Supersedes IPC/JEDEC J-STD-033B October 2005 JOINT ...

1 JOINTINDUSTRYSTANDARDH andling, Packing,Shipping and Use ofMoisture/ReflowSensitive SurfaceMount DevicesIPC/JEDEC Amendment 1 January 2007 Supersedes IPC/JEDEC J-STD-033 BOctober 2005 NoticeJEDEC and IPC Standards and Publications are designed to serve the publicinterest through eliminating misunderstandings between manufacturers andpurchasers, facilitating interchangeability and improvement of products,and assisting the purchaser in selecting and obtaining with minimum delaythe proper product for his particular need. Existence of such Standards andPublications shall not in any respect preclude any member or nonmemberof JEDEC or IPC from manufacturing or selling products not conformingto such Standards and Publications, nor shall the existence of such Standardsand Publications preclude their voluntary use by those other than JEDECand IPC members, whether the standard is to be used either domesticallyor Standards and Publications are adopted by JEDEC andIPC without regard to whether their adoption may involve patents on articles,materials, or processes.

2 By such action, JEDEC and IPC do not assume anyliability to any patent owner, nor do they assume any obligation whateverto parties adopting the Recommended Standard or Publication. Users are alsowholly responsible for protecting themselves against all claims of liabilitiesfor patent material in this JOINT standard was developed by the JEDEC on Reliability Test Methods for Packaged Devices and the IPCP lastic Chip Carrier Cracking Task Group (B-10a)For Technical Information Contact:JEDEC Solid StateTechnology Association2500 Wilson BoulevardArlington, VA 22201 Phone (703) 907-7500 Fax (703) 907-7583 IPC3000 Lakeside DriveSuite 309 SBannockburn, Illinois60015-1249 Tel (847) 615-7100 Fax (847) 615-7105 Please use the Standard Improvement Form shown at the end of thisdocument.

3 Copyright 2007. JEDEC Solid State Technology Association, Arlington, Virginia, and IPC, Bannockburn, Illinois. All rights reserved underboth international and Pan-American copyright copying, scanning or other reproduction of these materials without the priorwritten consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United Amendment 1 Handling, Packing,Shipping and Use ofMoisture/ReflowSensitive SurfaceMount DevicesA JOINT standard developed by the JEDEC Committee onReliability Test Methods for Packaged Devices and the B-10a PlasticChip Carrier Cracking Task Group of IPCU sers of this standard are encouraged to participate in thedevelopment of future :JEDEC2500 Wilson BoulevardArlington, VA 22201 Phone (703) 907-7500 Fax (703) 907-7583 IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1249 Tel (847) 615-7100 Fax (847) 615-7105 Supersedes .

4 IPC/JEDEC J-STD-033B - October 2005 IPC/JEDEC J-STD-033A -July 2002 IPC/JEDEC J-STD-033 -April 1999 JEDEC JEP124 IPC-SM-786A - January 1995 IPC-SM-786 - December 1990 ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES This Page Intentionally Left BlankAcknowledgmentMembers of the JOINT IPC/JEDEC Moisture Classification Task Group have worked to develop this document. We wouldlike to thank them for their dedication to this effort. Any Standard involving a complex technology draws material from avast number of sources. While the principal members of the JOINT Moisture Classification Working Group are shown below,it is not possible to include all of those who assisted in the evolution of this Standard.

5 To each of them, the members of theJEDEC and IPC extend their Plastic Chip CarrierCracking Task Group, B-10aChairmanSteven MartellSonoscan, JC McCullenIntel CorporationJEDEC JC 14 ChairmanNick LycoudesFreescale SemiconductorJoint Working Group MembersJasbir Bath, Solectron CorporationJames Mark Bird, Amkor W. Blazier, Delphi DelcoElectronicMaurice Brodeur, Analog Brooks, Amkor TechnologyRalph Carbone, Hewlett Packard Charest, Allegro C. Colish, Northrop GrummanCorporationAndrew Corriveau, CogiscanJ. Gordon Davy, Northrop GrummanCorporationWerner Engelmaier, EngelmaierAssociates G.

6 Feinstein, Leo FeinsteinAssociateBarry R. Fernelius, AgilentTechnologiesJohn Fink, Honeywell SSECC urtis Grosskopf, IBM CorporationJoel Heebink, HoneywellTerence Kern, Ambitech InternationalNick Lycoudes, FreescaleSemiconductorSteven R. Martell, Sonoscan McCullen, Intel CorporationSean McDermott, CelesticaJames H. Moffitt, Moffitt ConsultingServQuang Nguyen, Xilinx NicolJohn Northrup, BAE SystemsControlsLarry Nye, Texas Instruments Oren, AcousTech K. Pai, , GeneralDynamics-Advanced InformationSystemsRichard Shook, Agere Systems Sorenson, Micron S.

7 Tamanaha, Seika W. Taylor, Lockheed MartinCorporationJerome Tofel, Northrop GrummanCorporationJanuary 2007 IPC/JEDEC - Includes Amendment 1iiiThis Page Intentionally Left BlankIPC/JEDEC - Includes Amendment 1 January 2007ivTable of .. Packages .. Processes .. Mass Reflow .. Localized Heating .. Socketed Components .. Point-to-Point Soldering .. and Definitions .. Active Desiccant .. Bar Code Label .. Bulk Reflow .. Carrier .. Desiccant .. Floor Life .. Humidity Indicator Card (HIC) .. Manufacturer s Exposure Time (MET).

8 Moisture Barrier Bag (MBB) .. Rework .. Shelf Life .. SMD .. Solder Reflow .. Water Vapor Transmission Rate (WVTR) .. 22 APPLICABLE Society for Testing and Materials(ASTM) .. Industries Alliance (EIA, JEDEC) .. Standards .. Industry Standards .. of Defense .. 33 DRY .. of SMD Packages and CarrierMaterials Before Being Sealed in MBBs .. Requirements - Levels 2a - 5a .. Requirements - Carrier Materials .. Requirements - Other .. Time Between Bake and Bag .. Pack .. Labels .. Moisture Barrier Bag Sealing.

9 Shelf Life .. Exposure to Factory Ambient .. Any Duration Exposure .. Short Duration Exposure .. Considerations for Baking .. High Temperature Carriers .. Low Temperature Carriers .. Paper and Plastic Container Items .. Bakeout Times .. ESD Protection .. Reuse of Carriers .. Solderability Limitations .. Bag Inspection .. Upon Receipt .. Component Inspection .. Life .. Storage .. Dry Pack .. Life .. Atmosphere Cabinet .. MBB .. Temperature Extremes .. Thermal Profile Parameters.

10 Reflow Passes .. Reflow Passes .. Indicators .. Humidity in the Dry Pack .. Floor Life or Ambient Temperature/Humidity Exceeded .. 6 SMD Packages .. 126 BOARD Removal, Rework and Remount .. for Failure Analysis .. and Remount .. of Populated Boards .. 127 DERATING DUE TO FACTORYENVIRONMENTAL 12 January 2007 IPC/JEDEC - Includes Amendment 1vAppendix ATest Method for Humidity IndicatorCard used with ElectronicComponent 14 Appendix BDerivation of Bake 15 Appendix CAmendment1-Differences and 15 FiguresFigure 3-1 Typical Dry Pack Configuration for Moisture-Sensitive SMD Packages in Shipping Tubes.