DLP5500 DLP 0.55 XGA Series 450 DMD datasheet (Rev. G)

1 ProductFolderSample &BuyTechnicalDocumentsTools &SoftwareSupport &CommunityDLP5500 DLPS013F APRIL2010 REVISEDMAY2015 DLP5500 DLP XGA Series450 DMD1 Features2 Applications1 Industrial 1024 768 Arrayof Aluminum,Micrometer- 3D Scannersfor MachineVisionand QualitySizedMirrors(XGAR esolution)Control m MicromirrorPitch 3D Printing 12 MicromirrorTilt Angle DirectImagingLithography(Relativeto Flat State) LaserMarkingand Repair Designedfor CornerIllumination Industrialand MedicalImaging Designedfor Use WithBroadbandVisibleLight MedicalInstrumentation(420nm 700 nm): DigitalExposureSystems WindowTransmission97%(SinglePass, MedicalThroughTwo WindowSurfaces) Opthamology MicromirrorReflectivity88% 3D Scannersfor Limband SkinMeasurement ArrayDiffractionEfficiency86% HyperspectralImaging ArrayFill Factor92% Displays 16-Bit,Low VoltageDifferentialSignaling(LVDS) 3D ImagingMicroscopesDoubleDataRate(DDR)Inp utDataBus Intelligentand AdaptiveLighting 200 MHzInputDataClockRate DedicatedDLPC200 Controllerfor High-Speed3 DescriptionPatternRates.

2 Featuringover750000micromirrors,thehigh 5,000Hz (1-BitBinaryPatterns)resolutionDLP5500( "XGA)digitalmicromirrordevice(DMD)is a spatiallightmodulator(SLM)that 500 Hz (8-BitGrayscalePatterns)modulatesthe amplitude,direction,and/orphaseof Series450 advancedlight controltechnology ThermalArea18 mm 12 mm EnablingHighhas numerousapplicationsin the industrial,medical,on ScreenLumens(>2000lm)and 3D printingapplications. 149 MicroPin Grid ArrayRobustElectricalConnectionDeviceInf ormation(1) PackageMatesto AmphenolInterConPARTNUMBERPACKAGEBODYSIZ E(NOM) (149) (1) For all availablepackages,see the orderableaddendumatthe end of the TypicalApplicationSchematic1An IMPORTANTNOTICEat the end of this datasheetaddressesavailability,warranty, changes,use in safety-criticalapplications,intellectual propertymattersand APRIL2010 275 Applicationand Description(continued).. Pin Configurationand Deviceand Mechanical,Packaging,and RevisionHistoryChangesfromRevisionE (September2013)to RevisionFPage AddedESDR atings,FeatureDescriptionsection,DeviceF unctionalModes,Applicationand Implementationsection,PowerSupplyRecomme ndationssection,Layoutsection,Deviceand DocumentationSupportsection,andMechanica l,Packaging,and ChangedIncorrectVCC2valuefrom9V to ChangedLVDS clockto200 MHz- previouslyincorrectlylistedas 150 AddedMax RecommendedDMDT emperature ChangedIncorrecttCvaluefrom4 ns to 5 ns (200 MHzclock).

3 11 to ns (200 MHzclock)..11 ChangedSCPBus AddedLVDS& SCPR iseand Fall MovedtheMechanicalsectionfromRecommended OperatingConditionstableto ChangedMicromirrorArrayPhysicalCharacter isticsFigureto genericimage(M x N)..16 Changedspecularreflectivitywavelengthran geto 420 - 700 nm (from400 - 700 nm) to ChangedMicromirrorLandedOrientationand Tilt Figureto genericimage(M x N)..182 SubmitDocumentationFeedbackCopyright 2010 2015, APRIL2010 REVISEDMAY2015 RevisionHistory(continued) ChangedMicromirrorArray,Pitch,HingeAxis OrientationFigureto genericimage(M x N)..22 ChangedMicromirrorStates:On, Off, Flat Figureto ChangedTestPointlocationsfromTC1 & TC2 to TP1 - TP5 ..25 ChangedTestPointlocationDiagramto showTP1 - AddedMicromirrorLanded- Replaced"DAD" with "DLPA200"..31 ChangesfromRevisionD (October2012)to RevisionEPage Deletedthe DevicePart (June2012)to RevisionDPage Changedthe DevicePart NumberNomenclatureFrom: DLP5500 FYATo: UpdatedMechanicalICD to V2 with a minorchangein the (Spetember2011)to RevisionCPage Addedthe PackageFootprintand Socketinformationin the Featureslist.

