Requirements for Power Conversion Devices for the ... - IPC

1 IPC-9592 BRequirements for PowerConversion Devicesfor the computer andTelecommunicationsIndustriesDeveloped by the Power Conversion Devices Standard Subcommittee(9-82) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1249 Tel 847 847 :IPC-9592A - May 2010 IPC-9592 - September 2008 Table of Contents1 Statement of Scope .. Description .. Purpose .. Order of Precedence When Purchasing .. 12 APPLICABLE DOCUMENTS AND TERMS IPC .. International .. Standards Association (Canada) .. Organization for Standardization.

2 China .. Electrotechnical Commission .. Oficial Mexicana .. Norm .. States .. , Definitions and Acronyms .. 43 PRODUCT SPECIFICATION ANDDOCUMENTATION Classification System .. I General or Standard PCDs .. II Enhanced or Dedicated Service PCDs .. to dc and dc to dc PCDs .. Categories of Product .. Requirements .. Data Sheet Information - Form,Fit and Function .. Power Specifications .. to dc PCD Data Sheet .. to dc PCD Data Sheet .. , Indicator, and Control Specifications .. Specifications .. to dc PCD Data Sheet .. to dc PCD Data Sheet .. to dc and dc to dc PCD Data Sheet .. to dc and dc to dc PCD Data Sheet.

3 And Regulatory .. to dc and dc to dc PCD Data Sheet .. Dimensions and ElectricalConnections .. to dc and dc to dc PCD Data Sheet .. Control and Labeling .. Control .. 144 DESIGN FOR Prediction (FIT) .. Selection .. Metal Corrosion with PCD ElectronicAssembly .. Testing .. Printed Circuit BoardSurface Finishes .. Finishes for the ComputerIndustry .. Finishes for TelecommunicationIndustry .. Finishes for Assembly Parts,ECM as a Failure Mechanism andConformal Coatings .. (Thick Film) .. Migration Failures .. Coatings .. Guidelines .. Documentation Requirements .. Design Failure Modes and Effects Analysis(DFMEA).

4 Spacing Design Requirements .. Moisture Sensitivity Level (MSL)Rating of Surface Mount PowerConversion Devices (PCDs) .. of MSL Guidelines DuringAssembly of PCDs .. of MSL Requirements .. of MSL Rating .. Requirements .. Requirements for BMP Users .. Testing for MSL .. 215 DESIGN AND QUALIFICATION Verification Testing (DVT) .. of Testing .. Size .. Methods .. Conditions and Limits .. Report .. 22 November Verification Testing -ac Input Parameters .. Conditions .. to Be Measured .. Verification Testing - dcInput Parameters .. Conditions .. to Be Measured .. Verification Testing - OverallInput to Output Parameters.

5 Conditions .. to Be Measured .. Verification Testing - dcOutput Parameters .. Conditions .. to Be Measured .. Design Verification Testing -Protection Features .. Test Conditions .. Parameters to Be Measured .. Design Verification Testing - Input andOutput Signals and Indicators .. Test Conditions .. Parameters to Be Measured .. Design Verification Testing - Other ElectricalParameters, Features and Functions .. Current Sharing .. Test Conditions .. Test Procedure .. Design Verification Testing - Hot Swap .. Test Conditions .. Test Procedure .. Design Verification Testing - MechanicalCompliance.

6 Stress Testing (EST) .. Purpose .. Sequence for EST .. Preconditioning .. Accelerated Life Test (HALT) .. and Purpose .. Chamber Equipment Requirements .. Thermal and VibrationCapability .. Minimum ReportingRequirements .. and Thermal MonitoringCapability .. Requirements forAccelerometers .. Requirements forThermocouples .. Reporting Requirements forVibration and Thermal Monitoring .. Test Equipment .. and Loading .. Capability .. Hardware .. Reporting Requirements forLaboratory Equipment .. Size .. Test Requirements .. Verification .. Step Stress/CombinedEnvironment/Rapid Thermal Cycle.

7 Step Stress .. Reporting and DocumentationRequirements .. Cause Analysis andCorrective Actions .. , Humidity and Bias (THB) .. Size .. Procedure .. Criteria .. Temperature Operating Bias (HTOB) .. Size .. Criteria .. Cycling Test .. Size .. Criteria .. and Temperature Cycling (PTC) Test .. Size .. Criteria .. and Vibration .. 33 IPC-9592 BNovember .. Overview .. Sequence .. Criteria .. Equipment .. Mounting .. Vibration - Operating .. Size .. Method .. Criteria .. Random Vibration - Non-Operating .. Purpose .. Applicability .. Sample Size .. Test Method.

8 Pass Criteria .. Shock - Operating .. Purpose .. Applicability .. Sample Size .. Test Method .. Pass Criteria .. Free Fall .. Purpose .. Applicability .. Sample Size .. Test Method .. Pass Criteria .. Drop Test .. Purpose .. Applicability .. Sample Size .. Test Method .. Pass Criteria .. Other Environmental Stress Testing .. Corrosion Resistance .. Dust Resistance .. SMT Attachment Reliability .. Purpose .. Size .. Method .. Criteria .. Hole Pin Solderability .. Purpose .. Applicability .. Sample Size .. Test Method.

9 Pass Criteria .. Electromagnetic Susceptability (EMS) andOther Tests .. Continuous Wave .. Devices .. Size .. Method .. Criteria .. Immunity .. Devices .. Size .. Method .. Criteria .. Electrical Fast Transient (EFT) .. Devices .. Size .. Method .. Criteria .. Surges .. Devices .. Size .. Method .. Criteria .. Waves .. Devices .. Size .. Method .. Criteria .. Discharge - PackagedPower Devices .. Devices .. Size .. Method .. Criteria .. Discharge - Board MountedPower Devices .. 42 November .. Size .. Method .. Criteria .. Line Disturbance Immunity - ac Input.

10 Size .. for All Tests .. Term Input Undervoltageand Overvoltage .. Undervoltage - Performance Level B .. to Slow Reduction ofInput Voltage .. Emissions .. with ac Input .. Emissions .. Input Current .. Emissions .. Power Devices with dc Input .. Emissions .. Emissions .. Mounted Power Deviceswith dc Input .. Emissions .. Emissions .. Acoustic Noise .. Size .. Method .. Safety .. : Green .. 446 QUALITY Management Systems .. Failure Modes and Effects Analysis .. Process Control .. Capability Assessment .. Capability Assessment .. Action Process .. Improvement.