Shielded power inductors - Cooper Industries

1 Technical Data 4139 Effective April 2016 Supersedes March 2007DR1050 Shielded power inductorsDescription Shielded drum core Inductance range from H to 1000 H Current range from A to A mm x mm footprint surface mount package in a mm height Ferrite core material Halogen free, lead free, RoHS compliantApplications LED/LCD backlighting High definition televisions (HDTV) Server and desktop power supplies Graphics cards and battery powered systems Point-of-load (POL) modules Printers and peripherals Portable electronicsEnvironmental Data Storage temperature range (Component): -40 C to +125 C Operating temperature range: -40 C to +125 C (ambient plus self-temperature rise) Solder reflow temperature: J-STD-020D compliantPbHALOGENHFFREE2 Technical Data 4139 Effective April 2016DR1050 Shielded power inductors Specifications Part Number5 OCL1( H) 30%Irms2 (A)Isat3 (A)DCR (m )typical@ 20 CDCR (m )maximum@ 20 Open Circuit Inductance (OCL) Test Parameters: 100 kHz, Vrms, Adc, +25 C2.

2 Irms: DC current for an approximate temperature rise of 40 C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125 C under worst case operating conditions verified in the end Isat: Peak current for approximately 35% rolloff @ +25 C4. K-factor: K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * I. Bp-p: (mT), K: (K-factor from table), L: (Inductance in H), I (Peak to peak ripple current in Amps).5. Part Number Definition: DR1050-xxx-RDR1050 = Product code and size -xxx= inductance value in H, R= decimal point, If no R is present then last character equals number of zeros-R suffix = RoHS compliant3 Technical Data 4139 Effective April 2016DR1050 Shielded power inductors (mm)Part marking: inductance value in uH.

3 R = decimal point. If no R is present then last character equals number of zeroes. wwlly = date code, R = revision level Do not route traces or vias underneath the inductorPackaging information (mm)Supplied in tape and reel packaging , 500 parts per 13 diameter reel4 Technical Data 4139 Effective April 2016DR1050 Shielded power inductors rise vs. total Rise ( C)Total Loss (W) (mT)Core Loss (W)Core loss vs. Bp-p5 Technical Data 4139 Effective April 2016DR1050 Shielded power inductors characteristics0%20%40%60%80%100%120%0%2 0%40%60%80%100%120%140%% of OCL% of Isat% of OCL vs. % of Isat-40 C+25 C+85 CEatonElectronics Division1000 Eaton BoulevardCleveland, OH 44122 United 2016 EatonAll Rights ReservedPrinted in USAP ublication No. 4139 April 2016 Eaton is a registered other trademarks are property of their respective power inductors Technical Data 4139 Effective April 2016 Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an of cer of the Company.

4 Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in signi cant injury to the reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this tsTC -5 CTime 25 C to Peak Time25 CTsminTsmaxTLTPP reheatAMax. Ramp Up Rate = 3 C/sMax. Ramp Down Rate = 6 C/sSolder reflow profileReference JDEC J-STD-020D Profile FeatureStandard SnPb SolderLead (Pb) Free SolderPreheat and Soak Temperature min. (Tsmin)100 C150 C Temperature max. (Tsmax)150 C200 C Time (Tsmin to Tsmax) (ts)60-120 Seconds60-120 SecondsAverage ramp up rate Tsmax to Tp3 C/ Second C/ Second temperature (Tl) Time at liquidous (tL)183 C 60-150 Seconds217 C 60-150 SecondsPeak package body temperature (TP)*Table 1 Table 2 Time (tp)** within 5 C of the specified classification temperature (Tc)20 Seconds**30 Seconds**Average ramp-down rate (Tp to Tsmax)6 C/ Second C/ Second 25 C to Peak Temperature6 Minutes Minutes Max.

5 * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user 1 - Standard SnPb Solder (Tc)Package ThicknessVolume mm3 <350 Volume mm3 350< )235 C220 C C220 CTable 2 - Lead (Pb) Free Solder (Tc)Package ThicknessVolume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000< C260 C260 C250 C245 C> C245 C245 C