig. 1,IR diode TSAL6200, IF = 400 mAd-5-mOutput voltage low (pin 3)IOSL = mA, test signal see Fig.

5 1 VOSL--250mVMinimum irradianceVS = 3 V, (20 kHz to 60 kHz)Ee irradianceTest signal see Fig. 1, (20 kHz to 60 kHz)Ee of half transmission distance 1/2- 50- degOutput accuracyfC = 20 kHz to 60 kHz,Ee = 25 mW/m2 to 50 W/m2,test signal see Fig. 1, BER 2%Ncarrier pulsesInput burst length- 1 cycleInput burst lengthInput burst length+ 1 cyclecountsCarrier cycle( s in case of 38 kHz)Delay time tdOptical burst(input signal)Output Semiconductors Rev. , 26-Apr-20183 Document Number: 82478 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT 2 - Relative Spectral Sensitivity vs.

6 WavelengthFig. 3 - Horizontal DirectivityFig. 4 - Vertical Directivity - Wavelength (nm)S( )rel - Relative Spectral 30 10 20 40 50 60 70 80 drel - Relative Transmission 30 10 20 40 50 60 70 80 drel - Relative Transmission Semiconductors Rev. , 26-Apr-20184 Document Number: 82478 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT DIMENSIONS in millimetersASSEMBLY INSTRUCTIONSR eflow Soldering Reflow soldering must be done within 72 h while stored under a max.

7 Temperature of 30 C, 60 % RH after opening the dry pack envelope Set the furnace temperatures for pre-heating and heating in accordance with the reflow temperature profile as shown in the diagram. Exercise extreme care to keep the maximum temperature below 260 C. The temperature shown in the profile means the temperature at the device surface. Since there is a temperature difference between the component and the circuit board, it should be verified that the temperature of the device is accurately being measured Handling after reflow should be done only after the work surface has been cooled offManual Soldering Use a soldering iron of 25 W or less.

8 Adjust the temperature of the soldering iron below 300 C Finish soldering within 3 s Handle products only after the temperature has cooled off x = (4 x) (1) ( ) ( )( ) ( )3 Pick and place areaProposed pad layoutfrom component side(for reference only)technical drawingsaccording to DINspecificationsNot indicated tolerances : : 4; areaTool separation line( )( ) x = (3 x)Mold residueMold Semiconductors Rev. , 26-Apr-20185 Document Number: 82478 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT LEAD (Pb)-FREE REFLOW SOLDER PROFILETAPING VERSION DIMENSIONS in millimetersmax.

9 120 smax. 100 smax. 20 sMax. ramp up 3 C/smax. 260 C101001000100000501002503000300 Axis Title2nd lineTemperature ( C)Time (s)25020015010050200150245 C217 C240 C255 CMax. ramp down 6 C/sMax. 2 cycles allowed19800 Drawing-No.: : 2; min. of drawingsaccording to Semiconductors Rev. , 26-Apr-20186 Document Number: 82478 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT VERSION DIMENSIONS in : : 4; drawingsaccording to DINspecificationsDirection of Semiconductors Rev.

10 , 26-Apr-20187 Document Number: 82478 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT DIMENSIONS in millimetersLEADER AND TRAILER DIMENSIONS in millimetersCOVER TAPE PEEL STRENGTHA ccording to DIN EN N to N300 mm/min. 10 to 180 peel angleLABELS tandard bar code labels for finished goodsThe standard bar code labels are product labels and used for identification of goods. The finished goods are packed in final packing area. The standard packing units are labeled with standard bar code labels before transported as finished goods to warehouses.