MICRO MACHINING PROCESSES

1 1 WELCOME TO THE COURSEONMICRO MACHINING PROCESSESBYDr. ENGINEERING DEPARTMENT KANPUR-208016e-mail : , Mechanical Engineering Department, Kanpur2 ORGANISATION TEXT BOOKS CHAPTERS TO BE COVERED IN THIS COURSE ON MMPs WHY DO YOU NEED MMPs CLASSIFICATION OF MMPs EVOLUTION AND WORKING PRINCIPLES OF SOME AMPs APPLICATIONS OF MMPs CONCLUSIONSProf. , Mechanical Engineering Department, KanpurProf. , Mechanical Engineering Department, Kanpur3 ADVANCED MACHINING PROCESSESProf. , Mechanical Engineering Department, Kanpur4 Grading PolicyMid Sem. Exam--> 30 %End Sem. Exam 40 %Term Paper 15%Lab. Visits 05%Attendance 05%Quizzes(unannounced)-- 05%For getting D or better grade, one should have minimum 30 % marksin both theory exams (Mid Sem. + End Sem.) and 35 % in total. For getting E ,One should have 25 % in theory and 30 % in BOOKSProf.

2 , Mechanical Engineering Department, Kanpur INTRODUCTION TO MICROMACHINING , (EDITOR) PUBLISHED BY NAROSA PUBLISHERS, N EW DELHI (2009). (second Edition) MICROMANUFACTURING PROCESSES BY V. K. JAIN (Editor), CRC PRESS. ADVANCED MACHINING PROCESSES BY JAIN , ALLIED PUBLISHERS, NEW DELHI. NON-CONVENTIONAL MATERIAL REMOVAL PROCESSES BY , BLOCK-4, INDIRA GANDHI NATIONAL OPEN UNIVERSITY (IGNOU), NEW DELHI Reference Books MICROMACHINING METHODS BY Mc GEOUGH, CHAMPAN AND HALL, LONODON 6 BOOKSProf. , Mechanical Engineering Department, Kanpur7 TOPICSTO BE COVEREDProf. , Mechanical Engineering Department, TO THE COURSE & CLASSIFICATION OF MMPsPART 1 : MECHANICAL TYPE ADVANCED MICRO MACHINING PROCESSES 2 ABRASIVE JET MICRO MACHINING (AJMM)3 ULTRASONIC MICRO MACHINING (USMM)4 ABRASIVE WATER JET MICRO MACHINING (AWJMM)PART 2 : ABRASIVE BASED NANO FINISHING PROCESSES5 ABRASIVE FLOW FINISHING (AFF)6 CHEMOMECHANICAL POLISHING (CMP)SUBJECT AREAS Prof.

3 , Mechanical Engineering Department, ABRASIVE FINISHING (MAF)8 MAGNETORHEOLOGICAL FINISHING (MRF)9 MAGNETORHEOLOGICAL ABRASIVE FLOW FINISHING (MRAFF)10 MAGNETIC FLOAT POLISHING (MFP)PART 3 : THERMOELECTRIC TYPE MICROMACHINING PROCESSES 11 ELECTRIC DISCHARGE MICROMACHINING (EDMM)12 WIRE EDM , EDDG, ELID13 LASER BEAM MICROMACHINING (LBMM)14 ELECTRON BEAM MICROMACHINING (EBMM)9 SUBJECT AREASProf. , Mechanical Engineering Department, 4 : CHEMICAL AND ELECTROCHEMICHAL TYPE ADVANCED MACHINING PROCESSES 15 ELECTROCHEMICAL MICROMACHININIG (ECMM)16 ELECTROCHEMICHAL MICRO DEBURRING17 CHEMICHAL AND PHOTOCHEMICAL MICROMACHININGPART-5 : TRADITIONAL MECHANICAL MICROMACHINING PROCESSS18 MICRO TURNING 19 MICRO MILLING10 SUBJECT AREASProf. , Mechanical Engineering Department, MICRO DRILLINGPART-6 : MISCELLANEOUS TOPICS21 FOCUSSED ION BEAM (FIB) MACHINING22 SELECTION OF MICRO MACHINING PROCESSES23 CONCLUDING REMARKS11 SUBJECT AREASProf.

