Specification for Base Materials for High Speed/ High ...

1 ASSOCIATION CONNECTING. ELECTRONICS INDUSTRIES . IPC-4103. Specification for base Materials for high speed /. high frequency applications IPC-4103. January 2002 A specification developed by IPC. Supersedes IPC-L-125A 2215 Sanders Road, Northbrook, IL 60062-6135. July 1992 Tel. Fax The Principles of In May 1995 the IPC's Technical Activities Executive Committee adopted Principles of Standardization Standardization as a guiding principle of IPC's standardization efforts. Standards Should: Standards Should Not: Show relationship to Design for Manufacturability Inhibit innovation (DFM) and Design for the Environment (DFE) Increase time-to-market Minimize time to market Keep people out Contain simple (simplified) language Increase cycle time Just include spec information Tell you how to make something Focus on end product performance Contain anything that cannot Include a feedback system on use and be defended with data problems for future improvement Notice IPC Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need.

2 Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of IPC from manufacturing or sell- ing products not conforming to such Standards and Publication, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than IPC members, whether the standard is to be used either domestically or internationally. Recommended Standards and Publications are adopted by IPC without regard to whether their adoption may involve patents on articles, Materials , or processes. By such action, IPC does not assume any liability to any patent owner, nor do they assume any obligation whatever to parties adopting the Recommended Standard or Publication. Users are also wholly responsible for protecting themselves against all claims of liabilities for patent infringement.

3 IPC Position It is the position of IPC's Technical Activities Executive Committee (TAEC) that the use and Statement on implementation of IPC publications is voluntary and is part of a relationship entered into by Specification customer and supplier. When an IPC standard/guideline is updated and a new revision is pub- Revision Change lished, it is the opinion of the TAEC that the use of the new revision as part of an existing relationship is not automatic unless required by the contract. The TAEC recommends the use of the lastest revision. Adopted October 6. 1998. Why is there Your purchase of this document contributes to the ongoing development of new and updated a charge for industry standards. Standards allow manufacturers, customers, and suppliers to understand one this standard? another better.

4 Standards allow manufacturers greater efficiencies when they can set up their processes to meet industry standards, allowing them to offer their customers lower costs. IPC spends hundreds of thousands of dollars annually to support IPC's volunteers in the standards development process. There are many rounds of drafts sent out for review and the committees spend hundreds of hours in review and development. IPC's staff attends and participates in committee activities, typesets and circulates document drafts, and follows all necessary procedures to qualify for ANSI approval. IPC's membership dues have been kept low in order to allow as many companies as possible to participate. Therefore, the standards revenue is necessary to complement dues revenue. The price schedule offers a 50% discount to IPC members.

5 If your company buys IPC standards, why not take advantage of this and the many other benefits of IPC membership as well? For more information on membership in IPC, please visit or call 847/790-5372. Thank you for your continued support. Copyright 2002. IPC, Northbrook, Illinois. All rights reserved under both international and Pan-American copyright conventions. Any copying, scanning or other reproduction of these Materials without the prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United States. IPC-4103. ASSOCIATION CONNECTING. ELECTRONICS INDUSTRIES . Specification for base Materials for high speed /. high frequency applications Developed by the high Speed/ high frequency base Materials Subcommittee (D-23) of the high Speed/ high frequency Committee (D-20) of IPC.

6 Supersedes: Users of this specification are encouraged to participate in the IPC-L-125A - July 1992 development of future revisions. IPC-L-125. Contact: IPC. 2215 Sanders Road Northbrook, Illinois 60062-6135. Tel 847 Fax 847 IPC-4103 January 2002. Acknowledgment Any Specification involving a complex technology draws material from a vast number of sources. While the principal mem- bers of the high Speed/ high frequency base Materials Subcommittee (D-23) of the high Speed/ high frequency Commit- tee (D-20) are shown below, it is not possible to include all of those who assisted in the evolution of this specification. To each of them, the members of the IPC extend their gratitude. high Speed/ high high Speed/ high frequency Technical Liaison of the frequency Committee base Materials Subcommittee IPC Board of Directors Chair Chair Thomas Bresnan Robert J.

