List of Failure Modes - TestNavi

1 List of Failure ModesPrepared by ESPEC 2 Failure phenomenon Applicable component or materialCombined accelerationconditionsMain test conditionsExample reference materialInsulationdeteriorationPlastic materials, adhesives, coating resinPressure cooker test110 to 130 C, 85%, 300 hoursKazuhiro Nakamura, 'Print Haisenban no Taishitsusei Hy ka ni Okeru Kaso kuseiShikenh no Kadai [ Problems With Accelerated Test Methods for PCB MoistureResistance Evaluations ] 16th Academic Meeting of Japan Institute of ElectronicsPackaging (2008)StrengthdeteriorationPlastic materials, coating resin, PCBsOxidationOxide film formation(contact Failure )Contact materialsHeat + MoistureUV irradiation in 40 C hydrogenperoxideKanji M o ri, To maku no K soku Taik sei Shiken H h no Kaihatsu [ A NewWeatherability Test Method for Coatings with Acceleration Factor of 100 ]Materials Life Society (2001)Low-temperature fragilityStrengthdeteriorationTin, solderTemperature cycle test (*1) 40/100 C (30 minutes each) for1,000 cyclesStrength test conditions: Shearvelocity of 20, 10, 5, mm/min*1: Yo Yoshida, Oi Handa to S ny Buhin no Setsug Shinraisei ni Tsuite [ JointReliability of Resoldered Locations and Inserted Parts ] 11th MicroelectronicsSymposium (2001)Temperature cycle test (*2) 40/125 C (30 minutes each) for 100,500, 1,000 cycles*2.

2 M asahiko Furuno , Hy men Jiss Buhin ni Okeru Namari-Free Handa Setsug bu no Sendan Ky do [ Shear Strength of Lead-Free Soldered Joints in Surface-Mounted Parts ] 15th Microelectronics Symposium (2005)Thermal-stress-drivenwhisker growthInsulation Failure ,short-circuitingLead frames, connectors, plating of component electrodes,soldered jointsHeat + StrainTemperature cycle test 65 to 150 C, 55 to 85 C (*1)Temperature cycle test 40 to 125 C, 100 cycles (*2)Temperature cycle test 40 to 130 C (2 hours per cycle),3,000 cycles (*3)*1: Yoshikuni Nakadaira, 'Growth of tin whiskers for lead-free plated leadframepackages in high humid environments and during thermal cycling'Microelectronics Reliability (2007)*2: Keun-so o Kim, Sn Whisker B shiy Hy men Nano mekki no Shinraisei Hy ka ,[ Reliability of surface coated Sn plating ] 18th Microelectronics Symposium (2008)*3: Koichiro Kuribayashi, Pb-Free Mekki no Himaku Hy ka Oyobi Whisker YokuseiGijutsu no Kaihatsu [ Lead-Free Plating Film Evaluation and Whisker InhibitionTechnology Development ]17th Academic Meeting of Japan Institute of Electronics Packaging (2003)SwellingInsulation Failure ,short-circuitingHydrolysisDiscol oration,strength deteriorationPlastic materials, adhesivesHeat + Moisture130 C/85%, 130 C/100%Nobuyuki Kawayoshi, J ki Osen ga Pressure Cooker Shiken ni Oyobosu Eiky ,[The effect of steam pollution on the pressure cocker test ] 19th JUSE R&MSymposium (1989)BreathingInsulation Failure ,short-circuitingResin films, sealed parts, temperature fusesHeat + MoistureCo nstant-temperature/co nstant-humidity test85 C/85%, applied voltage of 10kV/mm (24 hours) + 15 KV/mm (32ho urs) (*1)85 C/85%, 50 V, 1,000 hours (*2)*1.

