PCB Rework and Repair Guide - Intertronics

1 This PCB Rework and Repair Guide has been downloaded from the Intertronics website. Please visit us for all your Rework and Repair needs! PC Board Reworkand RepairA Comprehensive GuideDocument No. CRC-20 Revision DECN No. 098 Dated January 5, 1998 Published by: CIRCUIT TECHNOLOGY CENTER, Research Drive, Haverhill MA 01832-1293 USAP hone: x Fax: : x Web Site: Ferry - President Copyright CIRCUIT TECHNOLOGY CENTER, INC. 1996 All rights document may not be copied or reproduced in any form, in whole or in part, without permission fromCIRCUIT TECHNOLOGY CENTER, TECHNOLOGY CENTER, INC. disclaims all liability associated with the use of this OF CONTENTST ypes - Printed Board TypesC - Conformance Level S - Skill Printed Boards and AssembliesHigh Highest Printed Boards and AssembliesMedium Medium Wiring Boards and AssembliesLowLowest Boards and Types C S BASIC Handling electronic AssembliesR, F, W, C High I CleaningR, F, W, C High I Coating Removal, Identification Of CoatingR, F, W, C High A Coating Removal, Solvent MethodR, F, W, C High A Coating Removal, Peeling MethodR, F, W, C High A Coating Removal.

2 Thermal MethodR, F, W, C High A Coating Removal, Grinding/Scraping MethodR, F, W, C High A Coating Removal, Micro Blasting MethodR, F, W, C High A Coating Replacement, Solder MaskR, F, W, C High I Coating Replacement, Conformal Coatings/EncapsulantsR, F, W, C High I Baking And PreheatingR, F, W, C High I Legend/Marking, Stamping MethodR, F, W, C High I Legend/Marking, Hand Lettering MethodR, F, W, C High I Legend/Marking, Stencil MethodR, F, W, C High I Epoxy Mixing and HandlingR, F, W, C High I BASE MATERIAL Delamination/Blister Repair , Injection MethodRHigh A Bow And Twist RepairR, WHigh A Hole Repair , Epoxy MethodR, WHigh A Hole Repair , Transplant MethodR, WHigh E Key And Slot Repair , Epoxy MethodR, WHigh A Key And Slot Repair , Transplant MethodR, WHigh E Base Material Repair , Epoxy MethodR, WHigh A Base Material Repair , Area Transplant MethodR, WHigh E Base Material Repair , Edge Transplant MethodR, WHigh E CONDUCTOR AND LAND Lifted Conductor Repair , Epoxy Seal MethodR.

3 FMediumI Lifted Conductor Repair , Film Adhesive MethodR, FHigh I Conductor Repair , Foil Jumper, Epoxy MethodR, F, C MediumA Conductor Repair , Foil Jumper, Film Adhesive MethodR, F, C High A Conductor Repair , Welding MethodR, F, C High A Conductor Repair , Surface Wire MethodR, F, C MediumI Conductor Repair , Through Board Wire MethodRMediumA Conductor Repair , Inner Layer MethodR, FHigh E Circuit Cut, Surface CircuitsR, FHigh A Circuit Cut, Inner Layer CircuitsR, FHigh A Deleting Inner Layer Connection At A Plated Hole, Drill ThroughR, FHigh A Deleting Inner Layer Connection At A Plated Hole, Spoke CutR, FHigh A D 1997 CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this TECHNOLOGY CENTER, INC.

4 , 45 Research Drive, Haverhill, MA 01832-1293 USAP hone: x Fax: x E-Mail: x Website: Page Land Repair , Epoxy MethodR, Land Repair , Film Adhesive MethodR, Repair , Epoxy MethodR, Repair , Film Adhesive MethodR, Contact Repair , Epoxy MethodR, F, W, Contact Repair , Film Adhesive MethodR, F, W, Contact Repair , Plating MethodR, F, W, Mount Pad Repair , Epoxy MethodR, F, Mount Pad Repair , Film Adhesive MethodR, F, HOLE Hole Repair , No Inner Layer ConnectionR, F, W, Hole Repair , Double Wall MethodR, F, W, Hole Repair , Inner Layer WIRE Wire BasicsR, F, W, Wires, Through Hole ComponentsR, F, W, Wires, Chip Components, Pads and ConductorsR, F, W, Wires, J Lead ComponentsR, F, W, Wires, Gull Wing ComponentsR, F, W, BasicsR, F, W.

