List of Failure Modes - TestNavi

1 List of Failure ModesPrepared by ESPEC 2 Failure phenomenon Applicable component or materialCombined accelerationconditionsMain test conditionsExample reference materialInsulationdeteriorationPlastic materials, adhesives, coating resinPressure cooker test110 to 130 C, 85%, 300 hoursKazuhiro Nakamura, 'Print Haisenban no Taishitsusei Hy ka ni Okeru Kaso kuseiShikenh no Kadai [ Problems With Accelerated Test Methods for PCB MoistureResistance Evaluations ] 16th Academic Meeting of Japan Institute of ElectronicsPackaging (2008)StrengthdeteriorationPlastic materials, coating resin, PCBsOxidationOxide film formation(contact Failure )Contact materialsHeat + MoistureUV irradiation in 40 C hydrogenperoxideKanji M o ri, To maku no K soku Taik sei Shiken H h no Kaihatsu [ A NewWeatherability Test Method for Coatings with Acceleration Factor of 100 ]Materials Life Society (2001)Low-temperature fragilityStrengthdeteriorationTin, solderTemperature cycle test (*1) 40/100 C (30 minutes each) for1,000 cyclesStrength test conditions: Shearvelocity of 20, 10, 5, mm/min*1.

2 Yo Yoshida, Oi Handa to S ny Buhin no Setsug Shinraisei ni Tsuite [ JointReliability of Resoldered Locations and Inserted Parts ] 11th MicroelectronicsSymposium (2001)Temperature cycle test (*2) 40/125 C (30 minutes each) for 100,500, 1,000 cycles*2: M asahiko Furuno , Hy men Jiss Buhin ni Okeru Namari-Free Handa Setsug bu no Sendan Ky do [ Shear Strength of Lead-Free Soldered Joints in Surface-Mounted Parts ] 15th Microelectronics Symposium (2005)Thermal-stress-drivenwhisker growthInsulation Failure ,short-circuitingLead frames, connectors, plating of component electrodes,soldered jointsHeat + StrainTemperature cycle test 65 to 150 C, 55 to 85 C (*1)Temperature cycle test 40 to 125 C, 100 cycles (*2)Temperature cycle test 40 to 130 C (2 hours per cycle),3,000 cycles (*3)*1.

3 Yoshikuni Nakadaira, 'Growth of tin whiskers for lead-free plated leadframepackages in high humid environments and during thermal cycling'Microelectronics Reliability (2007)*2: Keun-so o Kim, Sn Whisker B shiy Hy men Nano mekki no Shinraisei Hy ka ,[ Reliability of surface coated Sn plating ] 18th Microelectronics Symposium (2008)*3: Koichiro Kuribayashi, Pb-Free Mekki no Himaku Hy ka Oyobi Whisker YokuseiGijutsu no Kaihatsu [ Lead-Free Plating Film Evaluation and Whisker InhibitionTechnology Development ]17th Academic Meeting of Japan Institute of Electronics Packaging (2003)SwellingInsulation Failure ,short-circuitingHydrolysisDiscol oration,strength deteriorationPlastic materials, adhesivesHeat + Moisture130 C/85%, 130 C/100%Nobuyuki Kawayoshi, J ki Osen ga Pressure Cooker Shiken ni Oyobosu Eiky ,[The effect of steam pollution on the pressure cocker test ] 19th JUSE R&MSymposium (1989)