3 Kenji Okamoto, K on K shitsu Bias Shiken ni Okeru Jushi Zetsuens noZetsuen Rekka Gensh [ Deterioration Phenomenon of Insulation Layers of HighTemperature High Humidity Bias Tests ] 20th Academic Meeting of Japan Instituteof Electronics Packaging (2006)*2: Yoichi Shinba, 20 m Pitch Flexible Kairo Kiban no Kaihatsu [ Development ofa 20 m-Pitch Flexible Circuit Board ]19th Academic Meeting of Japan Institute of Electronics Packaging (2005)Oxide-growth (internalstress) whiskersShort-circuiting,insulation failureLead-free (tin/silver) solder plating, jointsThermal cycling + MoistureCo nstant-temperature/co nstant-humidity test60 C/93%, 85 C/85% (*1)Co nstant-temperature/co nstant-humidity test55 C/85% (96 hours) (*2)Pressure cooker test110 C/85%, 85 C85%, 60 C/93%,room temperature (0, 500, 1,000,4,500 hours) (*3)Co nstant-temperature/co nstant-humidity test85 C/85% (3 000 h) (*4)*1: Yoshikuni Nakadaira, Growth of tin whiskers for lead-free plated leadframepackages in high humid environments and during thermal cycling Microelectronics Reliability (2007)*2: Keun-so o Kim, Sn Whisker B shiy Hy men Nano mekki no Shinraisei Hy ka ,[ Reliability of surface coated Sn plating ] 18th Microelectronics Symposium (2008)*3: Kazuhiko Tanabe, Namari-Free Handazukebu ni Okeru Whisker Hassei Y in noIchi K satsu [ An Examination of Whisker Generation Factors in Lead-FreeSoldered Locations ]20th Academic Meeting of Japan Institute of Electronics Packaging (2006)*4.

4 Koichiro Kuribayashi, Pb-Free Mekki no Himaku Hy ka Oyobi Whisker YokuseiGijutsu no Kaihatsu [ Lead-Free Plating Film Evaluation and Whisker InhibitionTechnology Development ]17th Academic Meeting of Japan Institute of Electronics Packaging (2003)Galvanic corrosionResistance valueincrease, wire breaksResistors, semiconductors, heat-radiating parts, + DC electric fields+ HeatTHB test (85 C/85% RH)Unsaturated pressure cooker bias test(120 C/85% RH)M ino ru To mo ike, COB no Taishitsusei Shiken ni Okeru Kaso kusei [ Acceleratio nIn Humidity Testing for COB ] Fujitsu Access Review (1999)Gap corrosionCorrosivedeteriorationMetal material connection terminals, gap portionsMoisture + electrolyticsubstances85 C/85%, 64%, 43% (1,000 hours)Jiangjun Xiang, Sn-Zn-Kei Teion Handa no K on K shitsu ni Okeru Sanka Kyo d [ Oxidation of Sn-Zn solder under high-temperature and high-humidity conditions ]16th Microelectronics Symposium (2006)Ion migration (dendrites,CAFs)Insulation Failure ,short-circuitingPCBs (main electrode materials: Silver, copper, lead, tin)Laminated ceramic capacitors , flax, coating materialsMoisture + DC electric fields+ Heat85 C/85%, 85 C/75%, 85 C/65%, 75 C/85%, 65 C/85%, 50 VDC (*1)85 C/85%, 60 C/90%, 40 C/90%.

5 50,25, VDC (*2)*1: Ikuo Yanase, Flexible Kiban no Migration Shiken [ Migration test of flexiblesubstrate ] Electronic Device Reliability Symposium (2004)*2: Sachiko Kitamura, Ion Migration Rekka ni Yoru Print Haisenban no Jumy Hy ka ni Kansuru Ichi K satsu [ An Examination of PCB Life Evaluations by Means ofIon Migration Deterioration ]36th JUSE Symposium on Reliability and Maintainability (2006)VibrationsFatigue cracksSolder joints, structural parts (metal, plastic), joint interfacesbetween different material typesVibrations + HeatAcceleration: m/s2; reso nancefrequency: 5 Hz; sweep time: 10minutes (48 ho urs)Toshiyuki Hamano et al., Electronics Jiss Kiban no Shind Fuka ni Okeru HakaiMechanism [ Destruction Mechanism for Vibration Load of Electronics MountingSubstrate ]Microjoining and Assembly Technology in Electronics (2003)Shock, drop impactFatigue cracksSolder joints, structural parts (metal, plastic), joint interfacesbetween different material typesJEITA-ET 7409/106: Test methods for solder joint of surface mount device Part106F: Cyclic drop test [in Japanese]WearContact resistanceincreasesSliding components, components with rotating partsVibrations + MoistureRepetitive bend fatigueFatigue cracksSoldered joints, structural parts (metal, plastic)JEITA-ET 7409/105: Test methods for solder joint of surface mount device Part105.

