Transcription of October-2011 - Bonding Source
1 TechnicalDataSheet CF3350 october - 2011 PRODUCTDESCRIPTIONCF3350provides thefollowingproductcharacteristics:Techn ologyEpoxyFilmAppearanceGrayTanCureHeatc ureProduct Benefits Highelectricalconductivity Highthermalconductivity Uniformbondlineadhesion Custompreformsavailable Adhesionwithflexibility Void-freebondline Clean,easyapplicationwithnowaste Even heatdissipation Provides electricalcontinuity Minimumthermalresistanceto heatsinkApplicationAssemblyFillerTypeSil verOperating Temperature-40 to160 CThickness2 or4 mils( )CarrierTypePolyesterTypicalAssemblyAppl icationsCircuitboardmaterials, Metalbackplanes andHeatsinksSubstratesFluoropolymercircu its,Ceramiccircuits,Copper, Brass, Kovar isformulatedforelectrical, @25 C, months3 ShelfLife@5 C(fromdateof manufacture), months9 PeakExothermTemperature,DSC,RampRate=10 C 5 CFlashPoint- SeeMSDSTYPICALCURINGPERFORMANCECureSched ule30 minutes@150 C AlternativeCureSchedule10 minutes@175 Cor50 minutes@137 Cor120 minutes@125 C CurePressure5 to60 psi Curepressuremayvarydependingonthemateria lsbeingbondedandtheirsize.
2 Alltemperaturesaremeasuredattheadhesivea nddonotincluderamp-uptime. (timeandtemperature)mayvarybasedoncustom ers'experienceandtheirapplicationrequire ments,aswellascustomercuringequipment,ov enloadingandactualoventemperatures..TYPI CALPROPERTIESOFCUREDMATERIALP hysicalProperties:Coefficientof ThermalExpansionTMA:BelowTg,10-6/ C65 AboveTg,10-6/ C150 GlassTransitionTemperature, DMA, C90 ThermalConductivity,W/mK7 ThermalResistancefor1sqcmarea@10psiassem blypressure:50 mbondline, mbondline, Modulus, DMA:@-40 C N/mm 4,000 (psi) (580,151)@0 C N/mm 3,000 (psi) (435,113)@25 C N/mm 2,400 (psi) (348,090)@100 C N/mm 680 (psi) (98,625)@150 C N/mm 60 (psi) (8,702)ExtractableIonicContent, ppm:Chloride(Cl-)50 Sodium(Na+)30 Potassium(K+)5 ElectricalProperties:VolumeResistivity,o hm/cm@25 (psi):4 milthickness, @25 CSubstrateAluminumto aluminum3,400 Goldto Gold3,500 GENERALINFORMATIONF orsafehandlinginformationonthisproduct,c onsulttheMaterialSafetyDataSheet,(MSDS).
3 Containerto , notmandatory,wipingwithanorganicsolvent( ) substratesurfaces.. ,laminationpresses, , , temperaturesbelow-5 C. Ifmaterialgoesbelowthistemperature,itsho uldbehandledgentlyandtheentirepackagesho uldbewarmedtoroomtemperaturebeforeopenin g. Thiswillminimizethepossibilityoffracturi nginthebrittlestateorallowingcondensatio nto original,tightlycoveredcontainersin clean,dryareas. Storageinformationmaybeindicatedonthepro ductcontainerlabeling. Usableshelflifemayvarydependingonmethodo fapplicationandstorageconditionsOptimalS torage: 5 C. Storagebelow 5 Corgreaterthanminus 5 Donotreturnproducttotheoriginalcontainer . additionalinformationis required, ( Cx )+ 32= FkV/mmx V/milmm/ inchesN x lbN/mmx lb/inN/mm x 145= psiMPax 145= psiN m x lb inN mx lb ftN mm oz inmPa s= istheuser'sresponsibilitytodeterminesuit abilityfortheuser' ,HenkelCorporationanditsaffiliates( Henkel )specificallydisclaimsallwarrantiesexpre ssedorimplied,includingwarrantiesofmerch antabilityorfitnessfora particularpurpose, , ,usingthisdataasa Henkelin + + +
