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Convection Reflow

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JEDEC STANDARD - Portland State University

JEDEC STANDARD - Portland State University

web.cecs.pdx.edu

2.2 Solder reflow equipment a) (Preferred) - Full Convection reflow system capable of maintaining the reflow profiles required by this standard. b) Infrared (IR)/Convection solder reflow equipment capable of maintaining the reflow profiles required by this standard. It is required that this equipment use IR to heat only the air and not

  Flowers, Convection, Convection reflow

MAX3222E/MAX3232E/MAX3237E/MAX3241E ... - Maxim …

MAX3222E/MAX3232E/MAX3237E/MAX3241E ... - Maxim …

datasheets.maximintegrated.com

mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Preheating is required. Hand or wave soldering is not allowed. PARAMETER CONDITIONS MIN TYP MAX UNITS DC CHARACTERISTICS (VCC = +3.3V or +5V, TA = +25°C) Supply Current SHDN = VCC, no load MAX3222E, MAX3232E, MAX3241E, …

  Flowers, Convection, Convection reflow

Supersedes IPC/JEDEC J-STD-033B October 2005 JOINT ...

Supersedes IPC/JEDEC J-STD-033B October 2005 JOINT ...

www.surfacemountprocess.com

1.3.1 Mass Reflow This standard applies to bulk solder reflow assembly by convection, convection/IR, infrared (IR), and vapor phase (VPR) processes. It does not apply to bulk solder reflow processes that immerse the component bodies in mol-ten solder (e.g., wave soldering bottom mounted components).

  Flowers, Convection

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