Transcription of 射頻、微波及毫米波積體電路 (RFIC and MMIC)
1 (RFIC and MMIC). m/90 nm 65 nm/40 nm RF. CMOS RFIC . RFIC (WLAN). IEEE 5-GHz IEEE . 60-GHz . WLAN (Transceiver) (PA) . (T/R switch) IEEE WLAN 24/77-GHz . WLAN GSM/WCDMA/LTE .. 1. (Multi-standard) (Multi-band) . ( ) .. 3W . 1W .. 2. (Multi-channel) . (Wireless Spectrum) . (Gigabit) (Multi-Input Multi-Output, MIMO) (Cognitive Radio). (Frequency-Channel) . (Multi-channel) 5 GHz (Bandwidth) . ( ) (Frequency-band) . (Frequency-Channel) . Gbps (Gigabits per second) (Multi-channel) Gbps .. (Multi-channel) Gbps .. 3.. WLAN . (power backoff) (PAE) .. 4.. CMOS/SiGe BiCMOS WLAN (transceiver) . T/R . 5.. CMOS 40 nm 1 V . cascode LNA (double-balanced mixer) . VCO (Transformer) .. 6.. Q.. Q . 30~100 GHz .. 7.. CMOS (Gate) . (Gate Bias) . RFIC/MMIC .. 8.. ( . LC ) . (conjugate matching) . RC .. ( ) ( ) ( ) .. MOS (gm) . MOS fT . (Bandpass ladder filter) (source follower).
2 9.. 57~64 GHz . 7 GHz 7 Gbps . 60-GHz IEEE 3D .. CMOS (System-in-Package, SiP) . 24-GHz 77-GHz .. 10. CMOS/SiGe/SOI . GaAs HBT . CMOS . SiGe/SOI GaAs HBT . SiGe/SOI CMOS . RFIC CMOS PA .. 11. (GaN) . (GaN) (Power density) . GaN . RFIC/MMIC .. 12. (3D IC).. (3D interconnects) .. (interconnects) .. 13. IPD CMOS / LTCC Flip-Chip CMOS. CMOS Q Integrated Passive Device (IPD) CMOS. Q . SiP LTCC . Q (Flip-chip) CMOS SiP . 14. (Digitally Assisted Radio Processing).. Gigabit.