5 For Soldering And Component RemovalR, F, W, Joint Acceptance CriteriaR, F, W, Through Hole Components, Point To Point MethodR, F, W, Through Hole Components, Solder Fountain MethodR, F, W, SM Chip Components, Point To Point MethodR, F, W, SM Chip Components, Hot Gas MethodR, F, W, SM J Lead Components, Point To Point MethodR, F, W, SM J Lead Components, Continuous Flow MethodR, F, W, SM J Lead Components, Hot Gas MethodR, F, W, SM Gull Wing Components, Point To Point MethodR, F, W, SM Gull Wing Components, Continuous Flow MethodR, F, W, SM Gull Wing Components, Hot Gas MethodR, F, W, REMOVAL Removal, Through Hole, Vacuum MethodR, F, W, Removal, Through Hole, Solder Fountain MethodR, F, W, Removal, SM Chip Components, Forked Tip MethodR, F, W, Removal, SM Chip Components, Hot Tweezer MethodR, F, W, Removal, SM J Lead Components, Conduction MethodR, F, W, Removal, SM J Lead Components, Hot Gas/Air MethodR, F, W, Removal, SM Gull Wing Components Conduction MethodR, F, W, Removal, SM Gull Wing Components Hot Gas/Air MethodR, F, W, CHighAC 1997 CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this TECHNOLOGY CENTER, INC.

6 , 45 Research Drive, Haverhill, MA 01832-1293 USAP hone: x Fax: x E-Mail: x Website: Page boards are more complex today than ever before, but despite how severely damaged theymay be, they can be repaired. Indeed the high value of many PC boards demands that theybe repaired. Even less expensive assemblies require Repair because just-in-timemanufacturing and tightly controlled production runs leave little room for a few years ago, PC boards were much simpler and repairs were relatively easy. Today'sPC boards have fine pitch components, ball grid arrays and fine line circuits making them achallenge to Repair . Yet, we're driven by simple economics and must Repair damaged PCboards whenever possible.

7 This manual is designed to help you Repair and ship good, reliablePC boards that might otherwise be consigned to of its high demands, PC board Repair has been accurately compared to repairing surface mount pads or repairing damaged internal circuitry, the technicalknowledge and manual skills needed for high reliability Repair and Rework are indeeddemanding. Since today's Repair procedures are more sophisticated than ever before, youneed a comprehensive Repair specialists at Circuit Technology Center, Inc. have used this guidebook to repairthousands of PC boards. Circuit Technology Center, Inc. is the world's leading specialist in PCboard Repair and modification and the procedures described herein are the same proceduresthey use to Repair and modify PC boards.

8 They have been repairing PC boards for over 15years for companies including Digital Equipment Corporation, IBM, Hewlett Packard, Siemens,Compaq Computer, AT&T, Allied Signal Aerospace and hundreds of other commercial andmilitary manufacturers. Damaged PC boards may be compared to patients in a hospital. Some will need a stitch ortwo while others will need open heart surgery. To expect a reliable outcome, each repairproject must follow proven and well established procedures. This guidebook covers the repairand Rework of both surface mount and through hole PC boards and assemblies . Not only willthis guidebook give you the details for most PC board Repair procedures, but it will also explainwhy certain procedures are important and answer many questions that you're bound to guidebook includes procedures for modifying, reworking and repairing printed boards andprinted board assemblies .

9 It complies with standards set by the Institute for Interconnectingand Packaging electronic Circuits (IPC), in Northbrook IL. The main IPC documents to refer towhen using this guidebook include:J-STD-001 Requirements for Soldered Electrical and electronic AssembliesIPC-A-600 Acceptability of Printed BoardsIPC-A-610 Acceptability of electronic AssembliesIPC-R-700 modification , Rework and Repair of Printed Boards and assemblies . Revision levels for each procedure are recorded in the header section. A complete log ofengineering changes is maintained at Circuit Technology Center, 1997 CIRCUIT TECHNOLOGY CENTER, INC disclaims all liability associated with the use of this TECHNOLOGY CENTER, INC.

10 , 45 Research Drive, Haverhill, MA 01832-1293 USAP hone: x Fax: x E-Mail: x Website: Page of ProductThree Classes of Products are referred to in this 1 General electronic ProductsIncludes consumer products, some computer products and computer peripherals, andhardware suitable for applications where the major requirement is the function of thecompleted 2 Dedicated Service electronic ProductsIncludes communications equipment, sophisticated business machines, and instrumentswhere high performance and extended life is required, and for which uninterrupted serviceis desired but not critical. Typically, the end use environment would not cause 3 High Performance electronic ProductsIncludes equipment for commercial and military products where continued performance orperformance-on-demand is critical.