7 Konsowitz Dr. William Beckenbaugh Sanmina Corporation GIL Technologies Sanmina high speed / high frequency base Materials Subcommittee Masamitsu Aoki, Toshiba Chemical Otto Ken Goins, Jr., Albemarle Christopher G. Olson, Rockwell Corp. Corporation Collins Richard A. Barnett, Compaq Malcolm Green, California Export Deepak K. Pai, , General Computer Corporation Finance Office Dynamics Information Sys. Inc. Amit Bhardwaj, Polar Instruments, Margie Hillsman, Harmon Industries, Thierry Philibert, Hexcel Fabrics Ltd. Inc. Roberta Ross, Taconic, Advanced Ronald J. Brock, NSWC - Crane Roy M. Keen, Rockwell Collins Dielectric Division Mike Bryant, BGF Industries Inc. Thomas E. Kemp, Rockwell Collins Visa Ruuhonen, Nokia Networks Gerard Cave, Pacific Testing Joseph D. Leibowitz, Shirline Kenneth C. Selk, TRW Electronics &.

8 Laboratories, Inc. Composites Inc. Technology Division Christine R. Coapman, Delphi Delco Gregory L. Lucas, Circuit Solutions Steve M. Sekanina, Neltec, Inc. Electronics Systems Corporation Lowell Sherman, Defense Supply David J. Corbett, Defense Supply P. Douglas Lyle, Advanced Glassfiber Center Columbus Center Columbus Yarns LLC G. Robert Traut, Rogers Corporation Ronald Desilets, Raytheon Systems Rene R. Martinez, TRW Electronics Richard Trine, Taconic Company & Technology Division Antti Vaisanen, Nokia Networks Patricia S. Dupuis, Raytheon Joel L. Murray, Hexcel Schwebel Kevin Walker, Rogers Corporation Company Michael B. Norris, Rogers Daniel Welch, Arlon MED. Thomas R. Fisher, E. I. du Pont de Corporation Nemours and Co. Philip R. Wellington, L-3. Thomas J. Nowak, Nowak &. Communications Mahendra S.

9 Gandhi, Space Systems/ Associates Loral Jih Yuan, , Lucent Technologies Jan Obrzut, , NIST. ii January 2002 IPC-4103. Table of Contents 1 GENERAL .. 1 Qualification Testing 6. Scope .. 1 Qualification Testing Bonding Layer .. 6. 1 Verification of Manufacturer's Quality System .. 6. Specification Sheet 1. Conflict .. 6. Dielectric 1. Materials .. 6. Dielectric Permittivity 1. Metal 6. Nominal Laminate Thickness .. 1. Reinforcement 6. Thickness Tolerance, Laminate .. 1. Resin 6. Surface Quality Class .. 1. 6. Metal Cladding Type, Nominal Weight .. 1. General Requirements/Acceptability .. 6. Reinforcement 2. Fabricated Sheets and Panels .. 7. Resin 2. Inspection Lot .. 7. Bonding Layer Parameters .. 2. Visual Properties .. 7. 2. 9. Dimensions and Tolerances .. 3. Physical Requirements .. 11. Interpretation.

10 3. Physical Requirements Laminate Materials .. 11. 2 APPLICABLE DOCUMENTS .. 3. Physical Requirements, Bonding IPC .. 3 Layer Materials .. 14. Joint Industry Standards .. 4 Chemical Requirements .. 15. National Conference of Standards Chemical Requirements, Laminate .. 15. Laboratories .. 4 Chemical Requirements, Bonding Layer .. 15. Federal Specifications4 .. 4 Flammability .. 15. ASQ .. 4 Electrical Requirements .. 15. ASTM .. 5 Electrical Requirements, Laminate .. 15. International Standards .. 5 Electrical Requirements, Bonding Layer .. 16. 3 REQUIREMENTS .. 5 Environmental Requirements .. 16. Terms and 5 Environmental Requirements, Laminate .. 16. Qualification Assessment .. 5 Environmental Requirements, Bonding Layer .. 16. Quality Conformance 5. Visual and Dimensional Requirements, Manufacturers Quality System.