4 BreathingInsulation Failure ,short-circuitingResin films, sealed parts, temperature fusesHeat + MoistureCo nstant-temperature/co nstant-humidity test85 C/85%, applied voltage of 10kV/mm (24 hours) + 15 KV/mm (32ho urs) (*1)85 C/85%, 50 V, 1,000 hours (*2)*1: Kenji Okamoto, K on K shitsu Bias Shiken ni Okeru Jushi Zetsuens noZetsuen Rekka Gensh [ Deterioration Phenomenon of Insulation Layers of HighTemperature High Humidity Bias Tests ] 20th Academic Meeting of Japan Instituteof Electronics Packaging (2006)*2: Yoichi Shinba, 20 m Pitch Flexible Kairo Kiban no Kaihatsu [ Development ofa 20 m-Pitch Flexible Circuit Board ]19th Academic Meeting of Japan Institute of Electronics Packaging (2005)Oxide-growth (internalstress) whiskersShort-circuiting,insulation failureLead-free (tin/silver) solder plating, jointsThermal cycling + MoistureCo nstant-temperature/co nstant-humidity test60 C/93%, 85 C/85% (*1)Co nstant-temperature/co nstant-humidity test55 C/85% (96 hours) (*2)Pressure cooker test110 C/85%, 85 C85%, 60 C/93%,room temperature (0, 500, 1,000,4,500 hours) (*3)Co nstant-temperature/co nstant-humidity test85 C/85% (3 000 h) (*4)*1.

5 Yoshikuni Nakadaira, Growth of tin whiskers for lead-free plated leadframepackages in high humid environments and during thermal cycling Microelectronics Reliability (2007)*2: Keun-so o Kim, Sn Whisker B shiy Hy men Nano mekki no Shinraisei Hy ka ,[ Reliability of surface coated Sn plating ] 18th Microelectronics Symposium (2008)*3: Kazuhiko Tanabe, Namari-Free Handazukebu ni Okeru Whisker Hassei Y in noIchi K satsu [ An Examination of Whisker Generation Factors in Lead-FreeSoldered Locations ]20th Academic Meeting of Japan Institute of Electronics Packaging (2006)*4: Koichiro Kuribayashi, Pb-Free Mekki no Himaku Hy ka Oyobi Whisker YokuseiGijutsu no Kaihatsu [ Lead-Free Plating Film Evaluation and Whisker InhibitionTechnology Development ]17th Academic Meeting of Japan Institute of Electronics Packaging (2003)Galvanic corrosionResistance valueincrease, wire breaksResistors, semiconductors, heat-radiating parts, + DC electric fields+ HeatTHB test (85 C/85% RH)Unsaturated pressure cooker bias test(120 C/85% RH)M ino ru To mo ike, COB no Taishitsusei Shiken ni Okeru Kaso kusei [ Acceleratio nIn Humidity Testing for COB ] Fujitsu Access Review (1999)

6 Gap corrosionCorrosivedeteriorationMetal material connection terminals, gap portionsMoisture + electrolyticsubstances85 C/85%, 64%, 43% (1,000 hours)Jiangjun Xiang, Sn-Zn-Kei Teion Handa no K on K shitsu ni Okeru Sanka Kyo d [ Oxidation of Sn-Zn solder under high-temperature and high-humidity conditions ]16th Microelectronics Symposium (2006)Ion migration (dendrites,CAFs)Insulation Failure ,short-circuitingPCBs (main electrode materials: Silver, copper, lead, tin)Laminated ceramic capacitors, flax, coating materialsMoisture + DC electric fields+ Heat85 C/85%, 85 C/75%, 85 C/65%, 75 C/85%, 65 C/85%, 50 VDC (*1)85 C/85%, 60 C/90%, 40 C/90%; 50,25, VDC (*2)*1: Ikuo Yanase, Flexible Kiban no Migration Shiken [ Migration test of flexiblesubstrate ] Electronic Device Reliability Symposium (2004)*2: Sachiko Kitamura, Ion Migration Rekka ni Yoru Print Haisenban no Jumy Hy ka ni Kansuru Ichi K satsu [ An Examination of PCB Life Evaluations by Means ofIon Migration Deterioration ]36th JUSE Symposium on Reliability and Maintainability (2006)VibrationsFatigue cracksSolder joints, structural parts (metal, plastic), joint interfacesbetween different material typesVibrations + HeatAcceleration: m/s2; reso nancefrequency: 5 Hz; sweep time: 10minutes (48 ho urs)Toshiyuki Hamano et al.

