LATENT CURING AGENTS AND ACCELERATORS …

1 2601-00-20-01 LATENT CURING AGENTS AND ACCELERATORSFOR EPOXY RESINA jinomoto Fine-Techno Co.,Inc. Functional Chemicals +81-44-221-2372 Fax +81-44-221-2387 02/9(2)T-E1-4 99/2(1), LABPRODUCTS tructure typeParticle sizeMelting point (C)Recommended usage *Special featureav. (micron)(softening point)as hardeneras acceleratorPN-23 Amine adduct10-12100-10515-251-5 Low temp. rapid cure. accelerator for adduct11-13120-12515-251-5 Modified PN-23 for longer pot adduct10-12115-12015-251-5 Modified PN-23 for longer pot adduct10-12105-11015-251-5 Modified PN-23 for longer pot adduct2-4100-10515-251-5 Micropulverized PN-23. Faster adduct 2-4115-12015-251-5 Micropulverized PN-31. Faster adduct2-4105-11015-251-5 Good tranparency and adduct8-10115-12015-251-5 Good adhision. accelerator for acidanhydrideMY-HAmine adduct8-10125-13015-251-5 Modified MY-24 for longer pot adduct2-4125-13015-251-5 Micropulverized MY-HAH-203 Amine adduct10-12115-12015-251-5 Modified MY-24.

2 Faster complex-15100-11515-251-5 Modified PN-23. Lower price type of complex-15200-2109-Accelerated DICY. AH-162 DICY complex-15200-21011-Accelerated DICY. Long pot pass12041-Colorless transparent cured product>98%Can be used as a crosslinking agent for aclylicVDH-JDihydrazide2-412041-Micropul verized VDH* Recommended usage : with a liquid epoxy resin having an epoxy equivalent weight of 190 2601-00-20-01 LATENT CURING AGENTS AND ACCELERATORSFOR EPOXY RESINA jinomoto Fine-Techno Co.,Inc. Functional Chemicals +81-44-221-2372 Fax +81-44-221-2387 method to disperse AJICURE revised 02/10(1)T-E12-6 02/10(1), LAB 2601-00-20-01 LATENT CURING AGENTS AND ACCELERATORSFOR EPOXY RESINA jinomoto Fine-Techno Co.,Inc. Functional Chemicals +81-44-221-2372 Fax +81-44-221-2387 PN-23 : Shear strengthrevised 01/12(1)T-E4-1 99/9(1), LABF ormulationBisphenol A epoxy(eew 190) : 100 AJICURE PN-23 : 10-30 Fumed silica (Aerosil 200) : 1 (parts)AJICURE10phr15phr20phr25phr30phr PN-23 (phr)Gel (min) (oC)120oC-30min cure58134-126-120oC-60min cure79138-129-150oC-30min cure59121-115-Shear strength80oC-60min curenot cure1152104112 (kgf/cm2)100oC-60min cure156140118101112120oC-60min cure173142130133121150oC-60min cure181173152158134180oC-60min cure181171152150134 Table 1.

3 Typical properties of AJICURE PN-23 formulationsTensile shear strength vs PN-23 con0204060801001201401601802005101520253 035PN-23 content (phTensile shear strength (kgf/cm2)80C-60min cure100C-60min cu120C-60min cu150C-60min cu 2601-00-20-01 LATENT CURING AGENTS AND ACCELERATORSFOR EPOXY RESINA jinomoto Fine-Techno Co.,Inc. Functional Chemicals +81-44-221-2372 Fax +81-44-221-2387 MY-24 : Reactivityrevised 02/10(1)T-E6-1 99/9(1), LABF ormulationBisphenol A epoxy(eew 190) : 100 AJICURE MY-24 : 10-30 Fumed silica (Aerosil 200) : 1 (parts)Table 1. Typical properties of AJICURE MY-24 formulationsAJICURE10phr15phr20phr25phr3 0phrMY-24 (phr)Gel Time80oC>60>60>60>60>60 (min) > (oC)100oC-30min cure--70--100oC-60min cure--90--120oC-30min cure--85--120oC-60min cure--100--Shear strength100oC-60min cure57156193229236 (kgf/cm2)120oC-60min cure226233229243229150oC-60min cure230287284268247180oC-60min cure223261269258264 Gel Time vs MY-24 conte05101520255101520253035MY-24 content (phTensile shear strength (kgf/cm2)100C120C150C 2601-00-20-01 LATENT CURING AGENTS AND ACCELERATORSFOR EPOXY RESINA jinomoto Fine-Techno Co.))