4 1 Deletedredundantinformationfromthe Changedthe IlluminationpowerdensityMax valueof <420 mm From:20 To: 2 ChangedStoragetemperaturerangeand humidityvaluesin AddedOperatingCaseTemperature,OperatingH umidity,OperatingDeviceTemperatureGradie ntand OperatingLandedDuty-Cycleto AddedMirrormetalspecularreflectivityand Illuminationoverfillvaluesto "MicromirrorArrayOpticalCharacteristics" Correctedthe CL2W, Qarrayand Tarrayvaluesin MicromirrorArrayTemperatureCalculationfo r 26 Correctedthe documentreferencein (June2010)to RevisionBPage Changedthe : Addedtablenote"At a wavelengthof "..17 ChangesfromOriginal(April2010)to RevisionAPage ChangedVREFto Added|VID| to the absolutemax AddedVMBRSTto the absolutemax Changedthe IlluminationpowerdensityMax valueof <420 mm From:2 To: 20 2010 2015,TexasInstrumentsIncorporatedSubmitD ocumentationFeedback3 ProductFolderLinks.

5 DLP5500 DLP5500 DLPS013F APRIL2010 Description(continued)The XGAresolutionhas the directbenefitof scanninglargeobjectsfor 3D operationof the DLP5500requiresthat it be usedin conjunctionwith the DLPC200digitalcontrollerand the robust,highresolutionXGA,and Pin Configurationand FunctionsFYAP ackage149-PinCPGAS eries450 BottomViewPin FunctionsPIN(1)TYPEDATAINTERNALTRACESIGN ALCLOCKDESCRIPTION(I/O/P)RATE(2)TERM(3)( mils)(4) A(LVDS)D_AN9C20 InputLVCMOSDDRD ifferentialDCLK_A687D_AP9D20 InputLVCMOSDDRD ifferentialDCLK_A715D_AN11B18 InputLVCMOSDDRD ifferentialDCLK_A715D_AP11A18 InputLVCMOSDDRD ifferentialDCLK_A732D_AN13A20 InputLVCMOSDDRD ifferentialDCLK_A686D_AP13B20 InputLVCMOSDDRD ifferentialDCLK_A715D_AN15B19 InputLVCMOSDDRD ifferentialDCLK_A700D_AP15A19 InputLVCMOSDDRD ifferentialDCLK_A719(1)The followingpowersuppliesare requiredto operatethe DMD:VCC,VCCI, be connected.(2)DDR= theTimingRequirementsfor specificationsand relationships.

6 (3)RefertoElectricalCharacteristicsfor differentialterminationspecification.(4) InternalTraceLength(mils)refersto the theDLP (DLPZ004) fordetailsregardingsignalintegrityconsid erationsfor 2010 2015, APRIL2010 REVISEDMAY2015 Pin Functions(continued)PIN(1)TYPEDATAINTERN ALTRACESIGNALCLOCKDESCRIPTION(I/O/P)RATE (2)TERM(3)(mils)(4) B(LVDS)D_BN9P20 InputLVCMOSDDRD ifferentialDCLK_B687D_BP9N20 InputLVCMOSDDRD ifferentialDCLK_B715D_BN11R18 InputLVCMOSDDRD ifferentialDCLK_B702D_BP11T18 InputLVCMOSDDRD ifferentialDCLK_B719D_BN13T20 InputLVCMOSDDRD ifferentialDCLK_B686D_BP13R20 InputLVCMOSDDRD ifferentialDCLK_B715D_BN15R19 InputLVCMOSDDRD ifferentialDCLK_B680D_BP15T19 InputLVCMOSDDRD ifferentialDCLK_B700 DCLK_AND19 InputLVCMOS-Differential 700 Inputdatabus A Clock(LVDS)DCLK_APE19 InputLVCMOS-Differential 728 DCLK_BNN19 InputLVCMOS-Differential 700 Inputdatabus B Clock(LVDS)DCLK_BPM19 InputLVCMOS-Differential 728 DATACONTROLINPUTSSCTRL_ANF20 InputLVCMOSDDRD ifferentialDCLK_A716 SCTRL_APE20 InputLVCMOSDDRD ifferentialDCLK_A731 DataControl(LVDS)SCTRL_BNL20 InputLVCMOSDDRD ifferentialDCLK_B707 SCTRL_BPM20 InputLVCMOSDDRD ifferentialDCLK_B722 SERIALCOMMUNICATION(SCP)