7 , Electronics Jiss Kiban no Shind Fuka ni Okeru HakaiMechanism [ Destruction Mechanism for Vibration Load of Electronics MountingSubstrate ]Microjoining and Assembly Technology in Electronics (2003)Shock, drop impactFatigue cracksSolder joints, structural parts (metal, plastic), joint interfacesbetween different material typesJEITA-ET 7409/106: Test methods for solder joint of surface mount device Part106F: Cyclic drop test [in Japanese]WearContact resistanceincreasesSliding components, components with rotating partsVibrations + MoistureRepetitive bend fatigueFatigue cracksSoldered joints, structural parts (metal, plastic)JEITA-ET 7409/105: Test methods for solder joint of surface mount device Part105: Cyclic bending strength test [in Japanese]CreepStrengthdeteriorationSolde red joints, metal materials, plasticsStress + Time + HeatExternal stress whiskersInsulation Failure ,short-circuitingTin plated connectors, lead framesStress + TimeCurrentdensityElectromigrationWire breaks (inaluminum or copperwiring)Semico nducto r aluminum wiring, so lder bump jo intsCurrent density + HeatTin/silver/copper solder bumpsCurrent density: 10 kA/cm2 Temperature.

8 180 CKimihiro Yamanaka, Namari-Free Handa Bish Setsug bu no Electromigration niTsuite [ A study on Pb-free solder electromigration in micro-joint system ] 16thMicroelectronics Symposium (2006)Electric fieldstrengthTime-dependent dielectricbreakdown (TDDB)Leak currentincreasesSemiconductor insulation filmsElectric field strength + HeatVoltage: V (NMOS), V(PMOS)Temperature: 110 CTetsuji Uno , Hf SiOx Gate Zetsuenmaku no TDDB To kusei ni Kansuru Ichi K satsu [ An Examination of the TDDB Characteristic of HfSiOx Gate InsulatingFilm ] 18th Electronic Device Reliability Symposium (2008)Sulfide gasCo ntact f ailure(sulfide corrosion)Contact materials and metal materials (copper, silver), platingSO2 + Moisture + Heat (+Nox)H2S + Moisture + Heat (+1 ppm H2S, 25 C/75% (1,000 hours) nitride gasCo ntact f ailure( nitride corrosion)Contact materials and metal materialsNox + Moisture + Heat1 ppm NO2, 25 C/75% (1000 hours)Organic gasSiloxane gasCo ntact f ailure(formation of siliconoxide)Contact materials in relays, small motors, + Heat40 C.)

9 Siloxane concentration: 1 ppm,11 pmOpen/close count: 30,000; resistanceload: 12 VDC, 10 mASaltwaterstressCorrosionChloride corrosionRuseMetal materials, exteriorsSaltwater spray testLight stressUVPhotolysisStrengthdeterioration, discolorationPlastics, solar cellsLight irradiation test, outdoorexposure testDust stressDustAdhering impurities(tracking)Insulation Failure ,short-circuitingPCBs, insulation materialsElectric field + Moisture +Electrolytic substances + DustTracking testNH4Cl , 600 VIEC Publ. 112, Method for determining the comparative and the proof trackingindices of solid insulating materials under moist conditions (1979)Kishichi Sasaki, Namari-Free Handa no Fushokusei no Kent [ A Study of theCorrosiveness of Lead-Free Solder ] 18th Electronic Device Reliability Symposium(2008)Plastic packaging, PCBs, adhesives, plastic materialsHeat + MoistureStrengthdeteriorationSoldered joints, plating or connecting portions of differentmetal typeHot/cold cycle test.

10 -40/105 C, 40/200 C, 40/250 C (20minutes each)Yasushi Yamada, Power Hand tai Device Jiss y Bi-Kei Handa (II) Setsug tai noReinetsu Cycle Shinraisei [ Hot/Cold Cycle Reliability of Bismuth-Based Solder (II)Joints for Mounting Power Semiconductor Devices ] 16th MicroelectronicsSymposium (2006)Heat + StressHeat + StrainStrengthdeterioration, fatiguecracksGas stressThermaldeteriorationThermalcycling MoistureabsorptionCorrosionElectricalstr essInorganicgasesRepetit