Transcription of STBGA - Signetics
1 Signetics (HQ) 483-3 Buphung-ri Thanhyun- myun , Paju-si Gyungki-do, Republic of Korea 413-840 Tel : (Korean) 82-31-940-7681, (English) 82-31-940-7660 Fax : 82-31-940-7888 Signetics High Technology, Inc. (USA) 200 Brown Road Suite 300, Fremont, CA 94539-7953 Tel : 408-907-0121 Cell : 925-980-6515 Fax : 408-907-0109 STBGA Features Superior electrical performance Enhanced thermal performance Fine bond finger pitch (100um for shorter wires) Polyimide tape substrate 1 and 2 metal layer tape options and mm ball pitch Reliability Overview Signetics Tape Ball Grid Array Cavity-down package Copper heat spreader Low dielectric constant Grounded 2-piece heat spreader Up to 2 layers of power/ground planes Die attached directly to the heat slug MSL Level JEDEC Level 3 Temp Cycling 150C/-65C, 1000 cycles Unbiased HAST 130 C/85% RH, 2 atm, 96hrs High Temp Storage 150 C, 1000hrs Package Sizes 17x17mm 40x40 mm I/O Counts 243 792 Signetics 600 STBGA 40x40MM Resistance (m ) 250~680 Inductance (nH) ~ Capacitance (pF)
2 ~ BODY SIZE Ball Count Theta JA ( c/w) 21X21mm 300B 18 35X35mm 560B Thermal Data Electrical Data *Results dependent on body size, die size, and Substrate design 35X35mm Body, 480B, Simulation Frequency : 100 Mhz *JEDEC STD 2S2P PCB, Still air