4 , Mechanical Engineering Department, KanpurProf. Jain12 Dept. Of Mechanical EngineeringIIT KanpurINTRODUCTION Intoday shightechengineeringindustries,thedesign er srequirementforthecomponentarestringent, suchas: Extraordinarypropertiesofmaterials(say,h ighStrength,highheatresistant,highhardne ss,corrosionresistantetc.). Complex3 Dcomponent(say,turbineblade). Miniaturefeatures(filtersforfoodprocessi ngandtextileindustrieshavingafewtensofmi crometerasholediameterandthousandsinnumb ers). Nanolevelsurfacefinishoncomplexgeometrie swhichareimpossibletoachievebyanytraditi onalmethods(say,thousandsofturbulatedcoo lingholesinaturbineblade,making&finishin gofmicrofluidicchannelsintheelectrically conductingandnon-conductingmaterials(say ,glass,quartz,ceramics)). MATERIALS HAVING MUCH SUPERIORPROPERTIESULTRAHIGH STRENGTH , HARDNESSVERY HIGH TEMPTURE RESISTANCE DIFFICULT TO MACHINE BY CONVENVENTIONAL MACHINING METHODSWORK PIECE MATERIAL HARDNESS >> TOOL MATERIAL HARDNESSHOW TO SOLVE THE PROBLEMADVANCED MICRO MACHINING PROCESSESWORKPIECE HARDNESS DOES NOT MATTER IN AMMPs ?

5 PRESENT DAY DEMAND TRENDS IN INDUSTRIES(AEROSPACE , MISSILES , AUTOMOBILES, NUCLEAR REACTORS, ETC.)Prof. , Mechanical Engineering Department, KanpurProf. Jain14 METHODS OF MICRO FABRICATIONM aterial depositionMaterial removalMetal forming(etc)Electro discharge Deposition (EDD)Chemical vapor deposition (CVD)Physical vapor deposition (PVD)Rapid prototyping/rapid tooling (RP/RT)LIGAE lectro chemical spark deposition (ECSD)Traditional material removal processesAdvanced material removal processesDept. Of Mechanical EngineeringIIT KanpurMicro joiningMicro DO YOU NEED OF MMPs? Prof. , Mechanical Engineering Department, Kanpur16 Why miniaturization?Minimizing energy and materials use in manufacturingReduction of power budgetFaster devicesIncreased selectivity and sensitivityImproved accuracy and reliabilityCost/ performance advantagesIntegration with electronics, simplifying systems171818 NOWADAYS , FOCUS IS ON MINIATURIZATION THROUGH DEVELOPMENT OFNOVEL PRODUCTION CONCEPTS (SPECIALLY MICRO & NANO) FOR THE PROCESSING OF NON-CERAMIC DEALS WITH ALL KIND OF MANUFACTURING PROCESSES BUT ATMICRO & NANO REPLICATION OF MICROPARTS THROUGH MOLDING IS ONE OF THE PREFERRED ROUTES FOR MICROMANUFACTURE BECAUSE OF ITS MASS-PRODUCTION CAPABILITY AND RELATIVELY LOW COST.

6 HOWEVER IN THIS COURSE I WILL MAINLY CONCENTRATE ON MICROATTRITIOUS PROCESSES : MICROMACHINING PROCESSES MICRO -PRODUCTS19 Material Removal ProcessesMicro/nano machiningMicro/nano finishingTraditional MACHINING processesAdvanced MACHINING processesTraditional finishing processesAdvanced finishing processes20 MICRO / nanofinishingtraditionalAdvancedGrinding LappingHoningELIDMRAFFCMPMRFMAFAFMMFP -EBM -LBM -AJMECMM -EDM -turning -milling -drillingTraditionalAdvancedMechanicalTh ermalChemical -USMAFM, MAF, MRAFF, MFP -AWJM -grinding -PAMPCMMHYBRID -ECSM -ECG -EDGELID, etc21 CLASSIFICATION Micromachining Methods BASED ON THE KIND OF ENERGY USED : MACHANICAL, THERMOELECTRIC, ELECTROCHEMICAL & CHEMICAL, BIOCHEMICAL22 APPLICABLE ONLY FOR ELECTRICALLY CONDUCTINGMATERIALS: ECM, EDM, EBM. APPLICABLE FOR BOTH ELECTRICALLY CONDUCTING & NON -CONDECTING MATERIALS: USM , AJM, LBM, ETC.

7 APPLICABLE FOR NON MAGNETIC MATERIALS : MAF, MRF, ETC. THERMAL CONDUCTIVITY, REFLECTIVITY, ETC. ALSO PLAY ANIMPORTANT ROLE IN SOME CASES: LBMBASED ON THE PROPERTIES OF WORK MATERIAL TO BE MACHINEDProf. , Mechanical Engineering Department, KanpurProf. , Mechanical Engineering Department, Kanpur23 EXAMPLES: WHY WE NEED MICROMACHINING / MICROMANUFACTURING?Prof. Jain24 Dept. Of Mechanical EngineeringIIT KanpurMICROMACHINING Macrocomponentsbutmaterialremovalisatmic ro/nanolevel MICRO /nanocomponentsandmaterialremovalis atmicro/nanolevel( ,NEMS)MICROMACHININGR emoval of material at micron levelUnfortunately , the present day notion is MACHINING of highly miniature components with miniature features. Literally it is NOT correctSize: 2mm 2mm MORE CORRECT DEFINITION IS material removal is MICRO /nano levelWITH NO CONSTRAINT ON THE SIZE OF THE COMPONENT2525 LASER-CUT STENTLIKE PATTERN IN miniature STAINLESS-STEEL TUBE WITH HOLE(DIA.)