6 Cyclic bending strength test [in Japanese]CreepStrengthdeteriorationSolde red joints, metal materials, plasticsStress + Time + HeatExternal stress whiskersInsulation Failure ,short-circuitingTin plated connectors, lead framesStress + TimeCurrentdensityElectromigrationWire breaks (inaluminum or copperwiring)Semico nducto r aluminum wiring, so lder bump jo intsCurrent density + HeatTin/silver/copper solder bumpsCurrent density: 10 kA/cm2 Temperature: 180 CKimihiro Yamanaka, Namari-Free Handa Bish Setsug bu no Electromigration niTsuite [ A study on Pb-free solder electromigration in micro-joint system ] 16thMicroelectronics Symposium (2006)Electric fieldstrengthTime-dependent dielectricbreakdown (TDDB)Leak currentincreasesSemiconductor insulation filmsElectric field strength + HeatVoltage: V (NMOS), V(PMOS)Temperature: 110 CTetsuji Uno , Hf SiOx Gate Zetsuenmaku no TDDB To kusei ni Kansuru Ichi K satsu [ An Examination of the TDDB Characteristic of HfSiOx Gate InsulatingFilm ] 18th Electronic Device Reliability Symposium (2008)Sulfide gasCo ntact f ailure(sulfide corrosion)Contact materials and metal materials (copper, silver), platingSO2 + Moisture + Heat (+Nox)H2S + Moisture + Heat (+1 ppm H2S, 25 C/75% (1,000 hours)Nitride gasCo ntact f ailure(nitride corrosion)Contact materials and metal materialsNox + Moisture + Heat1 ppm NO2, 25 C/75% (1000 hours)Organic gasSiloxane gasCo ntact f ailure(formation of siliconoxide)Contact materials in relays, small motors, + Heat40 C; siloxane concentration: 1 ppm,11 pmOpen/close count: 30,000.)

7 Resistanceload: 12 VDC, 10 mASaltwaterstressCorrosionChloride corrosionRuseMetal materials, exteriorsSaltwater spray testLight stressUVPhotolysisStrengthdeterioration, discolorationPlastics, solar cellsLight irradiation test, outdoorexposure testDust stressDustAdhering impurities(tracking)Insulation Failure ,short-circuitingPCBs, insulation materialsElectric field + Moisture +Electrolytic substances + DustTracking testNH4Cl , 600 VIEC Publ. 112, Method for determining the comparative and the proof trackingindices of solid insulating materials under moist conditions (1979)Kishichi Sasaki, Namari-Free Handa no Fushokusei no Kent [ A Study of theCorrosiveness of Lead-Free Solder ] 18th Electronic Device Reliability Symposium(2008)Plastic packaging, PCBs, adhesives, plastic materialsHeat + MoistureStrengthdeteriorationSoldered joints, plating or connecting portions of differentmetal typeHot/cold cycle test.

8 -40/105 C, 40/200 C, 40/250 C (20minutes each)Yasushi Yamada, Power Hand tai Device Jiss y Bi-Kei Handa (II) Setsug tai noReinetsu Cycle Shinraisei [ Hot/Cold Cycle Reliability of Bismuth-Based Solder (II)Joints for Mounting Power Semiconductor Devices ] 16th MicroelectronicsSymposium (2006)Heat + StressHeat + StrainStrengthdeterioration, fatiguecracksGas stressThermaldeteriorationThermalcycling MoistureabsorptionCorrosionElectricalstr essInorganicgasesRepetitivestressLoad stressMechanicalstressSoldered joints, PCBs, chip capacitors , joint interfacesbetween different material typesHumiditystressDiffusionThermal breakdownThermal diffusionThermal stressThermal fatigueAbout this listFailure Modes are classified from various perspectives that are determined by the different standpoints of engineers working in different fields, and by the frequency with which they are encountered. Examples of typical anticipated Failure phenomena areclassified here mainly from the perspective of electronics mounting reliability.

9 They are drawn from Espec's experience and past reported cases. We plan to update this list in future to reflect member feedback and the latest information. List of Failure ModesCopyright(C)ESPEC CORP. All rights Navi [Test handbook]