Memory Module Specifi cations - Kingston Technology
• VPP - 2.5V Typical • VDDSPD=2.2V to 3.6V • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals • Low-power auto self refresh (LPASR) • Data bus inversion (DBI) for data bus • On-die VREFDQ generation and calibration • Single-rank • On-board I2 serial presence-detect (SPD) EEPROM
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Memory Module Specifi cations - Kingston
www.kingston.comDESCRIPTION Document No. VALUERAM1445-001.C00 12/18/15 Page 1 SPECIFICATIONS *Power will vary depending on the SDRAM used. Continued >> kingston.com
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microSDHC/microSDXC Class 10 UHS-I Card
www.kingston.comTHIS DOCUMENT SUBJECT TO CHANGE WITHOUT NOTICE. ©2017 Kingston Technology Europe Co LLP und Kingston Digital Europe Co LLP, Kingston Court, Brooklands Close,
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Memory Module Specifications - Kingston
www.kingston.comDESCRIPTION SPECIFICATIONS *Power will vary depending on the SDRAM used. HX421C14FBK4/64 64GB (16GB 2G x 64-Bit x 4 pcs.) DDR4-2133 CL14 288-Pin DIMM
Memory Module Specifi cations - Kingston
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www.kingston.com1 to 4 bi-directional data signals. After power up, the microSD card will use only DAT0 by default. After initialisation, the host can change the bus width. Multiplied microSD card connections are available to the host. Common Vdd, Vss and CLK signal connections are …
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