7 ANDCONFIGURATIONSCP_CLKA8 InputLVCMOS Pull-Down SCP_DOA9 OutputLVCMOS SCP_CLK SCP_DIA5 InputLVCMOS Pull-DownSCP_CLK SCP_ENB7 InputLVCMOS Pull-DownSCP_CLK PWRDNB9 InputLVCMOS Pull-Down MICROMIRRORBIASCLOCKINGPULSEMODE_AA4 InputLVCMOS Pull-Down MBRST0C3 InputAnalog MBRST1D2 InputAnalog MBRST2D3 InputAnalog MBRST3E2 InputAnalog MBRST4G3 InputAnalog MBRST5E1 InputAnalog MicromirrorBiasMBRST6G2 InputAnalog ClockingPulse"MBRST"signalsMBRST7G1 InputAnalog "clock"micromirrorsMBRST8N3 InputAnalog into stateof LVCMOS memorycell associatedMBRST9M2 InputAnalog with MBRST11L2 InputAnalog MBRST12J3 InputAnalog MBRST13L1 InputAnalog MBRST14J2 InputAnalog MBRST15J1 InputAnalog Copyright 2010 2015,TexasInstrumentsIncorporatedSubmitD ocumentationFeedback5 ProductFolderLinks: DLP5500 DLP5500 DLPS013F APRIL2010 Functions(continued)PIN(1)TYPEDATAINTERN ALTRACESIGNALCLOCKDESCRIPTION(I/O/P)RATE (2)TERM(3)(mils)(4) ,B12,B13,B16,R12,Powerfor LVCMOSVCCP owerAnalog R13,R16,R1 Logic7A12,A14,A1 Powersupplyfor LVDSVCCI6,T12,T14,TPowerAnalog Interface16C1,D1,M1,NPowerfor HighVoltageVCC2 PowerAnalog 1 CMOSL ogicA6,A11,A13,A15,A17,B4,B5,B8,B14,B15, B17,C2,C18,C19,F1,F2,F19,H1 Commonreturnfor allVSS,H2,H3,H18,PowerAnalog powerinputsJ18,K1,K2,L19,N2,P18,P19,R4,R 9,R14,R15,T7,T13,T15,T17 RESERVEDSIGNALS(Notfor use in system)

8 RESERVED_R7R7 InputLVCMOS Pull-Down RESERVED_R8R8 InputLVCMOS Pull-Down Pinsshouldbeconnectedto VSSRESERVED_T8T8 InputLVCMOS Pull-Down RESERVED_B6B6 InputLVCMOS Pull-Down A3, A7,A10,B2,B3, B10,E3, F3, K3,L3, P1, P2,P3, R1, R2,NO_CONNECT DO NOTCONNECT R3, R5, R6,R10,R11,T1, T2, T3,T4, T5, T6,T9, T10,T116 SubmitDocumentationFeedbackCopyright 2010 2015, APRIL2010 REVISEDMAY20158 (unlessotherwisenoted)(1)MINMAXUNITELECT RICALVCCV oltageappliedto VCC(2)(3) VCCI(2)(3) |VCC VCCI|(4) ,Damagecan occurto internalresistorif exceeded,|VID|700mVSee Figure6 VCC2 Voltageappliedto VOFFSET(2)(3)(4) MBRST[0:15]InputPins 2828 VVoltageappliedto all otherpins(2) + high-levelIOHVOH= V 20mAoutputCurrentrequiredfroma low-levelIOLVOL= V15mAoutputENVIRONMENTALC asetemperature:operational(5) (6) 2090 CTCASEC asetemperature:non operational(6) 4090 CDewPoint(Operatingand non-Operating)81 C(1)StressesbeyondthoselistedunderAbsolu teMaximumRatingsmay causepermanentdamageto the stressratingsonly,whichdo not implyfunctionaloperationof the deviceat theseor any otherconditionsbeyondthoseindicatedunder RecommendedOperatingConditions.