4 ,Inc. Functional Chemicals +81-44-221-2372 Fax +81-44-221-2387 MY-24 : Shear strengthrevised 02/10(1)T-E7-1 99/9(1), LABF ormulationBisphenol A epoxy(eew 190) : 100 AJICURE MY-24 : 10-30 Fumed silica (Aerosil 200) : 1 (parts)Table 1. Typical properties of AJICURE MY-24 formulationsAJICURE10phr15phr20phr25phr3 0phrMY-24 (phr)Gel Time80oC>60>60>60>60>60 (min) > (oC)100oC-30min cure--70--100oC-60min cure--90--120oC-30min cure--85--120oC-60min cure--100--Shear strength100oC-60min cure57156193229236 (kgf/cm2)120oC-60min cure226233229243229150oC-60min cure230287284268247180oC-60min cure223261269258264 Tensile shear strength vs MY-24 co0501001502002503003505101520253035MY-2 4 content (phTensile shear strength (kgf/cm2)100C-60min cur120C-60min cur150C-60min cur180C-60min cur 2601-00-20-01 LATENT CURING AGENTS AND ACCELERATORSFOR EPOXY RESINA jinomoto Fine-Techno Co.)

5 ,Inc. Functional Chemicals +81-44-221-2372 Fax +81-44-221-2387 of DICY/AJICURE formulationrevised 99/9(1)T-E14-2 99/9(1), LABF ormulationEpoxy resin 100 (Bisphenol A epoxy:eew190)Dicyandiamide 8 accelerator 1-5Tg : measured by TMATg (100oC cure) of DICY/AJICURE formulation02040608010012014002040608010 0120140 CURING time (min.)Tg (oC)PN-23 (5phr)PN-23 (3phr)MY-24 (5phr)2MI (1phr)Tg (120oC cure) of DICY/AJICURE formulation02040608010012014016002040608 0100120140Tg (oC)PN-23 (5phr)PN-23 (3phr)MY-24 (5phr)2MI (1phr) 2601-00-20-01 LATENT CURING AGENTS AND ACCELERATORSFOR EPOXY RESINA jinomoto Fine-Techno Co.,Inc. Functional Chemicals +81-44-221-2372 Fax +81-44-221-2387 strength of DICY/AJICURE formulationrevised 99/9(1)T-E14-3 99/9(1), LABF ormulationEpoxy resin 100 (Bisphenol A epoxy:eew190)Dicyandiamide 8 accelerator 1-5 Shear strength (steel/steel) of DICY/AJICURE050100150200250300PN-23(1phr )PN-23(3phr)PN-23(5phr)MY-24(5phr)DCMU(5 phr)2MI (1phr) accelerator (phr)Shear strength (kgf/cm2)120C-1hr cure150C-1hr cureDICY with small amount of AJICURE PN-23 as an accelerator provides higher shear strength than DCMU or 2MI as an :3-(3,4-dichlorophenyl)-1,1-dimethylurea 2MI :2-methylimidazole 2601-00-20-01 LATENT CURING AGENTS AND ACCELERATORSFOR EPOXY RESINA jinomoto Fine-Techno Co.

6 ,Inc. Functional Chemicals +81-44-221-2372 Fax +81-44-221-2387 uptake of DICY/AJICURE formulationrevised 02/10(1)T-E14-4 02/10(1), LABF ormulationEpoxy resin 100 (Bisphenol A epoxy:eew190)Dicyandiamide 8 accelerator 1-5 Cure condition120oC-60minDICY with small amount of AJICURE PN-23 as an accelerator provides much lower water-uptake than 2MI as an :2-methylimidazoleWater uptake (100oC=boil / (3phr)PN-23(5phr)MY-24(3phr)2MI(1phr)wei ght gain (wt%) 2601-00-20-01 LATENT CURING AGENTS AND ACCELERATORSFOR EPOXY RESINA jinomoto Fine-Techno Co.,Inc. Functional Chemicals +81-44-221-2372 Fax +81-44-221-2387 for solid bisphenol A epoxy resinrevised 01/2(1)T-E46-1 01/2(1), LABAJICURE PN-23 usage level to solid bisphenol A type epoxy resin(eew 450) is about :Properties of solid bisphenol A epoxy resin and AJICURE PN-23 formulationsTg of solid Bisphenol A epoxy resin/PN-2380901001101200501001502002503 00 Cure time (min) at 120oCTg (oC)PN-23(5phr)PN-23(7phr)PN-23(10phr)PN -23(15phr)PN-23(20phr)PN-23+DICYF ormulation123456 Solid bisphenol A epoxy (eew450)100100100100100100 AJICURE PN-23571015204 DICY-----4 DSCon-set temp.)