8 15 m) PATTERN IN POLYURETHANE TUBESOME MICROMACHINED PARTS2626 MECHANICAL DEFORMATION THERMAL DEFORMATION SURFACE INTEGRITY GAP BETWEEN TOOL AND WORK PIECE COORDINATE SHIFT IN TOOL HANDLINGPROBLEMS IN MICROMACHINING27 ENGINEERING MATERIALSMETALS AND ALLOYS PLASTICS AND COMPOSITESCERAMICS GETTING MORE POPULARITY DEFINITE ADVANTAGES OVER OTHERSHOW TOMICROMACHINETHEM?ADVANCED MACHINNG PROCESSESSOLUTIONProf. , Mechanical Engineering Department, KanpurProf. , Mechanical Engineering Department, Kanpur28 WHY DO YOU NEED ADVANCED MICRO MACHINING PROCESSES ?some examples29 MICRO MACHINING OF COMPLEX SHAPED WORKPIECES? ELECTROCHEMICAL MACHININGHOLE NORMAL TO THE WALLT urbine Blade with cooling HolesContoured Hole Drilled In Inconel Using ECM Prof. , Mechanical Engineering Department, Kanpur30 HOLE= mm HOLES DENSITY = 4000/cm2 ; THICK = MM; TIME = 10 S/HOLEHOLE = mm (6 m); HOLES DENSITY = 200,000 / cm2 ;THICKNESS = mm; TIME= 2 s / HOLEPATTERN OF HOLES DRILLED BY EBMPART OF A HELICOPTER TURBINE HOLES DRILLED BY EBM AFF MEDIA ACTS AS A SELF-DEFORMABLE STONEProf.

9 , Mechanical Engineering Department, Kanpur31 WORKING PRINCIPLE OF SOME MMPsProf. , Mechanical Engineering Department, KanpurProf. Jain32 Dept. Of Mechanical EngineeringIIT KanpurMECHANICAL ADVANCED MICROMACHINING PROCESSES Abrasive jet micromachining (AJMM) Abrasive water jet micromachining (AWJMM) Water jet micromachining (WJMM) Ultrasonic micromachining (USMM) An young boy hits a ball twice on the wall with F1 & F2. The ball makes a crater of size D1& D2such that D2>D1 when F2>F1. D2& D1 size = (Kinetic energy of the ball when hitting the wall).= Force (or velocity of the ball with which it hits the wall, and mass of the ball) Abrasive Jet MACHINING (AJM) works on the same >F1D2>D1D1 Soft wallF2D2 Soft wallD1 Soft wallF2D2 Soft wallF1 How Abrasive JET MACHINING (AJM) Works?3334 WATER JET MACHINING (WJM), ABRASIVE WATER JET MACHINING (AWJM) , AIR JET MACHINING (AJM)35 APPLICATIONS OF ABRASIVE WATER JET CUTTING (AWJC)Granite cuttingCOURTESY : IITM CHENNAIProf.

10 Jain36 Dept. Of Mechanical EngineeringIIT KanpurPRINCIPLE OF MECHANICAL ADVANCED MICROMACHINING Fineabrasiveparticleswithhighkineticener gy(KE)hittheworkpieceatanangleandremovet hematerialintheformofmicro/nano-chips. IftheKEoftheabrasiveparticleishighenough , Jain37 Dept. Of Mechanical EngineeringIIT KanpurAPPLICATIONS Holesupto66 mdeepcanbedrilledwithoutemployingspecial techniques. Microburrsareclearlyvisible. BEAM MACHINING (LBM)Prof. , Mechanical Engineering Department, Kanpur39 ULTRASONIC MACHININGProf. , Mechanical Engineering Department, Kanpur40 LASER BEAM MACHINING (LBM)Prof. , Mechanical Engineering Department, Kanpur41 ELECTRON BEAM MICROMACHININGProf. , Mechanical Engineering Department, Kanpur42 FOCUSSED ION BEAM MACHNING SPUTTERINGOFF:KNOCKINGOUTATOMSFROMTHEWOR K-PIECESURFACEBYTHEKINETICMOMENTUMTRANSF ERFROMINCIDENTIONTOTHETARGETATOMS SCHEMATIC ILLUSTRATION ATSUFFICIENTLYHIGHENERGY,THECASCADINGEVE NTSWILLPENETRATEMOREDEEPLYINTOTHESOLID, , Mechanical Engineering Department, Kanpur43 ELECTROCHEMICAL & CHEMICAL MICRO MACHINING PROCESSESELECTROCHEMICAL MACHINING Prof.