9 Exposureto absolute-maximum-ratedconditionsfor extendedperiodsmay affectdevicereliability.(2)All voltagesreferencedto VSS(ground).(3)VoltagesVCC, VCCI, and VCC2are requiredfor properDMDoperation.(4)Exceedingthe recommendedallowableabsolutevoltagediffe rencebetweenVCCand VCCImay resultin VCCI, | VCC- VCCI|, shouldbe less (5)Exposureof the DMDsimultaneouslyto any combinationof the maximumoperatingconditionsfor casetemperature,differentialtemperature, or illuminationpowerdensity(seeRecommendedO peratingConditions).(6)DMDT emperatureis the worst-caseof any test pointshownin Figure15, or the activearrayas calculatedby DMDis installedin the final productMINMAXUNITTstgDMDstoragetemperatu re 4080 CStorageDewPoint- long-term(1)24 TDPS toragedew point CStorageDewPoint- short-term(2)28(1)Long-termis definedas the usablelife of the device.(2)Dewpointsbeyondthe specifiedlong-termdew pointare for short-termconditionsonly,whereshort-term is definedas less than60cumulativedaysoverthe usablelife of the device(operating,non-operating,or storage).

10 LVCMOS[I/O] pins(1) 2000 Humanbodymodel(HBM),per ANSI/ESDA/JEDECJS-001,all other 2000V(ESD)ElectrostaticdischargeVpins [power,controlpins]exceptMBRST(2)Electro staticdischargeimmunityfor MBRST[0:15]pins(1)<250(1)Testedin accordancewith JESD22-A114-BElectrostaticDischarge(ESD) sensitivitytestingHumanBodyModel(HBM).(2 )JEDEC documentJEP155statesthat 500-VHBM allowssafe manufacturingwith a 2010 2015,TexasInstrumentsIncorporatedSubmitD ocumentationFeedback7 ProductFolderLinks: DLP5500 DLP5500 DLPS013F APRIL2010 (unlessotherwisenoted)MINNOMMAXUNITSUPPL YVOLTAGES(1) (2)VCCS upplyvoltagefor |VCCI VCC|Supplyvoltagedelta(absolutevalue)(3) (4) + levelInputvoltage(4) VOH= V 20mAIOLLow leveloutputcurrentat VOL= V15mATPWRDNZPWRDNZ pulsewidth(5)10nsSCPINTERFACE clockSCPclockfrequency(6)500kHztSCP_SKEW T imebetweenvalidSCPDIand risingedgeof SCPCLK(7) 800800nstSCP_DELAYT imebetweenvalidSCPDOand risingedgeof SCPCLK(7)700nstSCP_BYTE_INTERVALT imebetweenconsecutivebytes1 stSCP_NEG_ENZT imebetweenfallingedgeof SCPENZand the first risingedgeof SCPCLK30nstSCP_PW_ENZSCPENZ inactivepulsewidth(highlevel)1 stSCP_OUT_ENTimerequiredfor SCPoutputbufferto recoverafterSCPENZ(fromtri-state) clockSCPcircuitclockoscillatorfrequency( 8) (1)SupplyvoltagesVCC,VCCI,VOFFSET,VBIAS, and VRESETare all requiredfor be connected.