Transcription of October-2011 - Bonding Source
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October-2011 - Bonding Source
TechnicalDataSheet CF3350 october - 2011 PRODUCTDESCRIPTIONCF3350provides thefollowingproductcharacteristics:Techn ologyEpoxyFilmAppearanceGrayTanCureHeatc ureProduct Benefits Highelectricalconductivity Highthermalconductivity Uniformbondlineadhesion Custompreformsavailable Adhesionwithflexibility Void-freebondline Clean,easyapplicationwithnowaste Even heatdissipation Provides electricalcontinuity Minimumthermalresistanceto heatsinkApplicationAssemblyFillerTypeSil verOperating Temperature-40 to160 CThickness2 or4 mils( )CarrierTypePolyesterTypicalAssemblyAppl icationsCircuitboardmaterials, Metalbackplanes andHeatsinksSubstratesFluoropolymercircu its,Ceramiccircuits,Copper, Brass, Kovar isformulatedforelectrical, @25 C, months3 ShelfLife@5 C(fromdateof manufacture), months9 PeakExothermTemperature,DSC,RampRate=10 C 5 CFlashPoint- SeeMSDSTYPICALCURINGPERFORMANCECureSched ule30 minutes@150 C AlternativeCureSchedule10 minutes@175 Cor50 minutes@137 Cor120 minutes@125 C CurePressure5 to60 psi Curepressuremayvarydependingonthemateria lsbeingbondedandtheirsize.
TDS CF3350, October-2011 DIRECTIONS FOR USE 1. While substrate cleaning is not mandatory, wiping with an organic solvent (e.g. isopropanol) is recommended to
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