7 (oC)1019795939293peak temp.(oC)141139137135133146exotherm(cal/ g) cure(oC)10411611711811757120oC-60min cure(oC)105118117118117109120oC-120min cure(oC)115 NDNDNDND110120oC-240min cure(oC)116118116115115110 Solid epoxy resin and AJICURE PN-23 was mixed through dry-blend method. 2601-00-20-01 LATENT CURING AGENTS AND ACCELERATORSFOR EPOXY RESINA jinomoto Fine-Techno Co.,Inc. Functional Chemicals +81-44-221-2372 Fax +81-44-221-2387 for solid bisphenol A epoxy resinrevised 01/2(1)T-E47-1 01/2(1), LABAJICURE MY-24 s usage level to solid bisphenol A type epoxy resin(eew 450) is about :Properties of solid bisphenol A epoxy resin and AJICURE MY-24 formulationsFormulation123456 Solid bisphenol A epoxy (eew450)100100100100100100 AJICURE MY-24571015204 DICY-----4 DSCon-set temp.(oC)1041031059393111peak temp.(oC)137137136134134148exotherm(cal/ g) cure(oC)808389909299120oC-60min cure(oC)899394949599120oC-120min cure(oC)9495959493105120oC-240min cure(oC)97 NDNDNDND107 Solid epoxy resin and AJICURE MY-24 was mixed through dry-blend of solid bisphenol A epoxy resin/MY-2470809010011002040608010012014 0 Cure time (min) at 120oCTg (oC)MY-24(5phr)MY-24(7phr)MY-24(10phr)MY -24(15phr)MY-24(20phr)MY-24+DICY 2601-00-20-01 LATENT CURING AGENTS AND ACCELERATORSFOR EPOXY RESINA jinomoto Fine-Techno Co.

8 ,Inc. Functional Chemicals +81-44-221-2372 Fax +81-44-221-2387 PN-series formulationwith various solventsT-E70-1 00/3(1), LABPGMAC (Propyleneglycol monomethylether acetate)AJICURE PN-40 formulation can be diluted by various solvents without viscosity PN-40 has excellent pot life even when it is used with solvent compared with of AJICURE formulations diluted by MEK (storage at 40C)048121620051015202530 DAYS (storage at 40 C)Viscosity (Pa s)PN-23PN-31PN-40 Viscosity of AJICURE formulations diluted by Toluene (storage at 40C)048121620051015202530 DAYS (storage at 40 C)Viscosity (Pa s)PN-23PN-31PN-40 MEK (Methyl ethyl ketone)TolueneViscosity of AJICURE formulations diluted by PGMAC (storage at 40C)048121620051015202530 Viscosity (Pa s)PN-23PN-31PN-40 2601-00-20-01 LATENT CURING AGENTS AND ACCELERATORSFOR EPOXY RESINA jinomoto Fine-Techno Co.

9 ,Inc. Functional Chemicals +81-44-221-2372 Fax +81-44-221-2387 98/4(1), LABEpon807 is equivalent to 02/10(1)Ajicure PN-31,PN-40 or PN-40J has much better pot life in bisphenol F epoxy resin / diluents system than Ajicure PN-23 or F epoxy / 1,6-hexanedioldiglycidylether formulations<Formulation>Epon 807 801,6-hexandiol diglycidylether 20 Ajicure 20 Aerosil 200 2 AjicurePN-31PN-40PN-40 JPN-23PN-HParticle size av. (micron) 10-12 2-3 10-12 Gel Time (min100 Viscosity (mPas )13321292141814451554 Viscosity Increase ratio after 4D @40 Increase ratio after 4W @25 Increase ratio after 8W @25 increase with reactive di02000400060008000100001200014000160001 8000200000246810 TIME (week / 25oC)Viscosity (mPas)PN-23PN-HPN-31PN-40PN-40J 2601-00-20-01 LATENT CURING AGENTS AND ACCELERATORSFOR EPOXY RESINA jinomoto Fine-Techno Co.)

10 ,Inc. Functional Chemicals +81-44-221-2372 Fax +81-44-221-2387 Time at 150 - 200oC of AJICURE PN-series 1T-E74-1 02/9(1), LABGel Time at elavated temp. of AJICURE formula051015202530PN-23PN-31PN-40PN-23 JPN-31 JPN-40 JPN-HGel Time (sec.)150??160??180??200??<Formulation>EP828EL (100 AJICURE (20)Aerosil#200 (1* Gel Time was measured by hot plate PN-23 or PN-23J cures fastest at elevated temp. of all AJICUREs. 2601-00-20-01 LATENT CURING AGENTS AND ACCELERATORSFOR EPOXY RESINA jinomoto Fine-Techno Co.,Inc. Functional Chemicals +81-44-221-2372 Fax +81-44-221-2387 cure at high temperature formulationsrevised 99/9(1)T-E38-2 99/9(1), LAB Bisphenol F epoxy resin formulation with AJICURE PN-23 cures faster thanbisphenol A epoxy resin formulation. Combination of AJICURE PN-23 and dicyandiamide(DICY) is good for rapidcure at high temperature.))