Transcription of IT-170GRA1 Data sheet rev 1.0-17 Data Sheet - 聯茂電子
1 !IT-170 GRA1 High Tg / Halogen Free / Mid-Loss Laminate & Prepreg Halogen free, High-Tg (180oC) Lower Dk (< @ 10 GHz) and low Df (< @ 10 GHz) Compatible with High Tg standard FR-4 processes High thermal & CAF resistance reliability Laminate properties ItemsIPC TM-650 Typical ValueUnitPeel Strength, minimum profile copper foil B. Standard profile copper ~ ~ > 1010M -cmSurface > 1010M Moisture Absorption, < (Dk, 50% resin content) A. 1 GHz B. 2 GHz C. 5 GHz D. Tangent (Df, 50% resin content) A. 1 GHz B. 2 GHz C. 5 GHz D. Flexural Strength, minimum A. Length direction B. Cross 400-430N/mm2 Thermal Stress 10 s at 288 C A. Unetched B. PassRating FlammabilityUL94N/ARating Glass Transition Temperature(DSC) CDecomposition CX/Y Axis CTE (40 C to 125 C) C! DRAFT REV !Z-Axis CTE A. Alpha 1 B. Alpha 2 C. 50 to 260 Degrees 210 C ppm/ C %Thermal Resistance A. T260 B. T288 >60 >60 Minutes Minutes! DRAFT REV
